Patents
Patents for B24B 49 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (8,827)
04/2007
04/11/2007CN1946527A Saw for semiconductor device
04/11/2007CN1943990A In-situ substrate imaging
04/10/2007US7203564 Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
04/10/2007US7201635 Methods and systems for conditioning planarizing pads used in planarizing substrates
04/10/2007US7201631 Automatic or semi-automatic device for trimming an ophthalmic lens
04/05/2007US20070077862 System for Endpoint Detection with Polishing Pad
04/04/2007EP1769885A1 Automatic machine for arrissing and grinding the edges of glass sheets
04/04/2007EP1622743A4 Whole-substrate spectral imaging system for cmp
04/04/2007EP1370393B1 Method of reducing thermal distortion in grinding machines
04/04/2007CN2885496Y Railway steel rail flatness repairing and grinding device
04/04/2007CN1941323A Chemical mechanical polishing and method for manufacturing semiconductor device using the same
04/03/2007USRE39547 Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates
04/03/2007US7198551 Substrate polishing apparatus
04/03/2007US7198548 Polishing apparatus and method with direct load platen
04/03/2007US7198547 Lens edger
04/03/2007US7198546 Method to monitor pad wear in CMP processing
04/03/2007US7198545 Method of calibration and data evaluation for eddy current metrology systems
04/03/2007US7198544 Polishing pad with window
04/03/2007US7198542 Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor
03/2007
03/29/2007US20070072517 Devices for altering the position of the scanning element unit on inclined installation of a segmented grinding platen and controller for control thereof
03/28/2007EP1766482A2 Method and apparatus for controlling the machining of mechanical pieces
03/28/2007CN1935456A Pressure-speed-regulating die curve grinding-polishing system
03/27/2007US7196011 Apparatus and method for treating substrates
03/27/2007US7195548 Method and apparatus for post-CMP cleaning of a semiconductor work piece
03/27/2007US7195544 CMP porous pad with component-filled pores
03/27/2007US7195543 Machine tool with 5 machining axes with a continuous grinding tool profilling system
03/27/2007US7195541 Endpoint detection system for wafer polishing
03/27/2007US7195540 Method and system for endpoint detection
03/27/2007US7195539 Polishing pad with recessed window
03/27/2007US7195538 Eyeglass lens processing apparatus
03/27/2007US7195536 Integrated endpoint detection system with optical and eddy current monitoring
03/27/2007US7195535 Metrology for chemical mechanical polishing
03/22/2007US20070066183 Control structure of grinding machine
03/22/2007US20070066182 Machine for grinding internal diameter and end surface of workpiece
03/21/2007EP1764187A2 Method for machining a surface and simultaneously measuring parameters of the surface being machined
03/21/2007EP1438158B1 Abrasive flow machining apparatus and method
03/21/2007CN2880371Y Feeding device of drilling bit grinding machine
03/21/2007CN1931524A Pawl measuring system with independent oil path for full automatic grinder
03/20/2007US7193724 Method for measuring thickness of thin film-like material during surface polishing, and surface polishing method and surface polishing apparatus
03/20/2007US7193714 Lens blank alignment and blocking device and method
03/15/2007US20070061088 System and Method for the Identification of Chemical Mechanical Planarization Defects
03/15/2007US20070061036 Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
03/15/2007US20070060022 Gear manufacturing machine and process for the operation of such a gear manufacturing machine
03/15/2007US20070059935 Polishing method for semiconductor wafer
03/15/2007US20070058128 Eyeglass lens processing apparatus
03/14/2007EP1594657B1 Grinding machine
03/14/2007CN1929952A Devices and methods for optical endpoint detection during semiconductor wafer polishing
03/14/2007CN1927535A Tracking method of on-line measuring roundness error and machine tool main axle error
03/14/2007CN1305027C Polish cleaning apparatus and method in manufacture of HGA.
03/13/2007US7189148 Polishing apparatus
03/13/2007US7189141 Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
03/13/2007US7189140 Methods using eddy current for calibrating a CMP tool
03/13/2007US7189139 Polishing apparatus
03/08/2007US20070054599 Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces
03/07/2007EP1758711A1 Polishing apparatus and polishing method
03/07/2007CN1925952A Tire uniformity machine grinding assembly
03/07/2007CN1923452A Processing method of three-pyramidal face large angle crossing point metric gage
03/06/2007US7186164 Processing pad assembly with zone control
03/06/2007US7185552 Movable sample holder
03/01/2007WO2007024807A2 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing
03/01/2007US20070049173 Process, apparatus and slurry for wire sawing
03/01/2007US20070049172 Apparatus and method for removing material from microfeature workpieces
03/01/2007US20070049171 Flexible CNC belt grinding machine
03/01/2007US20070049167 Sealed polishing pad, system and methods
03/01/2007US20070049166 Polishing method and polishing apparatus
02/2007
02/28/2007CN1921984A Device for production of a pre-formed shape on a workpiece by grinding and corresponding method
02/27/2007US7182882 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
02/27/2007US7182673 Method and apparatus for post-CMP cleaning of a semiconductor work piece
02/27/2007US7182670 CMP pad having a streamlined windowpane
02/27/2007US7182669 Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
02/27/2007US7182668 Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
02/27/2007CA2395949C Grinder
02/22/2007WO2006134234A3 Method for grinding a variable crown roll
02/22/2007US20070042681 Spectrum based endpointing for chemical mechanical polishing
02/22/2007US20070042680 Spectrum based endpointing for chemical mechanical polishing
02/22/2007US20070042679 Substrate polishing apparatus
02/22/2007US20070042676 Blasting apparatus and blasting method
02/22/2007US20070042675 Spectrum based endpointing for chemical mechanical polishing
02/22/2007US20070039196 Method for the in-process dimensional checking of orbitally rotating crankpins
02/22/2007DE102005039010A1 Bearbeitungsvorrichtung mit Vermessungseinrichtung für ein Modell Processing apparatus with measuring device for a model
02/21/2007EP1754571A1 Retaining ring in a carrier head for a chemical mechanical polishing system
02/21/2007CN1917984A Detection signal transmitting apparatus
02/20/2007US7180591 Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods
02/15/2007US20070037490 Methods and apparatus for selectively removing conductive material from a microelectronic substrate
02/15/2007US20070037489 Centerless grinder
02/15/2007US20070037488 Polishing pad having a window with reduced surface roughness
02/15/2007US20070037487 Polishing pad having a sealed pressure relief channel
02/15/2007US20070034506 Pad assembly for electrochemical mechanical processing
02/15/2007DE102005039094A1 Verfahren und Vorrichtung zum Führen eines Maschinenteils entlang einer definierten Bewegungsbahn über einer Werkstücksoberfläche A method and apparatus for guiding a machine part along a defined movement path over a workpiece surface
02/14/2007EP1578562B1 Grinding wheel monitoring
02/14/2007CN1300769C Multi-chambered, compliant apparatus for restraining workpiece and applying variable pressure thereto during lapping to improve flatness characteristics of workpiece
02/13/2007US7177019 Apparatus for imaging metrology
02/13/2007US7175505 Method for adjusting substrate processing times in a substrate polishing system
02/13/2007US7175504 Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus
02/13/2007US7175503 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
02/08/2007WO2007015163A1 Precision machining apparatus and precision machining method
02/08/2007US20070032172 Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
02/08/2007US20070032171 Methods and systems for conditioning planarizing pads used in planarizing susbstrates
02/08/2007US20070032170 Polishing pad with built-in optical sensor
02/07/2007EP1748867A1 Substrate peripheral portion measuring device and method, substrate peripheral portion polishing apparatus and method, and substrate rinsing apparatus and method
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