Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
11/2003
11/11/2003US6646065 Product of mono or polyamine and polyepoxide-amine precursor, epoxy resin-amine adduct, monoepoxide-amine adduct and epoxide thinner
11/11/2003US6646064 Reacting epoxy resin with p-containing dihydric phenol or naphthol
11/11/2003US6645633 Autodeposition compositions
11/11/2003US6645631 Flame retardant phosphorus element-containing epoxy resin compositions
11/11/2003US6645630 Phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having particles,
11/11/2003US6645341 Two part epoxide adhesive with improved strength
11/11/2003US6645340 Blend containing epoxy resin
11/11/2003CA2220062C Cationically polymerizable epoxy resins and optical information recording medium made therefrom
11/11/2003CA2118124C Catalysed cationic paint binders, process for their preparation, and their use
11/06/2003WO2003091335A1 Surface improver for reinforced composite compositions
11/06/2003US20030208009 Epoxy resin compositions, solid state devices encapsulated therewith and method
11/06/2003US20030208008 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation
11/06/2003US20030207956 Dual radiation/thermal cured coating composition
11/06/2003US20030207209 6Planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The
11/05/2003EP1359202A1 Temperature curable epoxy resin composition
11/05/2003EP1359198A1 Epoxy-modified polysiloxane resin based compositions useful for coatings
11/05/2003EP1359197A1 Epoxy-polysiloxane resin based compositions useful for coatings
11/05/2003EP1359182A1 Organo-functional polysiloxanes
11/05/2003EP1359175A1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
11/05/2003EP1359174A1 Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition
11/05/2003EP1359172A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition
11/05/2003EP1358291A2 Method for adhering substrates using light activatable adhesive film
11/05/2003EP1358286A1 Ambient cure fast dry solvent borne coating compositions
11/05/2003EP1358285A2 Curable, weldable coating compositions
11/05/2003EP1358243A2 Gel coat composition
11/05/2003EP1153980B1 Epoxy resin composition
11/05/2003EP1112312B1 Polymer compound with improved gloss properties
11/05/2003CN1454245A Method for the anodic electrophoretic enamelling and electrophoretic paints
11/05/2003CN1454238A 导电性树脂组合物 Conductive resin composition
11/04/2003US6642345 Novolak aralkyl resin, preparation process thereof and composition containing said resin
11/04/2003US6642344 Reacting with aliphatic secondary cyclohexyl diamine; flexibility; high hardness; chemical and wear resistance
11/04/2003US6641928 Adhesives and electric devices
11/04/2003US6641923 Thermosetting mixture of a polymer binder with functional groups, a crosslinking agent, an electroconductive pigment, and an adhesion promoter comprising boric acid or derivatives; use coating automobile panels, for example
10/2003
10/30/2003WO2003089106A2 Multi-layered macromolecules and methods for their use
10/30/2003WO2003011984A3 Weldable coating compositions having improved intercoat adhesion
10/30/2003WO2000064572A3 Epoxy-functional polymeric microbeads
10/30/2003US20030203994 Solventless photo-sensitive thermosetting-type ink
10/30/2003CA2482854A1 Multi-layered macromolecules and methods for their use
10/29/2003EP1357610A1 Light emitting diode, optical semiconductor elemet and epoxy resin composition suitable for optical semiconductor element and production methods therefor
10/29/2003EP1357204A1 Application type thin plate reinforcing material composition
10/29/2003EP1357160A1 Photo-curable coating composition for hard protective coat and coated article
10/29/2003EP1356002A1 Coating compositions containing alcoholic reactive diluents
10/29/2003EP1355984A2 Novel epoxy hardeners for improved properties, processing and handling
10/29/2003EP1355683A2 Biocompatible adhesives
10/29/2003EP1196422B1 Polymerisation catalysts
10/29/2003EP1109862B1 Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization
10/29/2003EP0845015B1 Storage stable autodepositable dispersions of epoxy resins and processes therefor and therewith
10/29/2003CN1451685A Polymer flame retardant of mixture contg. two different aryl phosphates, method for preparing same and use thereof
10/29/2003CN1125997C Optical guide
10/29/2003CN1125841C Epoxy resin composition and process for producing silane modified epoxy resin
10/28/2003US6639039 Polysiloxane precondensate having curable glycidol or methacryl functionality, dye, stabilizer and particles; light and scratch resistance
10/28/2003US6638567 Hardenable composition with a particular combination of characteristics
10/23/2003WO2003087187A1 Actinic radiation hardenable resin composition and hardening product thereof
10/23/2003WO2003087186A1 Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
10/23/2003WO2003002057A3 Amine compounds and curable compositions derived therefrom
10/23/2003US20030199668 Organic sulfides such as 1,1,3,3-tetrakis(mercaptomethylthio) propane, used to form resins having high refractive index, impact strength and heat reistance, for use as lenses, prisms or optical fiber and filters
10/23/2003US20030199391 Thermosetting resin composition, epoxy resin molding material and semiconductor device respectively using latent catalyst
10/23/2003US20030198815 Packaging materials having barrier coatings based on water-epoxy resin copolymers
10/22/2003EP1354904A1 Epoxy resin, coating composition, and method of can inside coating
10/22/2003EP1354885A1 Flame retardants for polymers comprising a mixture of two different aryl phoaphates, their preparation and use thereof
10/22/2003EP1276816B1 Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability
10/22/2003EP0984032B1 Foam cross-linked with metal salt and process for production
10/22/2003EP0914398B1 Heat-setting single-component lva (low-viscosity adhesive) system with improved storage properties
10/22/2003CN1449910A Gas barrier film with fine bending-resisting property
10/21/2003US6635689 Such as benzoic acid, salicylic acid, o-anisic acid, cyclohexanecarboxylic acid, phenylacetic acid or methyl salicylate; modifying rate and temperature
10/16/2003WO2003085063A1 Activatable material
10/16/2003WO2003085062A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
10/16/2003WO2003085024A1 Organic polymers having at the ends epoxy- and/or oxetanyl-containing silicon groups and process for production thereof
10/16/2003WO2003002663A3 Hydrolysis resistant polyesters and articles made therefrom
10/16/2003US20030195324 Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins
10/16/2003US20030195281 Having high glass transition temperatures and/or markedly less discoloration/yellowing, for use in epoxy resins
10/16/2003US20030194562 Curable end groups, such as allyl, (meth)acryloyloxy, glycidyloxy and cyanate groups; printed wiring board
10/16/2003US20030194560 Coating powders, methods of manufacture thereof, and articles formed therefrom
10/16/2003US20030194555 Layers are covalently bonded together and bonded to solid particulate substrates
10/16/2003CA2476737A1 Adhesive expandable material
10/16/2003CA2418736A1 Use of epoxypolysiloxanes modified with oxyalkylene ether groups as additives for radiation-curing coatings
10/15/2003EP1352933A2 Flexible gas barrier film
10/15/2003EP1352027A2 Curing agent for epoxy resins and epoxy resin composition
10/15/2003EP1352026A1 Filled epoxy resin system having high mechanical strength values
10/15/2003EP1352008A2 Epoxy resin composition for semiconductor encapsulation
10/15/2003CN1449418A No-flow flux adhesive compositions
10/15/2003CN1448263A Packaging materials having barrier coatings based on water-epoxy resin copolymers
10/14/2003US6632893 Used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected
10/14/2003US6632892 For encapsulating a solid state device, such as a light emitting diode
10/14/2003US6632881 Superior moisture-resistant adhesion and low-stress properties
10/14/2003US6632860 Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
10/09/2003WO2003083901A2 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same
10/09/2003WO2003082976A1 Thermosetting resin composition and epoxy resin molding material using the composition and semiconductor device
10/09/2003US20030191256 Cationically polymerizable composition
10/09/2003US20030191218 A multifunctional hindered phenolic stabilizer as a viscosity modifier added to curable diglycidyl ethers of bisphenol A, a particulate flame retardant and an adhesion promoter; penetration; shear overlap; protective coatings
10/09/2003US20030190480 Gas barrier film having excellent flexibility
10/09/2003US20030190479 Thermosetting resin compositions comprising epoxy resins, adhesion promoters and curatives based on the combination of nitrogen compounds and transition metal complexes
10/08/2003EP1350803A1 Packaging materials having barrier coatings based on water-epoxy resin copolymers
10/08/2003EP1350140A2 Positive type photosensitive epoxy resin composition and printed circuit board using the same
10/07/2003US6630565 Phosphorus-comprising polyol, oligomer derived from this phosphorus-comprising polyol, polymer derived from this oligomer, processes for their preparation and uses of these. for fireproofing
10/07/2003US6630204 Coating with functionalized rubber, crosslinker, accelerator/catalyst and vulcanizer
10/02/2003WO2003061577A3 Polyalkylene glycol with moiety for conjugating biologically active compound
10/02/2003US20030187176 Oxazolidine compound and curable resin composition
10/02/2003US20030187155 Using mixture of alcohol and amine
10/02/2003US20030187154 Corrosion and aging resistance; hot melt adhesive
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