Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
09/2003
09/04/2003US20030165771 Blends of curable epoxy resins, polyepoxides, novolacs and photoinintiators, used to from films having high glass transition temperature and good flexibility used in printed circuits
09/04/2003US20030165695 Electronic design; using computers
09/04/2003US20030165687 Cationic paint composition
09/04/2003US20030164555 B-stageable underfill encapsulant and method for its application
09/03/2003EP1340775A1 High functionality vinyl ester resins compatible with vinyl esters of alpha, alpha branched alkane carboxilic acids
09/03/2003EP1339524A1 Fluxing underfill compositions
09/03/2003EP1339492A2 Esterification catalyst, polyester process and polyester article
09/03/2003EP1006119B1 Novel crystalline ion-association substance, process for producing the same, and latent photopolymerization initiator
09/03/2003CN1120204C Flame retardant resin composition and laminate using the same
09/03/2003CN1120191C Polycarbided diimine polymer and its use as interlayer of adhesive layer in automobile paint
09/02/2003US6613849 Curable multifunctional glycidyl ethers and acrylated derivatives thereof, for example the diglycidyl ether of 1,2-bis(4-hydroxyphenyl)-2-hydroxypropane; thermosetting resins; higher reactivity during curing
09/02/2003US6613848 Phosphorus-containing phenolic, thiophenolic or aminophenyl flame-retardant hardener, and epoxy resins cured thereby
09/02/2003US6613839 Polyepoxide, catalyst/cure inhibitor complex and anhydride
09/02/2003US6613449 Chip on films; flexible printed circuit
09/02/2003US6613438 Single component adhesive with an adaptable open joint time
09/02/2003US6613436 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers
09/02/2003US6612343 Protective plastic coating for interior of oil pipes
08/2003
08/28/2003WO2003070850A1 Two-pack type adhesive
08/28/2003WO2003070800A1 Curable resin and curable resin composition containing the same
08/28/2003WO2003043973A3 Amine phenolic compounds and their use as hardeners and/or accelerators in epoxy coatings
08/28/2003US20030162935 Halogen-free
08/28/2003US20030162911 No flow underfill composition
08/28/2003US20030162898 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards
08/28/2003US20030162872 Chromate-free low-friction coating composition
08/28/2003US20030162125 Organic anti-reflective coating compositions for advanced microlithography
08/28/2003US20030162049 Laminate and process for producing a laminate of this type
08/27/2003EP1338624A1 Liquid thermosetting resin composition, printed wiring boards and process for their production
08/27/2003EP1337585A1 Silicone-modified single-component sealing compound
08/27/2003EP0830641B1 Photohardenable epoxy composition
08/27/2003CN1439038A Epoxyresin composition and cured object obtained therefrom
08/27/2003CN1439027A Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom
08/27/2003CN1439015A Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins make by using the derivatives, flame-retardant resin compositions, sealing media and
08/27/2003CN1119366C Outdoor durable coating compositions and acid functional plyester resins and polyglycidyl esters thereof usable therefor
08/27/2003CN1119245C Inkjet print head containing radiation curable resin layer
08/27/2003CN1119221C Rotary trowel for use in the molding of ceramics and method for production thereof
08/26/2003US6610817 Coating composition containing alcoholic reactive diluents
08/26/2003US6610406 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
08/26/2003US6610281 Polyether modified with sulfone compound; immobilizing biomass
08/26/2003CA2086719C Heimd-containing polyetheramine curative for flexible, toughened products
08/21/2003WO2003068877A1 Solution type coatings
08/21/2003WO2003068841A1 Resin composition
08/21/2003WO2003068840A1 Latent hardener, process for producing the same, and adhesive containing latent hardener
08/21/2003WO2003068837A1 Indole resins, epoxy resins and resin compositions containing the same
08/21/2003US20030158337 Thermosetting resin composition for high performance laminates
08/21/2003US20030158286 Active energy beam-curable composition
08/21/2003US20030155664 Liquid epoxy resin composition and semiconductor device
08/20/2003EP1336632A1 Curable, dimensionally stable Two-Component-Reactive resin-System based on Epoxyresins
08/20/2003CN1437644A Adhesive for resin roll assembly and resin roll
08/20/2003CN1437632A Reactive particles, curable composition comprising the same and cured products
08/20/2003CN1437625A Epoxy resin and process for making the same
08/20/2003CN1436779A Cyclic disulfide, producing process thereof and optical products containing the same
08/20/2003CN1118502C Epoxy functional polyester resins, its producing process and outdoor durable coating composition containing the same
08/20/2003CN1118495C Water-dispersible polymer and paint composition containing the same
08/19/2003US6608161 Carboxylic acid catalysts comprising maleic acid, dihydroxyfumaric acid, acetylenedicarboxylic acid, 2,6-dihydroxybenzoic acid, salicylic acid, maleic anhydride, citraconic anhydride or chloromaleic anhydride
08/19/2003US6608126 A reaction product obtained by combining an amine functional silicone, an epoxy functional silicone and water; useful in personal care for preparing various skin, hair, and underarm products
08/19/2003CA2049779C Adducts of hydroxyl group containing epoxy resins and isocyanates and use thereof
08/14/2003WO2003067329A1 Organic anti-reflective coating compositions for advanced microlithography
08/14/2003WO2003066709A1 Process for preparing chain extended thermoplastic guanidinium polymers
08/14/2003US20030153777 Amine compounds and curable compositions derived therefrom
08/14/2003US20030153718 Reacting a mixture: a diepoxide having at least two glycidyl ether type epoxy groups, unsaturated monocarboxylic acid, maleic anhydride and water, until all of the epoxy group react to form a resin
08/14/2003US20030153683 Co-crosslinking agent is brominated bisphenol A, or brominated bisphenol A diglycidyl ether; use as laminates for electronics and printed wiring boards
08/14/2003US20030153650 Epoxy resin composition and electronic part
08/14/2003US20030152862 Deodorizing agent for sulfur- or nitrogen-containing initiators
08/14/2003US20030152842 Data storage medium comprising colloidal metal and preparation process thereof
08/14/2003US20030152777 Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
08/14/2003US20030152776 Flame-retardant epoxy resin composition and laminate made with the same
08/13/2003EP1334974A1 Cyclic disulfide compound, process of producing the same and optical product comprising the same
08/13/2003EP1334161A1 Structural hot melt material and methods
08/13/2003EP1333940A2 Method for producing a multilayer coating and the use thereof
08/13/2003EP1055690B1 Process for producing modified phenolic resin
08/13/2003EP1036106B1 Condensation polymer containing hydroxyalkylamide groups
08/13/2003EP0906941B1 Weather-resistant resin composition for powder coating
08/13/2003EP0787348B1 Epoxy resin casting composition
08/13/2003CN1435444A Cast composite based on thermosetting epoxy resin
08/13/2003CN1117991C (Co) polymer contg. sulphur (thio-) ether and use thereof
08/13/2003CN1117784C Hydroxy-functional oligomers for high solids coatings
08/13/2003CN1117782C Method of producing epoxy resin
08/12/2003US6605355 Semiconductor connections
08/12/2003US6605354 High nitrogen containing triazine-phenol-aldehyde condensate
08/12/2003US6605353 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming
08/12/2003CA2280884C Thermoplastic compounds comprising a cross-linked phase
08/07/2003WO2003065447A2 No-flow underfill encapsulant
08/07/2003WO2003064529A1 Barrier layer made of a curable resin containing polymeric polyol
08/07/2003WO2003064494A1 Low voc vinylester resin and applications
08/07/2003WO2003064493A1 No flow underfill composition
08/07/2003WO2003064358A1 Process for producing fluorene derivative
08/07/2003US20030149233 One-component, low temperature curable coating powder
08/07/2003US20030149230 Polythiol compound
08/07/2003US20030149220 Epoxy resin hardener compositions
08/07/2003US20030149219 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom
08/07/2003US20030149194 Epoxy resin composition
08/07/2003US20030149193 Powder coating; to producing coatings having a high crosslinking density and a high level of stability towards weathering and ultraviolet radiation
08/07/2003US20030149169 Novel epoxy dispersions for use in coatings
08/07/2003US20030149135 No-flow underfill encapsulant
08/07/2003US20030149124 Radiation curable resin composition for making colored three dimensional objects
08/07/2003US20030148109 Novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance. Printed circuits
08/07/2003US20030148098 Sizing/finishing composition comprising poly(hydroxy amino ether) , and a solubilizing/emulsifying agent present in an amount sufficient to solubilize or emulsify the polymer in water.
08/07/2003US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer
08/06/2003EP1333075A1 Coating composition and method of can inside coating
08/06/2003EP1333046A2 Epoxy resin composition, surface treatment method, liquid-jet recording head and liquid-jet recording apparatus