Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 53 - Devices or means for dressing or conditioning abrasive surfaces
Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
07/2003
07/31/2003US20030143932 Gear-shaping grindstone and method of fabricating the same
07/30/2003EP1331063A1 Dressing tool and method for producing the same
07/30/2003EP1331062A1 Grinder with a brush and method for using such a brush
07/30/2003EP1330339A2 Method and apparatus for making a cutting tool having a plurality of margins
07/30/2003EP1330336A1 Centreless cylindrical grinding machine
07/24/2003WO2003059576A1 Abrasive grain burying device for lapping device
07/24/2003US20030139120 Method and apparatus for grinding workpiece surfaces to super-finish surface with micro oil pockets
07/22/2003US6596087 Method of cleaning conditioning disk
07/22/2003US6595836 Calibration device for pad conditioner head of a CMP machine
07/22/2003CA2416812A1 Systems and methods for cleaning sanding devices
07/17/2003WO2003058691A1 Methods and apparatus for conditioning and temperature control of a processing surface
07/17/2003US20030134580 Polishing apparatus
07/16/2003EP1327498A2 Polishing apparatus
07/16/2003CN1430546A Method for grinding metallic workpieces containing, in particular nickel
07/15/2003US6592431 Eyeglass lens processing apparatus
07/10/2003WO2003055642A1 Method and device for truing grinding wheel, and grinding device
07/10/2003US20030129924 Oscillating arm fixture for lapping machines
07/09/2003EP1325514A2 Method and apparatus for processing a semiconductor wafer using novel final polishing method
07/09/2003CN1428225A Grinding bed dresser
07/03/2003WO2003053602A1 Copper polishing cleaning solution
07/03/2003US20030124960 Polishing method
07/03/2003US20030124856 Methods and apparatus for conditioning and temperature control of a processing surface
07/02/2003EP1322450A1 Activated slurry cmp system and methods for implementing the same
07/02/2003EP1322449A1 Web-style pad conditioning system and methods for implementing the same
07/02/2003EP1322448A2 Method and apparatus for making a cutting tool having a flute
07/02/2003EP1322441A2 Cutting tool and method and apparatus for making the same
07/01/2003US6585572 Subaperture chemical mechanical polishing system
07/01/2003US6585559 Modular controlled platen preparation system and method
06/2003
06/26/2003US20030119692 Mixture containing complexing agentand corrosion inhibitor; antideposit agent
06/26/2003US20030119427 Temprature compensated chemical mechanical polishing apparatus and method
06/26/2003US20030119322 Method of producing semiconductor device and processing conditions setting device
06/25/2003EP1320441A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
06/25/2003EP1320440A1 Wafer carrier for cmp system
06/24/2003US6582288 Diaphragm for chemical mechanical polisher
06/19/2003US20030114094 Conditioner for polishing pad and method for manufacturing the same
06/19/2003US20030111176 Apparatus for polishing semiconductor wafer
06/18/2003CN1424180A Multifunctional grinding wheel truing device and utilizing method thereof
06/17/2003US6579157 Polishing pad ironing system and method for implementing the same
06/12/2003US20030109204 Fixed abrasive CMP pad dresser and associated methods
06/12/2003US20030109200 Constant pH polish and scrub
06/10/2003US6575820 Chemical mechanical polishing apparatus
06/05/2003US20030104769 Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
06/03/2003US6572454 Apparatus and method of conditioning polishing pads of chemical-mechanical polishing system
06/03/2003US6572446 Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane
06/03/2003US6572442 Method and apparatus for forming grooves on a workpiece and for dressing a grindstone used in the groove formation
06/03/2003US6572440 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
05/2003
05/29/2003US20030100246 Polishing apparatus and dressing method
05/29/2003US20030100196 Compensating chemical mechanical wafer polishing apparatus and method
05/27/2003US6569000 Makes it possible to perform dressing on wheels without contour errors on workpiece at all or with only negligible such contour errors, even if machine is subjected to varying temperatures and/or positioning errors
05/21/2003EP1312446A2 Diamond form dressing roller and manufacturing method
05/21/2003EP1312445A1 Method, apparatus and software for grinding and at the same time dressing the grinding tool
05/21/2003EP1311368A2 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
05/21/2003EP1311366A2 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
05/20/2003US6565705 Wafer carrier used for chemical mechanic polishing
05/15/2003US20030092357 Apparatus and method of conditioning polishing pads of chemical-mechanical polishing system
05/15/2003US20030092270 CMP machine dresser and method for detecting the dislodgement of diamonds from the same
05/13/2003US6561880 Apparatus and method for cleaning the polishing pad of a linear polisher
05/13/2003US6561879 Conditioning device for grinding wheels
05/13/2003US6561873 Method and apparatus for enhanced CMP using metals having reductive properties
05/08/2003WO2003037566A1 Method and apparatus for controlling cmp pad surface finish
05/08/2003US20030084894 Brazed diamond tools and methods for making the same
05/06/2003US6558226 Polishing apparatus
05/02/2003EP1306164A1 Contact-discharge truing/dressing method and device therefor
05/01/2003WO2002053322A3 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
05/01/2003WO2002015247A3 Method and apparatus for processing a semiconductor wafer using novel final polishing method
05/01/2003US20030082997 Method and apparatus for controlling CMP pad surface finish
04/2003
04/29/2003US6554951 Chemical-mechanical polishing pad conditioning system and method
04/29/2003US6554688 Method and apparatus for conditioning a polishing pad with sonic energy
04/24/2003US20030077988 Activated slurry CMP system and methods for implementing the same
04/22/2003US6551177 Forming device for bevelling
04/22/2003US6551176 Pad conditioning disk
04/17/2003US20030073391 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
04/17/2003US20030070756 Wafer carrier used for chemical mechanic polishing
04/15/2003US6547652 Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning
04/15/2003US6547648 Method and device for high speed electrolytic in-process dressing for ultra-precision grinding
04/10/2003US20030068960 Polymeric polishing pad having continuously regenerated work surface
04/10/2003US20030066548 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
04/08/2003US6544106 Dressing of grinding wheels
04/03/2003WO2002076674A3 Rigid polishing pad conditioner for chemical mechanical polishing tool
04/03/2003US20030064595 Chemical mechanical polishing defect reduction system and method
04/02/2003EP1297926A2 Method and apparatus for grinding workpiece surfaces to super-finish surfaces with micro oil pockets
04/02/2003EP0906171A4 Apparatus for precision grinding face gears
04/02/2003CN1407605A Device for eliminating stress by machining
04/01/2003US6541383 Apparatus and method for planarizing the surface of a semiconductor wafer
04/01/2003US6540597 Polishing pad conditioner
04/01/2003US6539932 Apparatus and method for cutting ingots
03/2003
03/27/2003WO2002024410A9 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
03/27/2003US20030060144 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
03/27/2003US20030060130 Method and apparatus for conditioning a chemical-mechanical polishing pad
03/27/2003US20030060128 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
03/26/2003EP1295681A2 Method and apparatus for dressing a grinding wheel
03/25/2003US6539277 Lapping surface patterning system
03/25/2003US6537144 Method and apparatus for enhanced CMP using metals having reductive properties
03/25/2003US6537139 Apparatus and method for ELID grinding a large-diameter workpiece to produce a mirror surface finish
03/25/2003US6537138 Method of grinding an axially asymmetric aspherical mirror
03/20/2003WO2003022523A1 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
03/20/2003WO2002078903A3 Method and apparatus for avoiding particle accumulation during an electrochemical process
03/20/2003DE10162597C1 Polished semiconductor disc manufacturing method uses polishing between upper and lower polishing plates
03/19/2003EP1293297A1 Polishing pad
03/18/2003US6533647 Method for controlling a selected temperature of a planarizing surface of a polish pad.
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