Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
08/2006
08/24/2006DE10322496B4 Vorrichtung zur automatischen Reinigung und Konditionierung von bei Polierprozessen eingesetzten Poliertüchern Apparatus for automatically cleaning and conditioning of polishing cloths used in polishing processes
08/22/2006US7094695 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
08/22/2006US7094134 Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system
08/17/2006US20060183410 Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
08/15/2006US7090566 Grinding apparatus and method for manufacturing magnetic recording medium using the same
08/15/2006US7090563 Polishing method
08/09/2006EP1687118A1 Improvements in and relating to grinding machines
08/03/2006US20060172663 Surface polishing method and apparatus thereof
08/01/2006US7083506 Polishing apparatus
08/01/2006US7083496 Gear grinding machine
07/2006
07/25/2006US7082345 Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
07/25/2006US7081037 Pad conditioner setup
07/20/2006US20060160477 CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner
07/20/2006DE102005034882A1 Verzahnungsschleifmaschine Gear Grinding Machine
07/19/2006EP1680271A2 Working surface and system for production thereof
07/19/2006EP1181134B1 Method for cleaning a chemical mechanical polishing pad
07/19/2006CN1803399A Surface polishing method and apparatus thereof
07/19/2006CN1803360A Method for grinding screw cap and special machine tool for grinding the screw cap using the method
07/19/2006CN1803359A Teeth grinding method for formed grinding wheel
07/19/2006CN1803358A Special machine tool for grinding teeth of grinding wheel
07/18/2006USRE39195 Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
07/18/2006US7077730 Method and apparatus for polishing a workpiece
07/18/2006US7077721 Pad assembly for electrochemical mechanical processing
07/18/2006CA2280342C Micro-discharge truing device and fine machining method using the device
07/06/2006US20060148381 Pad assembly for electrochemical mechanical processing
07/04/2006US7070484 Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry
07/04/2006US7070479 Arrangement and method for conditioning a polishing pad
07/04/2006US7070478 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
06/2006
06/29/2006US20060141910 Methods and systems for conditioning polishing pads
06/29/2006US20060140105 Glass substrate for information recording medium and method for producing same
06/28/2006CN2790674Y Guiderail grinding spindle head device
06/28/2006CN1795076A A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
06/28/2006CN1795074A Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
06/28/2006CN1792553A Finishing Apparatus of polishing pat and finishing method
06/27/2006US7066800 Conductive polishing article for electrochemical mechanical polishing
06/27/2006US7066786 Method of dressing polishing pad and polishing apparatus
06/22/2006US20060131183 Grinding machine
06/22/2006US20060130627 Cutting tool for soft material
06/21/2006EP1671726A1 Diamond tool, synthetic single crystal diamond and method for synthesizing single crystal diamond, and diamond jewelry
06/21/2006EP1322450B1 Activated slurry cmp system and methods for implementing the same
06/20/2006US7063603 Method and apparatus for cleaning a web-based chemical mechanical planarization system
06/20/2006US7063599 Apparatus, systems, and methods for conditioning chemical-mechanical polishing pads
06/15/2006US20060128279 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
06/15/2006US20060128273 Methods and systems for conditioning planarizing pads used in planarizing substrates
06/14/2006CN2787378Y Grinding wheel dresser
06/14/2006CN1785597A Cathode device suitable for high speed on line electrolysis grinding
06/13/2006US7059951 Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method
06/08/2006US20060121837 Dressing method for polishing pad
06/01/2006WO2005072338A3 Multi-step pad conditioningh system and method for chemical planarization
06/01/2006US20060116057 Method and apparatus for cleaning a web-based chemical mechanical planarization system
05/2006
05/30/2006US7052379 Methods and apparatus for machining a coupling
05/30/2006US7052371 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
05/30/2006US7052365 Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
05/25/2006US20060111021 Semiconductor wafer grinder
05/24/2006CN1775479A 2000-6000 mesh resin grinding wheel comminution soft-ball groove-grinding method
05/24/2006CN1775478A Bearing steel ball 2000-6000 mesh resin grinding wheel comminution method
05/23/2006CA2412102C Tool for dressing pulpstones
05/18/2006DE10131668B4 Verfahren zur abrasiven Bearbeitung von Oberflächen, auf Halbleiter-Wafern A method for the abrasive machining of surfaces on semiconductor wafers
05/16/2006US7047099 Integrating tool, module, and fab level control
05/16/2006US7044990 Forming a pattern layer includes a vitrified bond, in a predetermined pattern on the working surface of the support body; sprinkling abrasive grains over the pattern layer before the pattern layer is dried; and firing the pattern layer and the abrasive grains which are bonded to the patten layer
05/11/2006WO2005090648A3 Electrolytic processing apparatus and electrolytic processing method
05/10/2006CN1771110A Polishing pad apparatus and methods
05/09/2006US7040968 Polishing apparatus
05/09/2006US7040967 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
05/09/2006US7040956 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
05/09/2006US7040954 Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing
05/03/2006EP1651386A1 In situ activation of a three-dimensional fixed abrasive article
05/02/2006US7037178 Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing
05/02/2006US7037177 Method and apparatus for conditioning a chemical-mechanical polishing pad
04/2006
04/27/2006WO2005024287A3 Working surface and system for production thereof
04/26/2006EP1649075A2 Cvd diamond-coated composite substrate and method for making same
04/26/2006EP1648658A2 Cell, system and article for electrochemical mechanical processing (ecmp)
04/25/2006US7033248 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
04/25/2006US7033246 Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
04/18/2006US7029365 Pad assembly for electrochemical mechanical processing
04/13/2006WO2006039457A1 Contoured cmp pad dresser and associated methods
04/12/2006CN2770867Y Multifunctional numerical control grinding machine
04/11/2006US7025663 Chemical mechanical polishing apparatus having conditioning cleaning device
04/11/2006US7025662 Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool
04/06/2006US20060073769 Polishing method
04/05/2006EP1641596A1 Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads
04/05/2006EP0921886B1 Apparatus and method for improved precision grinding of face gears
04/05/2006CN2768970Y Adjustable angle abrasive wheel dresser
04/04/2006US7021999 Rinse apparatus and method for wafer polisher
04/04/2006US7021996 Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
04/04/2006US7021995 CMP pad conditioner having working surface inclined in radially outer portion
04/04/2006CA2366715C Tool and method for precision grinding of a conical face gear that meshes with a conical involute pinion
03/2006
03/30/2006WO2006032622A1 Multi-station rotary machine for polishing wafers of semiconductor electronic components
03/29/2006EP0809798B1 Method for polishing a wafer and method for manufacturing an integrated circuit
03/28/2006US7020306 Polishing pad surface condition evaluation method and an apparatus thereof and a method of producing a semiconductor device
03/28/2006US7018269 Pad conditioner control using feedback from a measured polishing pad roughness level
03/21/2006US7014538 Article for polishing semiconductor substrates
03/16/2006US20060057940 Polishing apparatus and method for producing semiconductors using the apparatus
03/15/2006EP1633527A2 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
03/15/2006CN1747814A Grinding machine
03/14/2006US7011567 Semiconductor wafer grinder
03/14/2006US7011566 Methods and systems for conditioning planarizing pads used in planarizing substrates
03/08/2006CN1743133A Polishing finishing device
03/07/2006US7008302 Chemical mechanical polishing equipment and conditioning thereof
02/2006
02/28/2006US7004825 Apparatus and associated method for conditioning in chemical mechanical planarization
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