Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
05/2004
05/11/2004US6733370 In-situ pad conditioning apparatus for CMP polisher
05/11/2004US6733363 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
05/06/2004US20040087255 Method for grinding metallic workpieces containing, in particular, nickel
05/06/2004US20040087248 Polishing method and apparatus
05/06/2004DE10345155A1 Grindstone dressing method e.g. for shaping rail, involves making grindstone attached to spindle, to abut shaping roll attached to another spindle
05/06/2004DE10214792B4 Verfahren zum Schleifen von Profilen an Werkstücken Method for grinding profiles on workpieces
05/04/2004US6732009 Machining error correction method adapted for numerically controlled machine tool and grinding machine using the same
05/04/2004US6730191 Coaxial dressing for chemical mechanical polishing
05/04/2004US6729943 System and method for controlled polishing and planarization of semiconductor wafers
04/2004
04/29/2004US20040082289 Conductive polishing article for electrochemical mechanical polishing
04/29/2004US20040082288 Fixed abrasive articles
04/22/2004US20040074599 Methods and apparatus for conditioning and temperature control of a processing surface
04/21/2004EP1409201A1 Fixed abrasive articles with wear indicators
04/21/2004EP1250215B1 System and method for controlled polishing and planarization of semiconductor wafers
04/21/2004CN1491147A Method and device for training grniding wheel ,and grinding device
04/20/2004US6722950 Method and apparatus for electrodialytic chemical mechanical polishing and deposition
04/20/2004US6722948 Pad conditioning monitor
04/20/2004US6722947 Lapping machine, lapping method, and method of manufacturing magnetic head
04/15/2004US20040072512 Polishing apparatus
04/15/2004US20040072510 Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
04/15/2004DE10245610A1 Verfahren zum selektiven Entfernen von Metallresten von einer dielektrischen Schicht mittels chemischen mechanischen Polierens A method for the selective removal of metal residues from a dielectric layer by chemical mechanical polishing
04/15/2004DE10220513B4 Verfahren zum Abrichten oder Profilieren einer zylindrischen oder im wesentlichen zylindrischen Schleifschnecke A method of dressing or profiling a cylindrical or substantially cylindrical grinding worm
04/13/2004US6719619 Quick coupler for mounting a rotational disk
04/08/2004WO2004028746A2 Brazed diamond tools and methods for making the same
04/07/2004CN2609714Y Abrasive wheel differential compensate dressing apparatus
04/06/2004US6716087 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
04/01/2004US20040063318 Method of selectively removing metal residues from a dielectric layer by chemical mechanical polishing
03/2004
03/31/2004EP1401614A1 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
03/31/2004EP1200228B1 Improvement in and relating to edge grinding
03/31/2004EP1071540B1 Corrosion resistant abrasive article and method of making
03/31/2004CN2608221Y Abrasive wheel shaping correction apparatus
03/31/2004CN1485180A Chemical mechanical polishing and pad dressing method
03/30/2004US6712682 Grinding wheel fixture
03/30/2004US6712678 Polishing-product discharging device and polishing device
03/25/2004US20040058546 Constant pH polish and scrub
03/24/2004EP1399961A2 Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
03/24/2004EP1399295A1 Feedforward and feedback control for conditioning of chemical mechanical polishing pad
03/24/2004CN1484567A System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad
03/24/2004CN1142844C Glass product machining apparatus
03/23/2004US6709981 Method and apparatus for processing a semiconductor wafer using novel final polishing method
03/18/2004US20040053567 End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
03/17/2004EP1084009B1 Cmp pad conditioner arrangement and method therefor
03/17/2004CN1482959A CMP Conditioner, method for arranging rigid grains used for CMP conditioner, and method for manufacturing CMP conditioner
03/16/2004US6706139 Method and apparatus for cleaning a web-based chemical mechanical planarization system
03/16/2004US6705930 System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
03/16/2004US6705929 Cloth cleaning device and polishing machine
03/11/2004US20040048557 Abrasive cloth dresser and method for dressing an abrasive cloth with the same
03/11/2004US20040048551 Centreless cylindrical grinding machine
03/11/2004US20040048550 Modular method for chemical mechanical planarization
03/10/2004EP1396311A1 Rotary dressing tool containing abrasive inserts
03/09/2004US6702654 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof
03/09/2004US6702646 Method and apparatus for monitoring polishing plate condition
03/04/2004WO2002053320A9 Wafer support for chemical mechanical planarization
03/04/2004US20040040864 Using rotating, electroconductive superabrasive grindstone; supplying direct current voltage
03/03/2004CN2605100Y Arbitrary double circular arc R grinding wheel dressing apparatus for grinding thread track of ball lead screw for lend screw grinding machine
03/03/2004CN1479665A Actived slurry chemical mechanical planarization system and method for implenting the same
03/02/2004US6699107 Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing
03/02/2004US6699106 Conditioner for polishing pad and method for manufacturing the same
03/02/2004US6699105 Method and apparatus for cutting and grinding single crystal SiC
02/2004
02/26/2004US20040038632 Conditioner of chemical-mechanical polishing station
02/26/2004US20040038623 Methods and systems for conditioning planarizing pads used in planarizing substrates
02/26/2004US20040038534 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
02/24/2004US6695684 Chemical mechanical polishing apparatus having a cleaner for cleaning a conditioning disc and method of conditioning a polishing pad of the apparatus
02/24/2004US6695680 Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same
02/19/2004US20040033772 Corrosion resistant abrasive article and method of making
02/18/2004EP1389505A2 Polishing apparatus
02/18/2004CN1138612C Wafer edge polishing method and apparatus
02/12/2004WO2004012904A2 Abrasive tool having a unitary arbor
02/12/2004US20040029497 Method and device for producing molds for toothed belts
02/11/2004EP1100653B1 Rotary dressing tool containing brazed diamond layer
02/05/2004US20040023610 Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The
02/05/2004US20040023602 Chemical mechanical polishing and pad dressing method
02/05/2004US20040023599 Abrasive tool having a unitary arbor
02/05/2004US20040023597 Method for seasoning a polishing pad
02/05/2004US20040023495 Contacts for electrochemical processing
02/05/2004US20040020789 For planarizing a substrate surface
02/05/2004DE10234044A1 Device for truing up a grinding disc has separately aligned truing roller held by truing head connected through positioning element to truing slide connected to guide carriage of linear guide unit
02/05/2004DE10232670A1 Process and device for cleaning a lapping disc has two parallel plates with an integrated high pressure hose feeding a fluid and with suction removal
02/04/2004EP1386695A2 Conductive polishing article for electrochemical mechanical polishing
02/03/2004US6687566 Method of machining a female screw and dressing a grinding wheel for female screw machining
02/03/2004US6685543 Compensating chemical mechanical wafer polishing apparatus and method
01/2004
01/29/2004US20040018807 Polishing pad conditioner and chemical-mechanical polishing apparatus having the same
01/28/2004EP1230067B1 Sharpening device for rotating cutting tools and machine employing said device
01/27/2004US6682405 Polishing apparatus having a dresser and dresser adjusting method
01/27/2004US6682404 Method for controlling a temperature of a polishing pad used in planarizing substrates
01/22/2004WO2004007146A1 Polishing apparatus and method of dressing polishing tool
01/20/2004US6679763 Apparatus and method for qualifying a chemical mechanical planarization process
01/15/2004US20040009743 Grind method of diamond grinding wheel finisher
01/15/2004US20040009742 Polishing pad conditioning disks for chemical mechanical polisher
01/14/2004EP1379357A2 Method and apparatus for avoiding particle accumulation during an electrochemical mechanical process
01/14/2004CN1134323C Modular machine tool for polishing and planting substrates
01/08/2004WO2004002681A1 Method of judging life and quality of abrasive pad etc, method of conditioning abrasive pad, polishing device, semiconductor device, and method of producing the semiconductor device
01/08/2004US20040005843 Method for dressing or profiling of an essentially cylindrical grinding worm
01/06/2004US6672949 Polishing apparatus
01/06/2004US6672945 Polishing apparatus and dressing method
12/2003
12/31/2003CN1132721C Abrasive tool having metal bound phase
12/30/2003US6669538 Pad cleaning for a CMP system
12/25/2003US20030236058 Centerless grinding apparatus and centerless grinding method
12/24/2003WO2003082519B1 Conditioner and conditioning methods for smooth pads
12/23/2003US6666755 Belt wiper for a chemical mechanical planarization system
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