| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 07/24/2013 | CN103213203A Groove processing tool and method for processing groove |
| 07/24/2013 | CN101518925B Process waste liquid treatment apparatus |
| 07/17/2013 | EP2614543A1 Method for producing piezoelectric actuators from a material block |
| 07/17/2013 | EP2613919A2 Apparatus for slicing ingot |
| 07/17/2013 | CN203062973U Arc hole gem element machining tool |
| 07/17/2013 | CN203062971U Clamping assembly for wire guiding piece of wire saw, wire saw and wafer saw cutting system |
| 07/17/2013 | CN203062970U Butt joint device of monocrystal silicon or polycrystal silicon multi-block silicon blocks |
| 07/17/2013 | CN203062968U Wiring device for cutting machine |
| 07/17/2013 | CN203062967U Diamond fretsaw device |
| 07/17/2013 | CN103203808A Efficient multi-line cutting device and method |
| 07/17/2013 | CN103203807A Ultrasonic rotary corer |
| 07/17/2013 | CN103203806A Method for breaking brittle material substrate |
| 07/17/2013 | CN103203671A Methods of crystallographically reorienting single crystal bodies |
| 07/17/2013 | CN101903128B Method for chamfering/machining brittle material substrate and chamfering/machining apparatus |
| 07/11/2013 | US20130174828 Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
| 07/10/2013 | CN203046016U Solar silicon rod adhesive-bonding tool |
| 07/10/2013 | CN203046015U Maskplate sample cross section cutting tool |
| 07/10/2013 | CN203046014U Silicon wafer washing device |
| 07/10/2013 | CN203046013U NTC 442 slicing machine with fixed adapting piece |
| 07/10/2013 | CN203046012U Three-position multi-line cutting working platform |
| 07/10/2013 | CN203046011U Eight-inch silicon single crystal silicon wafer multi-wire cutting machine |
| 07/10/2013 | CN203046010U Wire cutting device for crystal ingots |
| 07/10/2013 | CN203046009U Material digging device |
| 07/10/2013 | CN203046004U Thin-film solar cell film coated substrate cutting device |
| 07/10/2013 | CN203045461U Chamfering machine capable of processing non-standard silicon wafer |
| 07/10/2013 | CN103201354A A method for production of photovoltaic wafers and abrasive slurry |
| 07/10/2013 | CN103192462A Multi-line silicon wafer cutting method |
| 07/10/2013 | CN103192461A Manufacturing method for high-wear-resistant fretsaw |
| 07/10/2013 | CN103192460A Cutting device and method |
| 07/10/2013 | CN103192459A Wafer dicing method and method of manufacturing light emitting device chips employing the same |
| 07/04/2013 | WO2013101872A1 Methods for mounting an ingot on a wire saw |
| 07/03/2013 | EP2610896A1 Silicon wafer processing solution and silicon wafer processing method |
| 07/03/2013 | CN203031792U Guide mechanism of multi-wire cutting machine take-up pay-off reel transmission device |
| 07/03/2013 | CN203031791U Tool for tray adhesive bonding |
| 07/03/2013 | CN203031790U Sand pouring mechanism of multi-line cutting machine |
| 07/03/2013 | CN203031789U Wire guiding wheel used for silicon wafer cutting |
| 07/03/2013 | CN203031788U 晶体固定装置 Crystal fixtures |
| 07/03/2013 | CN103189157A Device for clamping a fixture attachment to a wire saw cutting machine |
| 07/03/2013 | CN103182759A Guide wheel and production method thereof |
| 07/03/2013 | CN103182753A Diamond wire take-up system and winding displacement device thereof |
| 07/03/2013 | CN103182752A State monitoring device for silicon wafer cutting equipment |
| 07/03/2013 | CN103182751A Winding machine head of multi-wire cutting machine and cutting machine |
| 07/03/2013 | CN103182750A Method for processing reference surface by adopting linear cutting of gallium arsenide monocrystal |
| 07/03/2013 | CN103182749A Cutting method for sheet-type polycrystalline materials |
| 07/03/2013 | CN103182748A Adhesive-free cutting method for silicon dioxide evaporation material |
| 07/03/2013 | CN103182747A Multi-wire sawing wire net system |
| 07/03/2013 | CN103182746A Splitting device, splitting method of processed object, and splitting method of substrate having optical element pattern |
| 07/03/2013 | CN103182607A Processing method of to-be-processed object and laser processing device |
| 07/03/2013 | CN103182602A To-be-processed object disjunction method and disjunction method for substrate provided with optical element pattern |
| 06/27/2013 | WO2013095928A1 Method of producing bricks from a silicon ingot |
| 06/27/2013 | WO2013094809A1 Wire guide, wire saw apparatus including the same, and method for slicing ingot using the same |
| 06/27/2013 | WO2013094117A1 Method for cutting work piece |
| 06/27/2013 | WO2013094059A1 Method for fracturing brittle material substrate |
| 06/27/2013 | WO2013093938A1 Gemstone processing |
| 06/26/2013 | CN203019552U Steel wire adjusting device of multi-wire sawing machine |
| 06/26/2013 | CN203019551U Broken wire detection device of multi-wire sawing machine |
| 06/26/2013 | CN203019550U Underwater sawing machine for silicon blocks |
| 06/26/2013 | CN203019549U Wiring device for steel wire of multi-wire cutting machine |
| 06/26/2013 | CN203019548U Silicon rod provided with chamfering guide strip |
| 06/26/2013 | CN103180100A Polishing pad and method for producing same |
| 06/26/2013 | CN103178007A Scribing method, chip manufacturing method and convex glass packaging diode |
| 06/26/2013 | CN103173857A Silicon single crystal substrate and method of manufacturing the same |
| 06/25/2013 | US8471176 Laser machine for examination, planning and marking raw diamond |
| 06/20/2013 | US20130152852 Large aluminum nitride crystals with reduced defects and methods of making them |
| 06/19/2013 | CN203004093U Silicon chip cutting device |
| 06/19/2013 | CN203004091U Line collecting device |
| 06/19/2013 | CN203004090U Cutting machine |
| 06/19/2013 | CN203004089U Silicon wafer cutting device |
| 06/19/2013 | CN203004088U Binder |
| 06/19/2013 | CN203004087U Crystal bar cutting filler strip |
| 06/19/2013 | CN203004086U Crystal frequency piece stone sticking and polishing machine |
| 06/19/2013 | CN203003696U Mortar nozzle for silicon wafer cutting machine |
| 06/19/2013 | CN103158204A Improved ultrasonic multi-wire cutting method and special equipment |
| 06/19/2013 | CN103158203A Manufacturing method of crystal area array and crystal detector |
| 06/19/2013 | CN103158202A Lap joint method of hollow silicon core |
| 06/19/2013 | CN103158201A Lap joint method between hollow silicon core and solid silicon core |
| 06/19/2013 | CN103158200A C-shaped silicon core lap joint method |
| 06/19/2013 | CN101625995B Wafer processing method |
| 06/13/2013 | WO2013084877A1 Method for cutting toughened glass plates and device for cutting toughened glass plates |
| 06/13/2013 | WO2013083838A1 Systems and methods for controlling surface profiles of wafers sliced in a wire saw |
| 06/13/2013 | WO2013082830A1 Cutting device and method for glass substrate |
| 06/13/2013 | DE102004012012B4 Verfahren zum Teilen eines Halbleiterwafers A method for dividing a semiconductor wafer |
| 06/12/2013 | EP2602058A1 Aqueous processing solution for fixed abresive grain wire saw |
| 06/12/2013 | CN202994251U Liquid level detection device and slurry updating system |
| 06/12/2013 | CN202985813U Tensioning connecting rod structure based on transversely cut steel wires |
| 06/12/2013 | CN202985812U Battery piece cutter mould |
| 06/12/2013 | CN202985811U Trepanning knife for processing sapphire crystal |
| 06/12/2013 | CN202985810U Rotating shaft of crystal cutting machine |
| 06/12/2013 | CN103153564A Apparatus and method for sawing single crystal ingot |
| 06/12/2013 | CN103144209A Diamond fret saw and production technology thereof |
| 06/12/2013 | CN103144208A Fretsaw cutting method |
| 06/12/2013 | CN103144207A Crystal stone machining method |
| 06/12/2013 | CN101992507B Wafer cutting tool and method for cutting wafer by using same |
| 06/12/2013 | CN101909806B Laser processing apparatus |
| 06/06/2013 | WO2013082107A1 Method for low energy separation of a glass ribbon |
| 06/06/2013 | WO2013079683A1 Systems and methods for controlling surface profiles of wafers sliced in a wire saw |
| 06/06/2013 | US20130144421 Systems For Controlling Temperature Of Bearings In A Wire Saw |
| 06/06/2013 | US20130144420 Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
| 06/06/2013 | US20130139801 Methods For Controlling Displacement Of Bearings In A Wire Saw |
| 06/06/2013 | US20130139800 Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |