Patents for B24B 53 - Devices or means for dressing or conditioning abrasive surfaces (5,132)
07/2002
07/11/2002WO2002053322A2 System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
07/11/2002WO2002053320A2 Wafer support for chemical mechanical planarization
07/11/2002US20020090896 Pad Cleaning for a CMP system
07/11/2002DE10163301A1 Surface preparation process for grinding tool involves focusing laser jet, applying it to tool surface for sampling, and removing layer of worked material between particles
07/10/2002EP1221356A1 Eyeglass lens processing apparatus
07/09/2002US6416878 Abrasive dressing tool and method for manufacturing the tool
07/09/2002US6416617 Using a torque detector which detects the rotation torque of polishing platen or substrate holder and adaptively dressing the polishing pad if the rotation torque detected is equal to or smaller than a predetermined value
07/09/2002US6416383 Device for dressing a grindstone to polish the running surface structure of a ski
07/04/2002WO2002016078A3 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
07/04/2002US20020086623 Dressing apparatus and polishing apparatus
07/04/2002US20020086622 Method and apparatus for conditioning a polishing pad with sonic energy
07/04/2002US20020086620 Method and apparatus for conditioning a polishing pad with sonic energy
07/03/2002EP1066133B1 Polishing apparatus
07/02/2002US6413357 Polishing apparatus
07/02/2002US6413149 For semiconductor wafers
07/02/2002US6413146 Polishing apparatus
06/2002
06/27/2002WO2002049807A1 Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
06/27/2002WO2000063963A9 Non-abrasive conditioning for polishing pads
06/27/2002US20020081951 Apparatus and method for qualifying a chemical mechanical planarization process
06/27/2002US20020081944 Method and apparatus for forming grooves on a workpiece and for dressing a grindstone used in the groove formation
06/27/2002US20020080698 System and method for controlling spin speed of media in an optical disc drive
06/27/2002US20020078940 Conditioning device for grinding wheels
06/26/2002EP1216118A1 Polishing pad treatment for surface conditioning
06/25/2002US6409580 Rigid polishing pad conditioner for chemical mechanical polishing tool
06/25/2002US6409579 Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
06/25/2002US6409577 Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
06/20/2002US20020077037 Fixed abrasive articles
06/20/2002US20020077035 Ion exchange materials for chemical mechanical polishing
06/20/2002US20020076838 Polishing method
06/20/2002DE10100870C1 Headless grinding machine operating process involves setting grindstone against fixed correcting unit so that it is constantly forcibly corrected
06/13/2002WO2002028593A3 Method and apparatus for making a cutting tool having a flute
06/13/2002US20020072314 Diaphragm for chemical mechanical polisher
06/13/2002US20020072312 Chemical mechanical polishing apparatus having a cleaner for cleaning a conditioning disc and method of conditioning a polishing pad of the apparatus
06/13/2002US20020072300 Method and apparatus for dressing polishing cloth
06/12/2002EP1017540B1 An abrasive means and a grinding process
06/12/2002CN2494733Y Device for dressing single-point abrasion wheel of grinder
06/11/2002US6402883 Polishing pad conditioning surface having integral conditioning points
06/11/2002US6402597 Polishing apparatus and method
06/11/2002US6402588 Polishing apparatus
06/06/2002WO2002043923A1 Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers
06/06/2002WO2002043919A1 Method and device for producing molds for toothed belts
06/06/2002WO2002028599A3 Method and apparatus for making a cutting tool having a plurality of margins
06/06/2002WO2002028578A3 Cutting tool and method and apparatus for making the same
06/06/2002WO2001026862A8 Conditioner for polishing pad and method for manufacturing the same
06/06/2002DE4416060C2 Abrichteinrichtung an einer Schleifmaschine zum Herstellen verschiedenartiger Innen- und Außenprofile Dresser on a grinding machine for the manufacture of various indoor and outdoor profiles
06/06/2002DE10059067A1 Verfahren und Vorrichtung zur Herstellung von Zahnriemenformen und Zahnrädern Method and apparatus for production of timing belts and gears forms
06/05/2002CN1352587A Apparatus and process for reconditioning polishing pads
06/05/2002CN1351922A Reparing and milling device for chemical-mechanical polishing soft pad and its producing method
06/04/2002US6398906 Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer
06/04/2002US6398626 Polishing apparatus
06/04/2002US6398625 Apparatus and method of polishing with slurry delivery through a polishing pad
05/2002
05/30/2002US20020065029 Conditioner set for chemical-mechanical polishing station
05/30/2002US20020063860 Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
05/29/2002EP1208943A1 Method and apparatus for dressing a metal bonded grinding wheel
05/29/2002EP0750538B1 Threaded grinding wheel, method of dressing, and grinding a workpiece therewith
05/29/2002DE10134518A1 Verbessertes Diaphragma für eine chemische mechanische Poliervorrichtung Improved diaphragm for a chemical mechanical polishing apparatus
05/29/2002CN2493350Y Shape correction machine for diamond grinding wheel
05/28/2002US6394886 Conformal disk holder for CMP pad conditioner
05/23/2002WO2001091969A3 Polishing methods and apparatus for semiconductor and integrated circuit manufacture
05/21/2002US6390909 Disk for conditioning polishing pads
05/21/2002US6390902 Multi-conditioner arrangement of a CMP system
05/21/2002US6390895 Wetting abrasive; prepolishing
05/16/2002WO2002002277A3 A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers
05/15/2002CN1349446A Method of conditioning wafer polishing pads
05/14/2002US6387188 Pad conditioning for copper-based semiconductor wafers
05/14/2002US6386963 Conditioning disk for conditioning a polishing pad
05/14/2002US6386953 Topological profiling of grinding worms for continuous generating grinding of gear teeth
05/10/2002WO2002036305A1 Centreless cylindrical grinding machine
05/09/2002US20020055325 Polishing apparatus
05/09/2002US20020053358 Method of cleaning abrasive plates of abrasive machine and cleaning device
05/07/2002US6383290 Bowling lane dressing application mechanism
05/02/2002WO2002035592A1 Polishing device
05/02/2002WO2002035587A1 Method of producing semiconductor device and processing conditions setting device
05/02/2002WO2002034467A1 Polisher
05/02/2002US20020052172 Lapping machine, lapping method, and method of manufacturing magnetic head
05/02/2002US20020052166 Polishing system
05/02/2002US20020052064 Method and apparatus for processing a semiconductor wafer using novel final polishing method
05/02/2002EP1201367A1 Dresser for polishing cloth and manufacturing method therefor
05/02/2002EP1201366A1 Dressing device for grinding wheels
05/02/2002EP1200228A1 Improvement in and relating to edge grinding
05/02/2002EP0921886A4 Apparatus and method for improved precision grinding of face gears
05/01/2002CN2488642Y Angle shaper
04/2002
04/30/2002US6379235 Wafer support for chemical mechanical planarization
04/30/2002US6379230 Automatic polishing apparatus capable of polishing a substrate with a high planarization
04/30/2002US6379229 Polishing apparatus
04/30/2002US6379217 Process and device for dressing a grinding worm and for grinding pre-cut toothed workpiece
04/25/2002US20020048957 Method of cleaning a polishing pad conditioner and apparatus for performing the same
04/25/2002DE10046973A1 Manufacture of chemical vapor deposition diamond product, e.g. cutting tool, involves depositing chemical vapor deposition diamond to desired thickness at mold interface, dissolving mold, and mounting remaining diamond in holder
04/24/2002EP1113902A4 Grinding machine, computer software to operate such a machine, and their uses therefor
04/24/2002CN1346300A Modular controlled platen preparation system and method
04/18/2002WO2002030618A1 Activated slurry cmp system and methods for implementing the same
04/18/2002US20020045408 Abrasive machine for machining a surface of a cylindrical work piece
04/17/2002EP1197296A2 Pad conditioning disk
04/17/2002CN1082868C Grinding and polishing machine tool and method and apparatus for grinding and polishing disk using the same
04/17/2002CA2323321A1 Dressing apparatus for grinding wheels
04/16/2002US6371838 Polishing pad conditioning device with cutting elements
04/16/2002US6371836 Groove cleaning device for chemical-mechanical polishing
04/11/2002WO2002028599A2 Method and apparatus for making a cutting tool having a plurality of margins
04/11/2002WO2002028598A1 Method for conditioning polishing pads
04/11/2002WO2002028596A1 Web-style pad conditioning system and methods for implementing the same
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