| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
|---|
| 03/05/2003 | EP1288697A2 Display device and method for producing the same |
| 03/05/2003 | EP1287069A1 Sound deadening and structural reinforcement compositions and methods of using the same |
| 03/05/2003 | EP1287055A1 Powder compositions for heat sensitive substrates |
| 03/05/2003 | EP1036789B1 Novel aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process |
| 03/05/2003 | CN1400993A Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 03/05/2003 | CN1400988A 热固性树脂组合物 A thermosetting resin composition |
| 03/05/2003 | CN1400987A Branched polymeric surfactant reaction products methods for their preparation, and uses therefor |
| 03/05/2003 | CN1400246A Free radical polymerized resin composite |
| 03/05/2003 | CN1102623C Curing process for cationically photocurable |
| 03/04/2003 | US6528571 Extrusion freeform fabrication of soybean oil-based composites by direct deposition |
| 03/04/2003 | US6528552 Permanent protective coating of a printed wiring board; aluminum hydroxide, inorganic molybdenum compound, zinc stannate or zinc hydroxystannate in a resin |
| 03/04/2003 | US6528546 Reuse; precipitation with base |
| 03/04/2003 | US6528169 No-flow flux adhesive compositions |
| 03/04/2003 | US6528005 Process for producing a lens by polymerizing bis(β-epithiopropyl) ether |
| 02/27/2003 | WO2003017363A1 Adhesive tape |
| 02/27/2003 | WO2003016394A1 Composition of bulk filler and epoxy-clay nanocomposite |
| 02/27/2003 | WO2003016377A1 Lightfast epoxy resin |
| 02/27/2003 | WO2003016369A1 Microcapsules, method for the production thereof and their use in adhesives |
| 02/27/2003 | WO2003015909A1 Method for the production of microcapsules |
| 02/27/2003 | US20030040578 Electrode-forming compositions and electrode members |
| 02/26/2003 | EP1285939A1 Epoxy resin compositions and solid state devices encapsulated therewith |
| 02/26/2003 | EP1285938A1 Epoxy resin encapsulation compositions |
| 02/26/2003 | EP1285034A1 Corrosion resistant coatings |
| 02/26/2003 | EP1285015A1 Composition based on renewable raw materials |
| 02/26/2003 | EP1040150B1 Novolaks as water-unaffected accelerators for epoxy resin hardeners |
| 02/26/2003 | CN1398918A Thermosetting resin composition |
| 02/26/2003 | CN1398858A Alcyl epoxide and its production process and composition and LED sealing material |
| 02/25/2003 | US6525169 Quaternary polyethers as reaction product of epichlorohydrin, one or more polyols and a tertiary amine; adjuvants in papermaking, especially as fixatives when using coated broke |
| 02/25/2003 | US6525160 Epoxy resin composition and process for producing silane-modified epoxy resin |
| 02/25/2003 | US6525159 Ketimine and epoxy resin and/or modified silicone; shelf stability; high curing rate |
| 02/25/2003 | US6524989 Tetraorganophosponium dicyclic tetraorganoborate catalyst |
| 02/25/2003 | US6524769 Photosensitive resin |
| 02/25/2003 | US6524711 Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition |
| 02/25/2003 | US6524709 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 02/20/2003 | WO2003014244A1 Binding agent component for surface coating agents with improved adhesive properties |
| 02/20/2003 | WO2003014235A1 Pigment dispersant for cathodic electrocoating composition |
| 02/20/2003 | WO2003014210A1 Flame retardant molding compositions |
| 02/20/2003 | WO2003014181A1 Curing accelerator for amine hardener for epoxy resin and method of accelerating epoxy resin curing |
| 02/20/2003 | WO2003014177A1 Resin composition, composition for solder resist, and cured article obtained therefrom |
| 02/20/2003 | US20030036623 Lightfast epoxy resin |
| 02/20/2003 | US20030036608 Two component powder coating system and the method for coating heating sensitive substrates therewith |
| 02/20/2003 | US20030036584 Reaction product of (1) adduct of alkylaminoalkylamine and an alkylene carbonate; (2) an organic acid to form a tertiary amine salt and (3) an epoxy resin that is reacted with the tertiary amine salt to form a quaternary ammonium salt. |
| 02/20/2003 | US20030035899 Polymerizable preparations based on epoxies that contain silicon |
| 02/20/2003 | CA2453998A1 Pigment dispersant for cathodic electrocoating composition |
| 02/20/2003 | CA2449052A1 Flame retardant molding compositions |
| 02/19/2003 | CN1398274A Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound |
| 02/19/2003 | CN1397588A Photocationic solidified resin compsn. and its application |
| 02/19/2003 | CN1101830C Water compatible curing agents for epoxy resins |
| 02/18/2003 | US6521732 Epoxy/acrylic terpolymer self-fixturing adhesive |
| 02/13/2003 | WO2003011984A2 Weldable coating compositions having improved intercoat adhesion |
| 02/13/2003 | WO2003011971A1 Epoxy resin |
| 02/13/2003 | WO2003011939A1 Curable compositions for display devices |
| 02/13/2003 | WO2003011936A1 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 02/13/2003 | WO2003011935A2 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 02/13/2003 | WO2002083759A3 Silicone liquid crystals, vesicles, and gels |
| 02/13/2003 | WO2002017422A3 Epoxy nitrile insulator and seal for fuel cell assemblies |
| 02/13/2003 | US20030032738 Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water; resulting product has much lower levels of bisphenol-A and bisphenol a, diglycidyl ether; thermosetting coatings |
| 02/13/2003 | US20030032729 Epoxy compound, an acrylic resin having an epoxy group, and a thermally activating ionic polymerization catalyst such as a sulfonium compound which can be dissolved by heating and crystallized by cooling; storage stability; various coatings |
| 02/13/2003 | US20030032717 A reaction product obtained by combining an amine functional silicone, an epoxy functional silicone and water; useful in personal care for preparing various skin, hair, and underarm products |
| 02/13/2003 | US20030031873 Laminates for printed wiring boards |
| 02/13/2003 | US20030031799 An epoxy compound such as bisphenol a, diglycidyl ether, and an amine hardener, part of which becomes highly reactive on exposure to open flame, providing near instant cure under flame spray conditions; strong adhesion to steel |
| 02/13/2003 | US20030030966 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer |
| 02/13/2003 | US20030030155 Resin component for encapsulating semiconductor and semiconductor device using it |
| 02/13/2003 | CA2455792A1 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 02/13/2003 | CA2453578A1 Modified aminoplast crosslinkers and powder coating compositions containing such crosslinkers |
| 02/12/2003 | EP1282660A1 Rheology-controlled epoxy-based compositions |
| 02/12/2003 | EP1115504B1 Scratch-resistant sol-gel coating for clear powder-slurry lacquer |
| 02/12/2003 | CN1396943A Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 02/12/2003 | CN1396938A 环氧树脂组合物 The epoxy resin composition |
| 02/12/2003 | CN1396937A Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same |
| 02/12/2003 | CN1101420C Poly(phenylene ether) thermoset compositions |
| 02/11/2003 | US6518332 Good flow and curing properties, reliability, do not pose hazard to human health or environment |
| 02/11/2003 | US6518331 Comprising epoxy resins and epoxy resin curing agents, said epoxy resins comprising bisphenol A type epoxy resins having epoxy equivalent of not less than 400 and epoxy resins having epoxy equivalent of less than 400 |
| 02/11/2003 | US6517743 Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition |
| 02/06/2003 | US20030027939 Epoxy-containing resin, especially from glycidyl methacrylate; and a curing agent containing a carboxy endcapped acid (poly)anhydride, a carbonyl, ester or amide capped polyanhydride and a alkylenedicarboxylic acid |
| 02/06/2003 | US20030027899 Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device |
| 02/06/2003 | US20030027882 2,4,6-triarylpyrylium salt; electron donor mixture of (i) a combination of an aromatic olefin and an aromatic carbonyl compound and/or (ii) a radical forming peroxy or azo compound. |
| 02/06/2003 | US20030026909 Method and composition of disrupting feeding patterns of woodpeckers |
| 02/06/2003 | US20030025760 Ink-repellent alkylsiloxane-containing epoxy resin |
| 02/06/2003 | US20030024723 Composition for layer on outer surface of first resin layer encapsulating semiconductor, containing epoxy resin, phenolic resin, curing accelerator and conductive or magnetic particles having surfaces coated with insulating inorganic material |
| 02/05/2003 | EP1280868A1 Rigid substrate lamination adhesive |
| 02/05/2003 | EP1280842A1 Aqueous two-component cross-linkable composition |
| 02/05/2003 | EP1235646A4 Metal salts of phosphoric acid esters as cross linking catalysts |
| 02/05/2003 | EP1141127B1 Hydrophobic epoxide resin system |
| 02/05/2003 | EP0997511B1 Thermosetting, high-solid coating composition and method of forming topcoating by using the same |
| 02/05/2003 | EP0788524B1 Hyperbranched macromolecule of polyester type |
| 02/05/2003 | EP0666885B1 Novel ionic emulsion polymers and their preparation |
| 02/05/2003 | CN1395604A Adhensive film for semiconductor, lead frame with adhensive film for semiconductor and semiconductor device using the same |
| 02/05/2003 | CN1394893A Method for preparing optical material with high refractive index by using amino polybasic thioalcohol to solidify epoxy resin |
| 02/05/2003 | CN1394892A Epoxy resin solidfying agent |
| 02/05/2003 | CN1394757A Graphic product and its preparing method |
| 02/05/2003 | CN1100827C Aqueous dispersions of epoxy resins |
| 02/04/2003 | US6515166 Vinyl esters with high cross-linkage density |
| 02/04/2003 | US6515094 Amino-modified polysiloxane and epoxy-modified polysiloxane; cures slowly at room temperature or may be rapidly cured at or above room temperature in the presence of a carboxylic acid. |
| 02/04/2003 | US6515081 Composition of epoxy resin, curing agent and reactive compound |
| 02/04/2003 | US6515047 Composition of epoxy resin and triazine-formaldehyde-phenol resin |
| 02/04/2003 | US6514644 Dispersion stability; developability |
| 02/04/2003 | US6514067 Rotary trowel for use in the molding of ceramics and method for production thereof |
| 01/30/2003 | WO2003008514A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 01/30/2003 | US20030021999 Mixture of organobismuth compound and epoxy resin binder |