Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
11/2002
11/19/2002US6481446 Method of cleaning a polishing pad conditioner and apparatus for performing the same
11/12/2002US6478661 Apparatus and method for processing micro-V grooves
11/12/2002US6477825 Flattening and machining method and apparatus
11/07/2002WO2002087823A2 Apparatus for machining the surface of guide wheels of grinding machines
11/07/2002WO2001089766A1 Method for grinding metallic workpieces containing, in particular, nickel
11/07/2002US20020164939 Quick coupler for mounting a rotational disk
11/07/2002US20020164932 Polishing apparatus
11/07/2002CA2408434A1 Method for grinding metallic workpieces containing, in particular, nickel
11/06/2002EP0790101B1 Shape control method and nc machine using the method
10/2002
10/31/2002US20020160691 Planarization apparatus and method
10/31/2002US20020160689 Method of polishing disks
10/31/2002US20020160609 Reducing dishing and erosion during polishing and riding thin films on a substrate planarizing for isolation of trenches by using a first and second liquid containing an oxidizing agent, an organic acid, corrosion inhibitor and water
10/31/2002US20020158395 Chemical mechanical polishing method and semiconductor device manufacturing method
10/30/2002EP1253628A1 Method of producing semiconductor device and processing conditions setting device
10/24/2002US20020155797 Retaining ring of a wafer carrier
10/24/2002DE10134519A1 Verbessertes Diaphragma für eine chemische mechanische Poliervorrichtung Improved diaphragm for a chemical mechanical polishing apparatus
10/23/2002EP1250215A1 System and method for controlled polishing and planarization of semiconductor wafers
10/22/2002US6468134 Method and apparatus for slurry distribution
10/17/2002US20020151264 Conditioning tool
10/17/2002US20020151263 Burr for preparing a homogeneous pulpstone surface
10/17/2002DE10214081A1 Verbesserter Grat für die Vorbereitung einer homogenen Schleifsteinoberfläche Improved ridge for the preparation of a homogeneous grinding stone surface
10/17/2002DE10118391A1 Method for grinding of gear hobbing tools using rolling machine with roller spindles to support hobbing tools, and grinding tool
10/17/2002DE10115801A1 Platform for chemical-mechanical wafer polishing has device with diamond particles in contact with pad to maintain surface roughness, device for cleaning particle residues from pad
10/16/2002EP1249481A2 Abrasive and boring method using the same
10/16/2002EP1089851B1 Wafer edge polishing method and apparatus
10/16/2002EP1009585B1 External abrasive machine
10/10/2002WO2002078903A2 Method and apparatus for avoiding particle accumulation during an electrochemical process
10/10/2002US20020146970 Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
10/10/2002US20020146966 Method for optimizing the planarizing length of a polishing pad
10/09/2002EP1247616A1 Method and arrangement for conditioning a polishing pad surface
10/09/2002EP0898504B1 Abrasive body
10/09/2002CN1092094C Abrasive machine for machining surface of cylindrical workpiece
10/08/2002US6461229 Abrasive machine for machining a surface of a cylindrical work piece
10/08/2002US6461228 Grinding and polishing machines
10/03/2002WO2002076674A2 Rigid polishing pad conditioner for chemical mechanical polishing tool
10/03/2002WO2002060643A3 Spherical drive assembly for chemical mechanical planarization
10/03/2002US20020142706 Method and configuration for conditioning a polishing pad surface
10/03/2002US20020139682 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits
10/02/2002CN1091674C Method and device for forming adrasive wheel
09/2002
09/26/2002US20020137441 Calibration device for pad conditioner head of a CMP machine
09/26/2002US20020137440 Polishing apparatus
09/26/2002US20020137436 System and method for controlled polishing and planarization of semiconductor wafers
09/25/2002EP1047526B1 Device for dressing a grindstone to polish the running surface structure of a ski
09/24/2002US6454637 Edge instability suppressing device and system
09/19/2002US20020132567 Apparatus and system of chemical mechanical polishing
09/19/2002US20020132562 Polish apparatus having a dresser and dresser adjusting method
09/19/2002US20020132559 Polishing apparatus
09/18/2002EP1240977A2 Polishing apparatus
09/12/2002WO2002071445A2 Polishing chemical delivery for small head chemical mechanical planarization
09/12/2002WO2002053320A3 Wafer support for chemical mechanical planarization
09/12/2002US20020127962 Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
09/12/2002US20020127957 Chemical mechanical polish pad conditioning device
09/12/2002US20020127950 Method of detecting and measuring endpoint of polishing processing and its apparatus and method of manufacturing semiconductor device using the same
09/12/2002US20020126421 Lapping apparatus, magnetic head and method of manufacturing the same
09/12/2002US20020124373 Polishing apparatus
09/10/2002US6447376 Conductive grindstone; electrode rotator; pulsed voltage applied between; pressurized mist mixture of water and compressed air; generates uniform, high efficiency sparks
09/10/2002US6447374 Chemical mechanical planarization system
09/03/2002US6444994 Apparatus and method for processing the components of a neutron lens
09/03/2002US6443819 Device for dressing grinding wheels
09/03/2002US6443817 Method of finishing a silicon part
09/03/2002US6443816 Method and apparatus for cleaning polishing surface of polisher
09/03/2002US6443815 Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
08/2002
08/29/2002WO2002066207A1 Polishing apparatus and dressing method
08/29/2002US20020119737 Tool and method for precision grinding of a conical face gear that meshes with a conical involute pinion
08/29/2002US20020119733 See attached list (k. yasui et al)
08/29/2002US20020119613 Method of cleaning a polishing pad conditioner and apparatus for performing the same
08/29/2002US20020119286 Conductive polishing article for electrochemical mechanical polishing
08/28/2002EP0906174B1 Workpiece inspection and handling
08/27/2002US6440319 Method and apparatus for predicting process characteristics of polyurethane pads
08/27/2002US6439989 Polymeric polishing pad having continuously regenerated work surface
08/27/2002US6439987 Tool and method for the abrasive machining of a substantially planar surface
08/27/2002US6439986 Conditioner for polishing pad and method for manufacturing the same
08/22/2002WO2000012264A9 Polishing pad having open area which varies with distance from initial pad surface
08/22/2002US20020115381 Eyeglass lens processing apparatus
08/20/2002US6435958 Abrasive means and a grinding process
08/20/2002US6435952 Apparatus and method for qualifying a chemical mechanical planarization process
08/15/2002WO2002016075A3 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
08/15/2002US20020111125 Flattening and machining method and apparatus
08/14/2002EP1230067A1 Sharpening device for rotating cutting tools and machine employing said device
08/13/2002US6432257 Dresser for polishing cloth and method for manufacturing such dresser and polishing apparatus
08/13/2002US6431964 Planarization apparatus and method
08/13/2002US6431962 Method and apparatus for making a cutting tool having a flute
08/13/2002US6431949 Planarization apparatus
08/08/2002WO2002060643A2 Spherical drive assembly for chemical mechanical planarization
08/08/2002US20020106979 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof
08/08/2002US20020106971 Method and apparatus for conditioning a polishing pad
08/08/2002US20020106829 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof
08/07/2002CN1362907A Dual CMP pad conditioner
08/06/2002US6428403 Polishing apparatus
08/06/2002US6428398 Method for wafer polishing and method for polishing-pad dressing
08/06/2002US6428397 Wafer edge polishing method and apparatus
07/2002
07/31/2002CN2502844Y Diamond contact roller dressing apparatus for grinder
07/25/2002WO2002057051A1 Dressing apparatus and polishing apparatus
07/25/2002US20020098779 Method and apparatus for enhanced CMP using metals having reductive properties
07/18/2002WO2002055260A1 Centreless grinder comprising a fixed dressing unit and a method for operating said grinder
07/17/2002EP1222056A1 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
07/16/2002US6419574 Abrasive tool with metal binder phase
07/16/2002US6419561 Method and apparatus for making a cutting tool having a plurality of margins
07/16/2002US6419553 Methods for break-in and conditioning a fixed abrasive polishing pad
07/16/2002US6419443 Glass product machining apparatus
1 ... 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 ... 52