Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
04/2002
04/11/2002WO2002028593A2 Method and apparatus for making a cutting tool having a flute
04/11/2002WO2002028578A2 Cutting tool and method and apparatus for making the same
04/11/2002US20020042200 Using multilayer polymer pad
04/09/2002US6368198 Diamond grid CMP pad dresser
04/09/2002US6368197 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
04/09/2002US6368186 Apparatus for mounting a rotational disk
04/04/2002WO2002026444A1 Wafer carrier for cmp system
04/04/2002US20020039880 Polishing apparatus
04/04/2002US20020039877 Method and system for cleaning a chemical mechanical polishing pad
04/02/2002US6364752 Method and apparatus for dressing polishing cloth
04/02/2002US6364749 CMP polishing pad with hydrophilic surfaces for enhanced wetting
04/02/2002US6364742 Chemical-mechanical polishing apparatus
03/2002
03/28/2002WO2002024410A1 Cmp apparatus and methods to control the tilt of the carrier head, the retaining ring and the pad conditioner
03/27/2002EP1190455A2 Dual cmp pad conditioner
03/27/2002CN1081510C 改进的磨削和抛光机床 Improved grinding and polishing machine
03/26/2002US6361423 Chemical mechanical polishing conditioner
03/26/2002US6361414 Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
03/26/2002US6361413 Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic device substrate assemblies
03/26/2002US6361412 Process and rotary point crush truer for dressing grinding wheels with profiled working surfaces
03/26/2002US6361411 Method for conditioning polishing surface
03/26/2002US6361410 Grinding apparatus for forming grooves on a workpiece and a method for dressing a grindstone used in the apparatus
03/26/2002US6361409 Polymeric polishing pad having improved surface layer and method of making same
03/19/2002US6358124 Pad conditioner cleaning apparatus
03/19/2002CA2245498C Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
03/14/2002WO2002020216A1 Grinding of cutting tools with a constant rake angle
03/14/2002US20020031979 Method of polishing a magnetic head slider
03/13/2002EP0865342B1 Improvements in and relating to grinding machines
03/12/2002US6354925 Composite polishing pad
03/12/2002US6354923 Apparatus for planarizing microelectronic substrates and conditioning planarizing media
03/12/2002US6354921 System for cross stream regassifier for improved chemical mechanical polishing in the manufacture of semiconductors
03/12/2002US6354918 Apparatus and method for polishing workpiece
03/12/2002US6354910 Apparatus and method for in-situ measurement of polishing pad thickness loss
03/07/2002US20020028628 Machining center and method of changing tools thereof
03/06/2002EP1184134A2 Machining center with dressing tool
03/06/2002CN1080166C Method of and apparatus for polishing wafer
03/05/2002US6352595 Method and system for cleaning a chemical mechanical polishing pad
03/05/2002US6352470 Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
02/2002
02/28/2002WO2002016078A2 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
02/28/2002WO2002016075A2 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
02/28/2002US20020025764 Polishing apparatus
02/27/2002EP1181134A1 Method and system for cleaning a chemical mechanical polishing pad
02/27/2002CN1079717C Apparatus and method for dressing inside diameter saws
02/26/2002US6350691 Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media
02/26/2002US6350184 Polishing pad conditioning device with cutting elements
02/26/2002US6350183 High pressure cleaning
02/21/2002WO2002015247A2 Method and apparatus for processing a semiconductor wafer using novel final polishing method
02/21/2002US20020022439 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
02/21/2002US20020022437 Working method for curved surface of a work and an apparatus thereof
02/20/2002CN1336637A Method for prodn. of glass substrate used as magnetic recording medium
02/19/2002US6347982 Method for making a polishing apparatus utilizing brazed diamond technology and titanium nitride
02/19/2002US6347981 Method and apparatus for conditioning polishing pads utilizing brazed diamond technology and titanium nitride
02/13/2002EP1179391A2 Procedure for creating multi-thread forms on a grindstone, particularly for the micro-scoring of the underside of skis
02/13/2002EP1178870A1 Blade sharpening
02/07/2002US20020016136 Conditioner for polishing pads
02/06/2002CN2475512Y Sheet-shape emery wheel trimmed chip with seamless structure
02/06/2002CN1078832C Method and apparatus for electrolytic dressing
02/05/2002US6343979 Modular machine for polishing and planing substrates
02/05/2002US6343977 Multi-zone conditioner for chemical mechanical polishing system
02/05/2002US6343974 Real-time method for profiling and conditioning chemical-mechanical polishing pads
01/2002
01/31/2002US20020013121 Method for the production of glass substrates for magnetic recording mediums
01/30/2002CN1078516C Internal abrasive machine
01/29/2002US6341999 Glass substrate chamfering method and apparatus
01/29/2002US6341997 Method for recycling a polishing pad conditioning disk
01/24/2002WO2002006008A1 Contact-discharge truing/dressing method and device therefor
01/24/2002US20020009954 Polishing apparatus
01/23/2002EP1174215A1 Lapping surface patterning system
01/23/2002EP0993350B1 Internal abrasive machine
01/23/2002CN1332664A Abrasive machine for machining surface of cylindrical work piece
01/22/2002US6340327 Wafer polishing apparatus and process
01/22/2002US6340326 System and method for controlled polishing and planarization of semiconductor wafers
01/17/2002WO2000060645A3 Dual cmp pad conditioner
01/17/2002US20020006768 Polishing method using an abrading plate
01/17/2002US20020006767 Ion exchange pad or brush and method of regenerating the same
01/17/2002DE10132368A1 Wafer-Poliervorrichtung The wafer polishing apparatus
01/16/2002EP1171264A1 Method of conditioning wafer polishing pads
01/16/2002EP1171256A1 Process and apparatus for manufacturing endodontic instruments
01/15/2002US6338672 Dressing wheel system
01/10/2002WO2002002277A2 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
01/10/2002US20020004361 Wafer polishing apparatus
01/10/2002US20020004306 Coaxial dressing for chemical mechanical polishing
01/09/2002EP0921904B1 Apparatus and method for polishing semiconductor devices
01/09/2002EP0907461B1 Grinding machine spindle flexibly attached to platform
01/09/2002CN1077483C Autmatic lapping method and lapping apparatus using the same
01/08/2002US6337281 Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
01/08/2002US6336855 Grindstone for ELID grinding and apparatus for ELID surface grinding
01/08/2002US6336851 Substrate belt polisher
01/08/2002US6336842 Rotary machining apparatus
01/02/2002EP1166966A2 Restoring of glass processing diamond cutters
01/02/2002EP1165287A1 Apparatus and process for reconditioning polishing pads
01/01/2002US6334810 Chemical mechanical polishing apparatus and method of using the same
12/2001
12/27/2001WO2001098028A1 Polishing pad
12/27/2001WO2000062977A9 Method of conditioning wafer polishing pads
12/27/2001US20010055937 Cleaning method and polishing apparatus employing such cleaning method
12/25/2001US6332826 Polishing apparatus
12/20/2001US20010053661 Apparatus and method for ELID grinding a large-diameter workpiece to produce a mirror surface finish
12/20/2001US20010053660 Methods for break-in and conditioning a fixed abrasive polishing pad
12/19/2001CN1076249C Method and apparatus for shaping polishing pads
12/18/2001US6331137 Polishing pad having open area which varies with distance from initial pad surface
12/18/2001US6331136 CMP pad conditioner arrangement and method therefor
12/13/2001WO1999062671A9 Apparatus for polishing silicon wafers
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