Patents
Sitemap › B24 - Grinding; Polishing › B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents › B24B 53 - Devices or means for dressing or conditioning abrasive surfaces
Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
10/2005
10/04/2005US6951507 Substrate polishing apparatus
10/04/2005US6951501 Method for forming a grinding worm for forming a conical face gear that meshes with a conical involute pinion
09/2005
09/29/2005WO2005090648A2 Electrolytic processing apparatus and electrolytic processing method
09/29/2005US20050215188 CMP pad conditioner having working surface inclined in radially outer portion
09/29/2005US20050215178 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
09/27/2005US6949016 Gimballed conditioning apparatus
09/27/2005US6949012 Polishing pad conditioning method and apparatus
09/27/2005US6949011 Method and apparatus for cleaning a web-based chemical mechanical planarization system
09/22/2005US20050208884 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
09/22/2005US20050208879 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
09/21/2005CN2726801Y Diamond grinding structure in chemical mechanical polishing process
09/20/2005US6945857 Polishing pad conditioner and methods of manufacture and recycling
09/20/2005US6945855 Method and apparatus for cleaning a web-based chemical mechanical planarization system
09/15/2005US20050202762 Dresser for polishing cloth and method for producing the same
09/15/2005US20050202760 Undulated pad conditioner and method of using same
09/15/2005US20050202676 Insulated pad conditioner and method of using same
09/15/2005DE10046973B4 Verfahren zur Herstellung eines CVD-Diamantwerkzeugs und Verwendung A method for producing a CVD diamond tool and using
09/14/2005CN2724922Y 预热装置 Preheating device
09/14/2005CN1666844A Dresser for polishing cloth and method for producing the same
09/13/2005US6942555 super-abrasive layer of a predetermined thickness is fixedly attached on the outer periphery of a body portion of a base metal formed on a cylinder solid, having a toothed portion in outer edge in the shape of a teeth of external gear
09/13/2005US6942548 Polishing method using an abrading plate
09/13/2005US6942541 Polishing apparatus
09/08/2005US20050197051 High smoothness grinding process and apparatus for metal material
09/07/2005EP1570952A2 Truing method and apparatus
09/07/2005CN1217767C Activated slurry CMP system and methods for implementing the same
09/06/2005US6939457 Using rotating, electroconductive superabrasive grindstone; supplying direct current voltage
09/06/2005US6939208 Polishing apparatus
09/06/2005US6939207 Method and apparatus for controlling CMP pad surface finish
09/01/2005WO2005080046A1 Centerless grinder
09/01/2005US20050191949 Polishing apparatus
09/01/2005US20050191944 Truing method and apparatus
09/01/2005DE102004005741A1 Polishing cloth refining method, involves rubbing off surface of cloth with tool, compiling refining conditions of cloth using parameters, monitoring conditions and terminating refining of cloth when specified condition is achieved
08/2005
08/31/2005EP1568441A1 Device for the production of toothed belt forms
08/31/2005CN1216721C Method and device for producing molds for toothed belts
08/30/2005US6935938 Multiple-conditioning member device for chemical mechanical planarization conditioning
08/25/2005WO2005077600A1 Double end face truing device, double end face truing tool, and double end face truing method
08/25/2005WO2005077598A1 Detection signal transmitting apparatus
08/25/2005US20050186891 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
08/24/2005CN1657232A Centreless grinding method and centreless grinder
08/23/2005US6932896 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits
08/23/2005US6932677 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method
08/18/2005US20050181712 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
08/18/2005US20050181709 Rinse apparatus and method for wafer polisher
08/17/2005CN1655906A Polishing apparatus and methods for controlling polishing pressure as function of overlap area between polishing head and semiconductor substrate
08/16/2005US6929536 System for chemical mechanical polishing comprising an improved pad conditioner
08/11/2005WO2005072910A1 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device
08/11/2005WO2005072338A2 Multi-step pad conditioningh system and method for chemical planarization
08/11/2005US20050176350 Semiconductor wafer grinder
08/09/2005US6926598 Grinding wheel
08/04/2005US20050167048 Pad conditioning head for CMP process
07/2005
07/28/2005US20050164613 Method of conditioning polishing pad for semiconductor wafer
07/28/2005US20050164612 Method of manufacturing magnetic recording medium
07/26/2005US6921322 Apparatus and methods for refinishing a surface in-situ
07/20/2005EP1554098A2 Brazed diamond tools and methods for making the same
07/19/2005US6918821 Materials and methods for low pressure chemical-mechanical planarization
07/19/2005US6918817 Cleaning tool and method
07/19/2005US6918814 Polishing apparatus
07/13/2005EP1117506B1 Cmp polishing head with three chambers and method for using the same
07/07/2005WO2005061177A1 Pad assembly for electrochemical mechanical processing
07/07/2005US20050148285 Surface cleaning and modifying method and surface cleaning and modifying apparatus
07/07/2005US20050148185 Polishing cloth and method of manufacturing semiconductor device
07/07/2005US20050145484 Apparatus for avoiding particle accumulation in electrochemical processing
07/05/2005US6913566 Size adjustment of corrugated boards in a box making machine
07/05/2005US6913516 Dummy process and polishing-pad conditioning process for chemical mechanical polishing apparatus
06/2005
06/28/2005US6911111 Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
06/28/2005US6910947 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
06/28/2005US6910943 Planarization apparatus and method
06/28/2005US6910942 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
06/23/2005US20050136808 Apparatus, systems, and methods for conditioning chemical-mechanical polishing pads
06/23/2005US20050133363 Conductive polishing article for electrochemical mechanical polishing
06/23/2005DE102004054104A1 Verfahren zum Abrichten einer Anfasscheibe und Anfasvorrichtung A method of dressing a Anfasscheibe and chamfering
06/21/2005US6908371 Ultrasonic conditioning device cleaner for chemical mechanical polishing systems
06/21/2005US6908370 Rinse apparatus and method for wafer polisher
06/15/2005EP1541284A1 Planarization method
06/15/2005EP1539425A2 Abrasive tool having a unitary arbor
06/15/2005CN1206628C Method for prodn. of glass substrate used as magnetic recording medium
06/14/2005US6905571 Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment
06/14/2005US6905400 Method and apparatus for dressing polishing cloth
06/14/2005US6905399 Conditioning mechanism for chemical mechanical polishing
06/09/2005WO2005051596A1 Improvements in and relating to grinding machines
06/09/2005US20050124267 Rinse apparatus and method for wafer polisher
06/09/2005US20050124266 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
06/07/2005US6903021 Method of polishing a semiconductor device
06/07/2005US6902470 Apparatuses for conditioning surfaces of polishing pads
06/02/2005US20050118928 Machine tool with 5 machining axes with a continuous grinding tool profilling system
06/01/2005EP1535978A1 Polishing cloth and method of manufacturing semiconductor device
06/01/2005EP1339527B1 Method for producing molds for toothed belts
06/01/2005CN1622290A Polishing cloth and method of manufacturing semiconductor device
06/01/2005CN1621200A Method of truing chamfering grindstone and chamfering device
05/2005
05/31/2005US6899612 Polishing pad apparatus and methods
05/31/2005US6899611 Polishing pad for a semiconductor device having a dissolvable substance
05/31/2005US6899604 Dressing apparatus and polishing apparatus
05/31/2005US6899601 Method and apparatus for conditioning a polishing pad
05/31/2005US6899592 Polishing apparatus and dressing method for polishing tool
05/26/2005WO2005046935A1 Materials and methods for low pressure chemical-mechanical planarization
05/26/2005WO2005046933A1 Surface cleaning/modifying method and surface cleaning/modifying device
05/26/2005WO2005046891A1 Cleaning apparatus for rotary and orbitally mounted buffing pads
05/26/2005WO2005012592A3 Cvd diamond-coated composite substrate for making same
05/26/2005US20050113009 Polishing pad conditioner and chemical mechanical polishing apparatus having the same
05/26/2005US20050113006 Chemical mechanical polishing apparatus and method to minimize slurry accumulation and scratch excursions
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