| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/14/2013 | US20130061535 Abrasive article and method of forming |
| 03/14/2013 | DE10222851B4 Schneidmaschine Cutting machine |
| 03/13/2013 | CN202786520U Crystal bar sticking work fixture |
| 03/13/2013 | CN202781476U Disc spring clamping type clamp |
| 03/13/2013 | CN202781474U Net diving device |
| 03/13/2013 | CN202781472U Multi-wire sawing machine |
| 03/13/2013 | CN202781471U Steel wire used for cutting silicon slice |
| 03/13/2013 | CN202781470U Cutting device specialized for preparation of silicon cores of chemical vapor deposition and growth polycrystalline silicon |
| 03/13/2013 | CN202781469U Supporting plate washing device for degumming machine |
| 03/13/2013 | CN102969394A Limit mold for back lapping of infrared focal plane detector and preparation method |
| 03/13/2013 | CN102962904A Three-position multi-line cutting table |
| 03/13/2013 | CN102962903A Method for recovering silicon particles in silicon ingot wire saw cutting process |
| 03/13/2013 | CN102962902A Multi-wire sawing machine |
| 03/13/2013 | CN102962901A Intermittent deformation cutting metal wire |
| 03/13/2013 | CN102962900A Cutting method for free-space photoisolator chip body |
| 03/13/2013 | CN102962743A Chamfering machine capable of processing non-standard silicon wafer |
| 03/13/2013 | CN102284970B Rotary ultrasonic transducer for nonmetallic material multi-silk thread cutting |
| 03/13/2013 | CN101407091B 切削刀具 Cutting Tools |
| 03/07/2013 | WO2013031778A1 Cutting method for reinforced glass plate and reinforced glass plate cutting device |
| 03/07/2013 | US20130055763 Hearts & Arrows SiC Gemstone |
| 03/06/2013 | CN202764055U Installation shoe of diversion rod |
| 03/06/2013 | CN202764054U Multiwire cutting machine metal wire cleaning device |
| 03/06/2013 | CN202764053U Multiwire cutting machine workbench |
| 03/06/2013 | CN202764052U Multi-line cutting machine for processing crisp and hard material curved surfaces |
| 03/06/2013 | CN202764051U Multi-wire saw sand blasting nozzle fixing device |
| 03/06/2013 | CN202764050U Triangular superfine cutting wire plated at intervals and used for crisp and hard materials |
| 03/06/2013 | CN202764049U Pentagon superfine hard and brittle material cutting wire |
| 03/06/2013 | CN202764048U Pentagonal superfine cutting wire with nickel layer and used for crisp and hard materials |
| 03/06/2013 | CN202764047U High-strength high-tenacity cutting wire with nickel layer and used for crisp and hard materials |
| 03/06/2013 | CN202764046U Triangular superfine cutting wire with nickel layer and used for crisp and hard materials |
| 03/06/2013 | CN202764045U Triangle superfine hard brittle material cutting wire |
| 03/06/2013 | CN202764044U Multi-knife cutting machine |
| 03/06/2013 | CN202764043U Gem shaping machine |
| 03/06/2013 | CN202764042U Sapphire crystal forming device |
| 03/06/2013 | CN202764041U Wafer cutting machine deionized water flow alarm device |
| 03/06/2013 | CN202764040U Sapphire deep and long and tiny hole machining device |
| 03/06/2013 | CN202764039U Sapphire slender step shaft step machining protective jacket |
| 03/06/2013 | CN102958646A Jig for measurement, wire saw, and workpiece mounting method |
| 03/06/2013 | CN102956530A Method and device for separating wafers |
| 03/06/2013 | CN102956442A Integrated circuit (IC) wafer edge processing method |
| 03/06/2013 | CN102950660A Wire cutting device, main wheel structure thereof and method for manufacturing main wheel structure |
| 03/06/2013 | CN102950659A Silicon block cutting device |
| 03/06/2013 | CN102950658A Wheel unit |
| 03/06/2013 | CN102950657A Brittle material substrate fracture device |
| 03/06/2013 | CN102950090A Grain coating method and grain coating system for diamond wire saws |
| 03/06/2013 | CN102097546B Method for cutting LED chip |
| 03/06/2013 | CN101695854B Scoring device and scoring method |
| 02/28/2013 | WO2013027880A1 Multi-tasking machine for silicon ingot |
| 02/28/2013 | WO2013027702A1 Wire saw |
| 02/28/2013 | WO2012074439A4 Method of separating surface layer of semiconductor crystal using a laser beam perpendicular to the separating plane |
| 02/27/2013 | CN202753296U Multi-wire swing cutting mechanism for sapphire |
| 02/27/2013 | CN202753295U Multistation single-wire swing cutting machine for sapphire |
| 02/27/2013 | CN202753294U Squaring cutting device of single crystal silicon rod |
| 02/27/2013 | CN202753293U Processing device for sapphire eccentric notch |
| 02/27/2013 | CN102941628A Diode silicon stack cutting process and special tool thereof |
| 02/27/2013 | CN102941627A Application method of micropore flat plate and preparation method of micropore glass |
| 02/27/2013 | CN101905491B Diamond wire saw and manufacturing method thereof |
| 02/27/2013 | CN101577217B Breaking apparatus for membraniform adhesive and breaking method thereof |
| 02/21/2013 | WO2013024900A1 Resin-coated saw wire and cut body |
| 02/21/2013 | WO2013023945A1 Cutting solution for cooling and lubricating a cutting wire having a fixed cutting means |
| 02/21/2013 | DE10391795B4 Verfahren zum Bearbeiten und Zerteilen eines Halbleiterwafers A method of machining and dicing a semiconductor wafer |
| 02/21/2013 | DE102011110360A1 Wire saw arrangement for disjointing hard compact body into e.g. slices, has saw wire for cutting material of body by movement using saw punches, and ultrasound device transferring ultrasonic vibrations to saw wire via transmission medium |
| 02/20/2013 | CN202742549U Squarer and protective air pipe abrasion-proof device thereof |
| 02/20/2013 | CN202742548U Sapphire cutting machine |
| 02/20/2013 | CN202742547U Single diamond wire guillotine shear |
| 02/20/2013 | CN202742546U Liquid distribution pipe structure of oil sand type multiline cutting machine |
| 02/20/2013 | CN202742545U Observation window of crystal cutting machine |
| 02/20/2013 | CN102935668A Cutting machine |
| 02/20/2013 | CN102935667A Swing type fixed-orbit reciprocating multi-wire cutting device |
| 02/20/2013 | CN102935666A Method for producing resin diamond wire |
| 02/20/2013 | CN102935665A BGO (bismuth germanium oxide) crystal cutting machine |
| 02/20/2013 | CN102935420A Method and system for sand planting of diamond wire saw |
| 02/14/2013 | WO2013021945A1 Adhesive composition for temporary fixing |
| 02/13/2013 | CN202727134U Diamond micropowder titanium, nickel-phosphorous and nickel plated diamond jigsaw |
| 02/13/2013 | CN202727133U 线锯装置 Wire sawing device |
| 02/13/2013 | CN202727132U Saw and sawing element with diamond coating |
| 02/13/2013 | CN202727131U Spindle preposition structure of wafer cutter |
| 02/13/2013 | CN202727130U Shock-proof base structure of wafer cutter difficult in deformation |
| 02/13/2013 | CN202727129U Polycrystalline binding orientation device for large sapphire crystal |
| 02/13/2013 | CN102922612A Cutting device for crystal ingot lines |
| 02/13/2013 | CN102922611A Manufacturing device for resin diamond wire |
| 02/13/2013 | CN102922610A Multi-wire cutting method, equipment and system for diamond wire |
| 02/13/2013 | CN102922609A Ultrasonic vibration rotary drawing-out device |
| 02/13/2013 | CN102079062B Tension adjusting mechanism of diamond wire extracting machine |
| 02/13/2013 | CN101875216B Marking head and marking device using the same |
| 02/07/2013 | WO2013018556A1 Wire saw |
| 02/07/2013 | WO2013018534A1 Method for manufacturing group-iii nitride crystal substrate |
| 02/06/2013 | CN202716385U Silicon block splice tool |
| 02/06/2013 | CN102917991A Method for cutting glass sheet |
| 02/06/2013 | CN102909794A Multi-wire cutting process for silicon wafers |
| 02/06/2013 | CN102214555B Method for thinning sapphire wafer |
| 02/06/2013 | CN101419936B Splitting method for wafer |
| 01/31/2013 | WO2013015053A1 Device for producing field-pole magnet and method for producing same |
| 01/31/2013 | WO2013015047A1 Device for producing field-pole magnet and method for producing same |
| 01/31/2013 | CA2842889A1 Apparatus and method for manufacturing field-pole magnet |
| 01/30/2013 | EP2551085A1 Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using same |
| 01/30/2013 | EP2551084A1 Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using same |
| 01/30/2013 | CN202702425U Multi-wire cutting device |
| 01/30/2013 | CN202702424U Multi-wire cutting machine |
| 01/30/2013 | CN202702423U Jewel punching die |