| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 04/17/2013 | CN202878513U Stopping block of silicon ingot offcut |
| 04/17/2013 | CN202878512U Fixed-diamond wire sawing machine and slurry pipe thereof |
| 04/17/2013 | CN202878511U Multiline cutting machine |
| 04/17/2013 | CN202878510U Hole processing device with evenly distributed holes of sapphire |
| 04/17/2013 | CN103053010A Silicon wafer processing solution and silicon wafer processing method |
| 04/17/2013 | CN103042615A Improved silicon wafer collecting device |
| 04/17/2013 | CN103042614A Material bonding device special for multi-line cutting and using method thereof |
| 04/17/2013 | CN103042613A Wire-rod guiding roller |
| 04/17/2013 | CN103042612A Solar energy crystalline silicon wire-electrode cutting mortar |
| 04/17/2013 | CN103042611A Holder, holder unit, and scribe device |
| 04/17/2013 | CN101590655B 切削装置 Cutting device |
| 04/11/2013 | WO2013052350A1 Systems and methods for connecting an ingot to a wire saw |
| 04/11/2013 | WO2013051183A1 Workpiece cutting method and wire saw |
| 04/11/2013 | WO2013050352A1 Method for performing a mechanical operation in a structure comprising two layers of different stiffness |
| 04/11/2013 | WO2013024451A3 Methods and systems for removing contamination from a wire of a saw |
| 04/11/2013 | US20130087132 Systems and Methods For Connecting An Ingot To A Wire Saw |
| 04/10/2013 | EP2578549A1 Method for cutting glass sheet |
| 04/10/2013 | CN202862429U Multi-linear cutting device with shaking mechanism |
| 04/10/2013 | CN202862427U Side cutting machine with mortar filtering device |
| 04/10/2013 | CN202862426U Magnetic field rotating mechanism for diamond cutting line production facility |
| 04/10/2013 | CN202862425U Installing structure of loading grit frame and shield plate |
| 04/10/2013 | CN202862424U Stirring drive mechanism for diamond cutting line production facility |
| 04/10/2013 | CN202862423U Three tension control mechanism of multiline digital controlled slicing machine |
| 04/10/2013 | CN202862422U Rolling needle guide rail feed mechanism |
| 04/10/2013 | CN202862421U Four-roller winding mechanism |
| 04/10/2013 | CN202862420U Direct drive mechanism for cutting roller on multi-line numerical control slicing machine |
| 04/10/2013 | CN202862419U Interval plating superfine hard and brittle material cutting wire |
| 04/10/2013 | CN202862418U Interval plating pentagonal superfine hard and brittle material cutting wire |
| 04/10/2013 | CN202862417U Polysilicon head and tail cutting machine provided with two galvanization adamas band saws |
| 04/10/2013 | CN202862416U Polycrystalline silicon small square anchor flaw piece removing mechanism |
| 04/10/2013 | CN103038183A Method for cutting glass film |
| 04/10/2013 | CN103035573A Separation method for semiconductor units |
| 04/10/2013 | CN103029227A Brittle material scribing wheel, scribing apparatus and scribing tool for brittle material substrate using same |
| 04/10/2013 | CN103029226A Forming method of sapphire pipe |
| 04/10/2013 | CN103029225A 切削装置 Cutting device |
| 04/10/2013 | CN102350742B Four-roller direct-driving type diamond wire numerical control slicer |
| 04/10/2013 | CN102181916B Method for improving uniformity of resistivity in N type 111 crystal direction |
| 04/04/2013 | WO2013047678A1 Method for manufacturing fine particles |
| 04/04/2013 | US20130081606 Sawing apparatus of single crystal ingot |
| 04/04/2013 | DE102011054107A1 Device for recovering wire break arising at wire field of multi-wire saw utilized for cutting silicon, has wire loop formed based on ends of cracked wire, and deflection rollers mounted at support, which is mounted above wire guide rollers |
| 04/03/2013 | CN202846728U Manufacturing device of resin diamond wire |
| 04/03/2013 | CN202846727U Cutting metal wire with spiral wave form rotating bending portions |
| 04/03/2013 | CN202846726U Producing device with spiral wave form rotating bending portion for cutting metal wire |
| 04/03/2013 | CN202846725U Jewel cutting machine |
| 04/03/2013 | CN202846724U Sapphire multi-ring counter groove inner punching center distance fine adjusting device |
| 04/03/2013 | CN103025486A Aqueous processing solution for fixed abresive grain wire saw |
| 04/03/2013 | CN103009491A Auxiliary device for slicing silicon rod |
| 04/03/2013 | CN103009490A Wire regulating device of multi-wire cutting machine steel wire |
| 04/03/2013 | CN103009489A Method and device for cutting silicon ingot |
| 04/03/2013 | CN103008882A Micro-processing method and system for pulse laser fragile material |
| 04/03/2013 | CN102751401B Method for improving yield in light-emitting diode (LED) chip production process |
| 04/03/2013 | CN102029656B Cutting process for Z surface X-direction angle control of Z plate seed crystal blocks |
| 04/02/2013 | US8409462 System and method for the manufacture of surgical blades |
| 03/28/2013 | WO2013042055A1 Wafer cutting sacrificial substrate for use in wafer cutting |
| 03/28/2013 | WO2013041140A1 Method and apparatus for cutting semiconductor workpieces |
| 03/28/2013 | US20130074820 Fret Saw Including a Cutting Wire Provided with Fixed Abrasive Grains each Including a Core Coated with a Hard Film |
| 03/28/2013 | DE10392232B4 Schneidvorrichtung Cutter |
| 03/27/2013 | EP2572850A1 Sacrificial substrate for use in wafer cutting |
| 03/27/2013 | CN202826125U Tray and squaring machine tool provided with the same |
| 03/27/2013 | CN202826124U Sapphire X-axis directional bonding device |
| 03/27/2013 | CN202826113U Jumper wire detection device |
| 03/27/2013 | CN202826111U Stone groove for collecting cutting powder of sapphire |
| 03/27/2013 | CN202826109U Honeycomb type sand leakage tray used for cutting crystal |
| 03/27/2013 | CN202826108U Silicon briquette splicing location tool |
| 03/27/2013 | CN202826105U Multi-wire cutting machine with inhibiting device |
| 03/27/2013 | CN202826103U Silicon block cutting device |
| 03/27/2013 | CN202826102U Diamond wire with non-cut surface |
| 03/27/2013 | CN202826101U Corrugation gouging steel wire |
| 03/27/2013 | CN202826100U Multi-wire cutting machine |
| 03/27/2013 | CN202826099U Double-way cutting system for solar silicon wafer |
| 03/27/2013 | CN202826098U Break machine |
| 03/27/2013 | CN202826097U Crystal cutting machine |
| 03/27/2013 | CN202826096U Four-roller sapphire slicer |
| 03/27/2013 | CN103003040A Wire saw device |
| 03/27/2013 | CN102990792A Eight-inch single crystal silicon wafer multi-wire sawing machine and sawing method thereof |
| 03/27/2013 | CN102990791A Single-layered winding of sawing wire with fixedly bonded abrasive grain for wire saws for slicing wafers from a workpiece |
| 03/27/2013 | CN102990790A Method for machining arc hole of gem element |
| 03/27/2013 | CN101913209B Manufacture method of silicon chip |
| 03/27/2013 | CN101850532B Method for ultra thin wafer backside processing |
| 03/27/2013 | CN101754840B Multi-head mounted scribing device, and tip holder automatic-exchanging system |
| 03/21/2013 | WO2013039162A1 Laser machining method and laser machining device |
| 03/21/2013 | WO2013039150A1 Laser machining method |
| 03/21/2013 | WO2013039012A1 Laser machining method and laser machining device |
| 03/21/2013 | WO2013039006A1 Laser machining method |
| 03/21/2013 | WO2013036977A1 Method and device for producing edge cutouts in sheet glass |
| 03/20/2013 | EP2570225A1 Cutting method and cutting device |
| 03/20/2013 | CN202805448U Tooling platform for PLC (Programmable Logic Controller) wafer saw |
| 03/20/2013 | CN202805447U Steel wire type cutoff device |
| 03/20/2013 | CN202805446U Multi-wire cutting machine and wiring device thereof |
| 03/20/2013 | CN202805445U Improved ultrasonic-wave multi-line cutting special-purpose device |
| 03/20/2013 | CN202805444U Crystal carrier moving device for silicon wafer processing equipment |
| 03/20/2013 | CN202804905U Crystal ingot machining device |
| 03/20/2013 | CN102975302A Silicon block cutting fixing structure, silicon block cutting method and silicon wafer |
| 03/20/2013 | CN102975300A Multi-thread cutting machine capable of cutting arc pieces |
| 03/20/2013 | CN102975299A Double cutter plate type super-precise fly-cutting milling machine |
| 03/20/2013 | CN102975105A Self compensating angle device of cutting machine |
| 03/20/2013 | CN101602232B Wire butting machine tool |
| 03/20/2013 | CN101562127B Marking device and multi-shaft marking device |
| 03/14/2013 | WO2013035373A1 Saw wire, and method for producing iii-nitride crystal substrate using same |
| 03/14/2013 | US20130061841 Saw wire and method of manufacturing group iii nitride crystal substrate using the same |