Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
06/1999
06/03/1999WO1999026763A2 Polishing apparatus
05/1999
05/26/1999EP0917931A1 Combined cutting and grinding tool
05/25/1999US5906754 Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications
05/20/1999WO1999024218A1 Manufacturing a memory disk or semiconductor device using an abrasive polishing system, and polishing pad
05/18/1999US5904615 Pad conditioner for chemical mechanical polishing apparatus
05/12/1999EP0855946B1 Method of cooling and lubricating a tool and/or workpiece and a working spindle for carrying out the method
05/11/1999US5902173 Polishing machine with efficient polishing and dressing
05/05/1999CN1216015A Abrasive body
05/04/1999US5900164 Sliding a planarizing pad made of a polymeric matrix impregnated with hollow flexible polymeric microelements on a semiconductor work surface; work surface of the pad may be continuously regenerated
04/1999
04/22/1999WO1999019113A1 Centerless grinder
04/21/1999EP0909611A1 Method for grinding the surfaces of workpieces and apparatus for carrying out the method
04/14/1999EP0907461A1 Grinding machine spindle flexibly attached to platform
04/13/1999US5893753 Vibrating polishing pad conditioning system and method
04/07/1999EP0906174A1 Workpiece inspection and handling
04/07/1999EP0906171A1 Apparatus for precision grinding face gears
04/06/1999US5890951 Utility wafer for chemical-mechanical planarization
04/06/1999US5890401 Apparatus for the continuous path-controlled sharpening of saw toothings
03/1999
03/31/1999EP0904893A2 Inspection of wafer edge after grinding
03/23/1999US5885147 Apparatus for conditioning polishing pads
03/23/1999US5885140 Single-side abrasion apparatus with dresser
03/23/1999US5885137 Chemical mechanical polishing pad conditioner
03/23/1999US5885132 Method and apparatus for machining an annular layer of boron nitride or diamonds of grinding discs
03/18/1999WO1999012705A1 Optical dressing method, machining device based on this method, grindstone and polishing cloth
03/18/1999DE19740926A1 External grinding method for cylindrical pin
03/18/1999DE19737854A1 Vorrichtung und Verfahren zum Reinigen von Polierpads, beispielsweise Poliertüchern, insbesondere für das Polieren von Wafern Apparatus and method for cleaning the polishing pad, for example, polishing cloths, particularly for polishing wafers
03/11/1999WO1999011433A1 Device and method for cleaning polishing pads, such as polishing cloths, especially for polishing wafers
03/11/1999WO1999011431A1 Device and method for treating polishing pads, especially polishing cloths
03/11/1999WO1999011427A1 Cavitational polishing pad conditioner
03/09/1999US5879226 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
03/04/1999DE19737216A1 Method of truing polishing tools for polishing optical lenses
03/04/1999DE19737215A1 Combination tool for polishing glass blanks e.g. optical lenses
03/03/1999EP0898504A1 Abrasive body
03/03/1999CN1209471A Abrasive-cloth surface finishing tool and production method therefor
03/02/1999US5876508 Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process
02/1999
02/25/1999WO1999008837A1 An abrasive means and a grinding process
02/24/1999EP0897328A1 Abrasive body
02/10/1999CN1042007C Method for grinding tooth back of worm hob with secondary enveloping ring surface
02/09/1999US5868608 Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus
02/09/1999US5868607 Electrolytic in-process dressing method, electrolytic in process dressing apparatus and grindstone
02/09/1999US5868124 Quick set radius dresser
01/1999
01/28/1999WO1999003639A1 Methods and apparatus for conditioning polishing pads utilizing brazed diamond technology
01/21/1999WO1999002309A1 Cvd diamond coated substrate for polishing pad conditioning head and method for making same
01/21/1999WO1999002305A1 Substrate polishing
01/19/1999US5860181 Method of and apparatus for cleaning workpiece
01/14/1999WO1999001254A1 Internal abrasive machine
01/14/1999WO1999001253A1 External abrasive machine
01/14/1999CA2294743A1 External abrasive machine
01/14/1999CA2294723A1 Internal abrasive machine
01/12/1999US5857899 For polishing a semiconductor wafer
01/12/1999US5857898 Method of and apparatus for dressing polishing cloth
01/12/1999US5857896 Method and device for the fine machining of spur or helical gear wheels
01/12/1999US5857894 Grinding machine for the grinding of spur or helica gear--wheels
01/12/1999CA2161782C Method of dressing a threaded grinding wheel
01/07/1999EP0888846A2 Method for wafer polishing and method for polishing-pad dressing
12/1998
12/30/1998EP0887153A2 Combined slurry dispenser and rinse arm and method of operation
12/30/1998EP0887152A2 Carrier for double-side polishing
12/30/1998EP0887151A2 Improved chemical mechanical polishing pad conditioner
12/24/1998DE19725543A1 Reinigungsverfahren für Schleifscheiben Cleaning method for grinding wheels
12/23/1998WO1998057779A1 Cleaning method for abrasive disks
12/23/1998EP0885692A1 Method and apparatus for cleaning and abrasive belt
12/22/1998US5851138 In a chemical mechanical polishing process
12/16/1998CN2300479Y Roll shaving machine for abrasive machine
12/10/1998WO1998055265A1 Combined cutting and grinding tool
12/10/1998WO1998055264A1 Semiconductor wafer cmp process monitoring and endpoint
12/10/1998WO1998055262A1 Methods and apparatus for conditioning grinding stones
12/08/1998US5846336 Apparatus and method for conditioning a planarizing substrate used in mechanical and chemical-mechanical planarization of semiconductor wafers
12/01/1998US5842912 Apparatus for conditioning polishing pads utilizing brazed diamond technology
11/1998
11/25/1998EP0879115A1 Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
11/24/1998US5840202 Apparatus and method for shaping polishing pads
11/24/1998US5839947 Polishing apparatus
11/18/1998EP0878269A2 Apparatus for conditioning polishing pads
11/12/1998DE19719503A1 Semiconductor wafer chemical and mechanical polishing device
11/11/1998EP0876875A1 Dressing grinding wheels
11/10/1998US5833520 Mirror polishing device
11/10/1998US5833519 Method and apparatus for mechanical polishing
11/03/1998US5830045 Polishing apparatus
11/03/1998US5830043 Chemical-mechanical polishing apparatus with in-situ pad conditioner
10/1998
10/29/1998DE19806591A1 Method for trimming grinding wheels with profiled operating surface
10/29/1998DE19717795A1 Method of trimming profiled grinding wheels with hard implement
10/28/1998CN1197543A Method of modifying an exposed surface of semiconductor wafer
10/20/1998US5823857 Apparatus and method for precision grinding of face gears
10/20/1998US5823854 Chemical-mechanical polish (CMP) pad conditioner
10/15/1998WO1998045090A1 Polishing media magazine for improved polishing
10/14/1998EP0870578A1 Superabrasive tool and method of its manufacture
10/14/1998EP0870577A2 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
10/14/1998EP0870576A2 Polishing Apparatus
10/14/1998CN1195597A Automatic lapping method and lapping apparatus using the same
10/13/1998US5820449 For polishing planar faces of a structure
10/07/1998EP0868258A1 Substrate belt polisher
09/1998
09/30/1998EP0827435B1 Device for the contoured sharpening of saw teeth
09/23/1998EP0865342A1 Improvements in and relating to grinding machines
09/22/1998US5810964 Chemical mechanical polishing device for a semiconductor wafer
09/16/1998EP0827436B1 Device for the contoured sharpening of saw teeth
09/09/1998CN2290447Y Glassed profiling edge grinder
09/01/1998US5801066 Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
08/1998
08/27/1998DE19706867A1 Method for profiling grinding screw
08/19/1998EP0858865A2 Method and device for dressing profiled grinding wheels
08/19/1998CN1190791A Method and apparatus for controlling flatness of polished semiconductor wafer
08/06/1998DE19800250A1 Grinding disc for optical lenses, fine stones, marble, wood, metal, plastics etc.
08/05/1998EP0855946A1 Method of cooling and lubricating a tool and/or workpiece and a working spindle for carrying out the method
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