| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 06/05/2013 | CN202964955U Fixing device for silicon block and cutting system for silicon block |
| 06/05/2013 | CN202964947U Rescue device for wire net middle wire breakage during solar silicon wafer cutting |
| 06/05/2013 | CN202964945U Glass plate deguming jig for cutting solar silicon wafer |
| 06/05/2013 | CN202964943U Horizontal-type rod-bonding device |
| 06/05/2013 | CN202964941U Guide pulley assembly for multi-wire cutting machine and multi-wire cutting machine |
| 06/05/2013 | CN202964939U Fretsaw cutter of silicon blocks |
| 06/05/2013 | CN202964938U Wire saw wheel disc and wire saw cutting device |
| 06/05/2013 | CN202964937U Device for cutting silicon ingot |
| 06/05/2013 | CN202964936U Silicon stick rotating saw cutting saw machine |
| 06/05/2013 | CN202964935U Sapphire crystal sawing horizontal band sawing machine |
| 06/05/2013 | CN202964934U Manufacturing order containing device for production of solar silicon wafers |
| 06/05/2013 | CN202964933U Squarer wire saw for edge skin cutting and fixed uniform of squarer wire saw |
| 06/05/2013 | CN103140336A Carrier for a silicon block, carrier arrangement having such a carrier and process for producing such a carrier arrangement |
| 06/05/2013 | CN103128866A Improved multi-line cutting device |
| 06/05/2013 | CN103128865A Silicon wafer cutting method |
| 06/05/2013 | CN103128864A Thrust bearing and motorized spindle |
| 06/05/2013 | CN102026926B Method of machining vulnerable material substrate |
| 06/05/2013 | CN102026925B Method for processing fragile material substrate |
| 06/05/2013 | CN101905490B 断裂棒 Broken stick |
| 05/30/2013 | WO2013076905A1 Band saw cutting device and ingot cutting method |
| 05/29/2013 | EP2596929A1 Saw blade and method for multiple sawing of rare earth magnet |
| 05/29/2013 | CN202952404U Air conducting connection rod and steel wire support device |
| 05/29/2013 | CN202952403U Device for detecting cutting position of workpiece, and squaring machine |
| 05/29/2013 | CN202952402U Quartz board connecting machine |
| 05/29/2013 | CN202952401U Novel sapphire cutting equipment |
| 05/29/2013 | CN202952400U High-efficient sapphire bar digging cutter |
| 05/29/2013 | CN103121245A Consolidation grinding material wire-electrode cutting method and cutting fluid |
| 05/29/2013 | CN101743092B Methods of crystallographically reorienting single crystal bodies |
| 05/23/2013 | WO2013073477A1 Glass plate cleaving device, method for cleaving glass plate, method for manufacturing glass plate, and glass plate cleaving system |
| 05/22/2013 | EP2593283A1 Carrier for a silicon block, carrier arrangement having such a carrier and process for producing such a carrier arrangement |
| 05/22/2013 | CN202943764U Multi-line cutting machine |
| 05/22/2013 | CN202943763U Multi-wire cutting wire breaking detection device |
| 05/22/2013 | CN202943762U Wire and wire saw used for semiconductor wire saw |
| 05/22/2013 | CN103118839A Wire saw |
| 05/22/2013 | CN103112093A Sliced method of polycrystalline silicon solar cell |
| 05/22/2013 | CN101628451B Saw wire |
| 05/16/2013 | WO2013069175A1 Cut-out sintered ceramic sheet and method of manufacturing the same |
| 05/16/2013 | US20130119106 Device and Method for Cleaving. |
| 05/15/2013 | EP2590789A1 Carrier device and method for cutting a material block fixed to the carrier device |
| 05/15/2013 | CN202936516U Glue stick tool |
| 05/15/2013 | CN202934715U Installing device of multi-wire cutting machine transition rollers |
| 05/15/2013 | CN202934714U Cutting fluid baffle device of silicon ingot cutting machine |
| 05/15/2013 | CN202934713U Silicon wafer cutting simple device for laboratory |
| 05/15/2013 | CN202934712U Sapphire crystal machining cutting tool |
| 05/15/2013 | CN202934711U Sapphire crystal machining equipment |
| 05/15/2013 | CN103108841A Plate glass scoring and cutting device |
| 05/15/2013 | CN103107136A 晶片加工方法 Wafer processing method |
| 05/15/2013 | CN103101121A Silicon carbide monocrystal cutting line positioning method |
| 05/15/2013 | CN103101120A Ultrasonic free grinding material multi-wire saw cutting method and special purpose device |
| 05/15/2013 | CN103100987A Electroplating diamond fretsaw with grinding materials controllably distributed and preparation method |
| 05/09/2013 | US20130115859 Surface treatment method of polishing pad and polishing method of wafer using the same |
| 05/09/2013 | US20130112185 Carrier for a silicon block, carrier arrangement having such a carrier and process for producing such a carrier arrangement |
| 05/08/2013 | CN202922778U Automatic orientation bar-sticking instrument |
| 05/08/2013 | CN103097096A Sawing apparatus and process for producing a scintillator structured into scintillator elements and scintillator having scintillator elements |
| 05/08/2013 | CN103085185A Wire saw control system and wire saw |
| 05/08/2013 | CN103085184A Mortar recycling device |
| 05/08/2013 | CN103085183A Line device for cutting lathe |
| 05/08/2013 | CN103085182A Wire Saw Device With Two Independent Wire Webs, Wire Saw Device And Novel Concept Of Method Thereof |
| 05/08/2013 | CN103085181A Quick Exchange Squarer Wire-guides Without Alignment |
| 05/08/2013 | CN103085180A Wire saw control system and wire saw |
| 05/08/2013 | CN103085179A Ultrasonic wire cutting method and special device |
| 05/08/2013 | CN103085178A Slicing machine for cutting sapphire silicon rods |
| 05/08/2013 | CN103085177A Slicing machine for cutting sapphire silicon rods |
| 05/08/2013 | CN103085176A Wafer cutting method |
| 05/07/2013 | US8434468 Wire saw apparatus |
| 05/02/2013 | WO2013061695A1 Water-soluble cutting fluid for fixed abrasive grain wire saw, cutting method using same, and recycling method therefor |
| 05/02/2013 | WO2013061519A1 Slurry and slurry manufacturing method |
| 05/01/2013 | EP2586751A1 Cutting method and cutting apparatus |
| 05/01/2013 | EP2586583A1 Wire saw control system and wire saw |
| 05/01/2013 | EP2586582A1 Wire saw control system and wire saw |
| 05/01/2013 | EP2586566A1 Systems and methods for manipulating objects |
| 05/01/2013 | EP2586555A1 Modular wafering concept for wafering plant |
| 05/01/2013 | EP2586554A1 Wire saw device with two independent wire webs and method thereof |
| 05/01/2013 | CN202911012U Silicon rod rotation floating cutting numerical control machine |
| 05/01/2013 | CN103079762A Wire saw |
| 05/01/2013 | CN103077951A Wafer-level packaging method of BSI (Backside Illumination) image sensor |
| 05/01/2013 | CN103072211A Fretsaw cutting method |
| 05/01/2013 | CN103072210A Saw and sawing element with diamond coating and method for producing the same |
| 05/01/2013 | CN103072209A Digging equipment |
| 05/01/2013 | CN101973086B Clamp for cutting silicon wafer |
| 04/30/2013 | CA2478329C System and method for the manufacture of surgical blades |
| 04/25/2013 | WO2013058201A1 Glass substrate cutting device, glass substrate cutting method, and glass substrate manufacturing method |
| 04/24/2013 | EP2583804A1 A new wafer sawing system |
| 04/24/2013 | EP2583778A1 Method and apparatus for measuring wire-web bow in a wire saw |
| 04/24/2013 | CN202895492U Sensor device for limiting protection of sapphire band saw cutter |
| 04/24/2013 | CN103066026A High-breaking-strength semiconductor wafer improved structure and manufacture method thereof |
| 04/24/2013 | CN103066018A Semiconductor unit separation method |
| 04/24/2013 | CN103065935A Method of disposing of insulated gate bipolar translator (IGBT) silicon wafer polishing piece edge oxidation film in extrusion mode |
| 04/24/2013 | CN103056977A Clamping assembly for wire guide of wire saw |
| 04/24/2013 | CN103056976A Light emitting diode (LED) light guide plate line scribing method and line scribing machine implementing same |
| 04/24/2013 | CN103056975A Novel wafer sawing system |
| 04/24/2013 | CN103056974A Multi-line incising method and special equipment |
| 04/24/2013 | CN103056730A Electric grinding multi-line cutting current inlet method and device |
| 04/24/2013 | CN102039638B Cutting method for cutting substrate by utilizing cutting line |
| 04/24/2013 | CN101585655B Substrate dividing apparatus and method for dividing substrate |
| 04/23/2013 | US8426767 Methods for laser scribing and breaking thin glass |
| 04/18/2013 | US20130095285 Silicon carbide substrate, silicon carbide ingot, and method of manufacturing the same |
| 04/18/2013 | US20130092143 Methods, wires, and apparatus for slicing hard materials |
| 04/18/2013 | DE102012218674A1 Drahtführungsrolle Wire lead |
| 04/17/2013 | CN202878514U Mark leading tool |