| Patents for B24B 37 - Lapping machines or devices; Accessories (20,836) |
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| 09/14/2011 | CN102186628A Polisher, pressure plate of the polisher and method of polishing |
| 09/14/2011 | CN102186627A Method and apparatus for polishing a substrate |
| 09/14/2011 | CN102179767A Bearing fine-grinding machine |
| 09/14/2011 | CN102179766A Automatic polishing machine for frame of pole plate |
| 09/14/2011 | CN102179757A Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus |
| 09/14/2011 | CN102179731A Preparation of synthetic quartz glass substrates |
| 09/14/2011 | CN101616773B Process for producing polyurethane foam |
| 09/14/2011 | CN101448607B 抛光垫 Polishing pad |
| 09/14/2011 | CN101423747B Abrasive, method of polishing wafer, and method of producing semiconductor device |
| 09/14/2011 | CN101113996B Element for detecting the amount of lapping, crystal and lapping method |
| 09/09/2011 | CA2791475A1 Bonded abrasive wheel |
| 09/08/2011 | US20110218263 Polishing pad |
| 09/08/2011 | US20110217845 Polishing Composition and Polishing Method Using The Same |
| 09/08/2011 | US20110216328 Polishing monitoring method, polishing method, and polishing monitoring apparatus |
| 09/07/2011 | CN201960464U 一种化学机械研磨垫及化学机械研磨设备 A chemical mechanical polishing pad and chemical mechanical polishing apparatus |
| 09/07/2011 | CN201960451U 一种化学机械研磨测试设备 A chemical mechanical polishing test equipment |
| 09/07/2011 | CN201960450U 一种自动油嘴研磨机 An automatic choke grinder |
| 09/07/2011 | CN201960449U 一种化学机械研磨设备 A chemical mechanical polishing apparatus |
| 09/07/2011 | CN201960448U 运动部件位置检测系统 Moving parts of the position detection system |
| 09/07/2011 | CN201960447U 一种化学机械研磨设备 A chemical mechanical polishing apparatus |
| 09/07/2011 | CN201960446U 用于轴承套圈研磨的分离式电磁无心磁极 Separate magnetic bearing rings for centerless grinding pole |
| 09/07/2011 | CN1939995B Aqueous polishing liquid and chemical mechanical polishing method |
| 09/07/2011 | CN102172884A Device and method for machining ceramic ball used by bearing and precise machine |
| 09/07/2011 | CN102172883A Method and device for machining high-quality tiny through hole of hard and crisp material |
| 09/07/2011 | CN102172882A Method for grinding and preserving cephalopod otolith slices |
| 09/07/2011 | CN102172858A Semiconductor surface protecting sheet and method |
| 09/07/2011 | CN101166604B Customized polishing pads for CMP and methods of fabrication and use thereof |
| 09/07/2011 | CN101134292B Cmp pad having overlaid constant area spiral grooves |
| 09/06/2011 | US8011999 Polishing pad, method for manufacturing the polishing pad |
| 09/01/2011 | WO2011105494A1 Abrasive pad |
| 09/01/2011 | WO2011105255A1 Manufacturing method for semiconductor wafer |
| 09/01/2011 | WO2011043567A3 Wafer-supporting member, method for manufacturing same, and wafer-polishing unit comprising same |
| 09/01/2011 | US20110212669 Method for manufacturing glass substrate for magnetic recording medium |
| 09/01/2011 | US20110209413 Non-Spherical Silica Sol, Process for Producing the Same, and Composition for Polishing |
| 08/31/2011 | CN201950566U 一种研磨装置 A polishing apparatus |
| 08/31/2011 | CN201950565U 脉冲安全阀研磨胎具 Pulse valve grinding tire tool |
| 08/31/2011 | CN102171000A Method for measuring the thickness of a discoidal workpiece |
| 08/31/2011 | CN102170999A Apparatus for polishing spherical body, method for polishing spherical body and method for manufacturing spherical member |
| 08/31/2011 | CN102169821A Method for producing a semiconductor wafer |
| 08/31/2011 | CN102166731A Grinding device |
| 08/31/2011 | CN101704174B Light scraping method of main bearing black golden tile of ball mill |
| 08/30/2011 | US8010222 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool |
| 08/30/2011 | US8008203 Substrate, method of polishing the same, and polishing apparatus |
| 08/30/2011 | US8008165 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 08/30/2011 | US8007676 Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions |
| 08/25/2011 | WO2011102078A1 Abrasive head and abrading device |
| 08/25/2011 | US20110204027 Slurry manufacturing method, slurry and polishing method and apparatus using slurry |
| 08/25/2011 | US20110204024 Polishing method |
| 08/25/2011 | US20110203186 Polishing liquid composition for magnetic disk substrate |
| 08/24/2011 | CN201940894U 球阀研磨装置 Ball grinding device |
| 08/24/2011 | CN201940893U 晶片研磨机 The wafer lapping machine |
| 08/24/2011 | CN201940892U 研磨垫调整装置 Abrasive pad adjustment device |
| 08/24/2011 | CN102165563A 碳化硅单晶基板 SiC single crystal substrate |
| 08/24/2011 | CN102161879A Polishing composition and polishing method using the same |
| 08/24/2011 | CN102161179A Wafer grinding device |
| 08/24/2011 | CN102161178A Workpiece dismantling and mounting structure of grinding machine |
| 08/24/2011 | CN101733701B Chemical mechanical polishing equipment |
| 08/24/2011 | CN101683723B Dead halt alarm device for CMP equipment |
| 08/23/2011 | US8005634 Copper wiring module control |
| 08/23/2011 | US8002860 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive |
| 08/23/2011 | US8002610 Double side polishing method and apparatus |
| 08/23/2011 | US8002607 Polishing apparatus and polishing method |
| 08/18/2011 | WO2011099313A1 Cmp polishing solution and polishing method |
| 08/18/2011 | WO2011099197A1 Cerium-based abrasive regeneration method |
| 08/18/2011 | US20110198531 Composition for polishing silicon nitride and method of controlling selectivity using same |
| 08/17/2011 | EP2357059A2 Method for chemical mechanical planarization of a tungsten-containing substrate |
| 08/17/2011 | CN201931351U Vertical grinding supporting device |
| 08/17/2011 | CN201931350U 一种瓷套v形接口研磨机 One kind of porcelain v-shaped interface grinder |
| 08/17/2011 | CN201931349U 一种强化研磨智能加工机器人 An enhanced polishing intelligent processing robot |
| 08/17/2011 | CN1805825B Data processing for monitoring chemical mechanical polishing |
| 08/17/2011 | CN102160152A Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program |
| 08/17/2011 | CN102159609A Two-pack urethane resin composite for use in an abrasive pad, polyurethane abrasive pad, and method for manufacturing a polyurethane abrasive pad |
| 08/17/2011 | CN102159361A Polishing pad with floating elements and method of making and using same |
| 08/17/2011 | CN102157157A Glass substrate for magnetic recording medium, and method for manufacturing the same |
| 08/17/2011 | CN102152233A Polishing pad |
| 08/17/2011 | CN102152232A Polishing pad and method for producing the same |
| 08/17/2011 | CN102152231A Equipment for fixing orientation of diamond blank with two conical ends |
| 08/17/2011 | CN102152230A Method for grinding beaker of piezoresistor and grinding equipment used in method |
| 08/17/2011 | CN102152229A Constant-pressure ultrasonic auxiliary excircle grinding device of adhesive grinding materials |
| 08/17/2011 | CN102152228A Grinding method of sapphire slices |
| 08/17/2011 | CN102152227A Auxiliary plate for grinding pad and regeneration method for grinding pad employing same |
| 08/17/2011 | CN101542690B Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device |
| 08/17/2011 | CN101522370B Stepped retaining ring |
| 08/17/2011 | CN101486145B Method for processing ceramic bearing ball |
| 08/17/2011 | CN101065218B Flexible rinsing step in a CMP process |
| 08/16/2011 | US7999540 Eddy current apparatus and method for in-situ profile measurement |
| 08/16/2011 | US7998334 establishing an optimal pulse duration; determined from a first calibration preceding the machining of the work piece and a second calibration carried out during the machining of the work piece; monitoring actual value of operational parameter and comparing actual to a preset value |
| 08/16/2011 | US7998229 Polishing composition and polishing method |
| 08/16/2011 | US7997958 Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
| 08/11/2011 | WO2011096366A1 Glass substrate manufacturing method |
| 08/11/2011 | WO2011096331A1 Polishing composition |
| 08/11/2011 | US20110195640 Applying different pressures through sub-pad to fixed abrasive cmp pad |
| 08/11/2011 | US20110195639 Retaining ring with shaped surface |
| 08/11/2011 | US20110195528 Polishing system with in-line and in-situ metrology |
| 08/10/2011 | CN201922346U 一种钢丝磨料研磨扩孔机 A wire - Abrasive reaming machine |
| 08/10/2011 | CN201922345U 卡尺自动研磨机 Caliper automatic grinding machine |
| 08/10/2011 | CN1934208B Cmp porous pad with component-filled pores |
| 08/10/2011 | CN1673306B Polishing composition |
| 08/10/2011 | CN102145475A Ball crusher with double-rotor hydrostatic bearing structure |
| 08/10/2011 | CN102145392A Lathe die head for processing plane of grinding disc |