Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/1995
01/11/1995CN2187315Y 液晶显示器 LCD Monitor
01/11/1995CN1027375C Silicone composition
01/11/1995CN1027352C Method and device for cleaning article
01/11/1995CA2127634A1 Method for the production of a printed circuit which is ready for soldering
01/10/1995US5381316 Electronic part assembly using a shape memory alloy element
01/10/1995US5381307 Mounting pad arrangement
01/10/1995US5381306 Method and apparatus for delivering power using a multiplane power via matrix
01/10/1995US5381050 Multi-position electrical connector and electrical devices incorporating same
01/10/1995US5380952 Integrated circuit package with stabilizer bar
01/10/1995US5380806 For flexible printed circuit board
01/10/1995US5380620 Image-forming process
01/10/1995US5380602 Electrical appliance powered by an incorporated rechargeable battery
01/10/1995US5380560 Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition
01/10/1995US5380546 Multilevel metallization process for electronic components
01/10/1995US5380474 Methods for patterned deposition on a substrate
01/10/1995US5380418 Rack bar for releasably holding plate-shaped parts
01/10/1995US5380221 Anchor pin
01/10/1995US5379943 Hot air circulation apparatus and method for wave soldering machines
01/10/1995US5379942 Method for producing a semiconductor modular structure
01/10/1995US5379512 Pressing substrate over conductor with an ultrasonic bonding tool and applying ultrasonic energy
01/10/1995CA2051542C Multi-pulse laser beam generation method and device and laser beam machining method and apparatus using multi-pulse laser beam
01/10/1995CA1333855C Process for the formation of an image
01/05/1995WO1995001086A1 A multiple layer printed circuit board
01/05/1995WO1995000882A1 Soluble, conductive copolymer, the preparation and use thereof
01/05/1995WO1995000363A1 Built-on control device
01/05/1995WO1995000285A1 Solderable anisotropically conductive composition and method of using same
01/05/1995WO1995000279A1 Process and device for metallizing a contact area
01/05/1995DE4424849A1 Conductor track plug-in board for IC sockets
01/05/1995DE4422216A1 Multilayer metallic printed circuit board and a cast component
01/05/1995DE4321390A1 Electrical component
01/04/1995EP0632685A2 Flexible circuit board assembly with common heat spreader and method of manufacture
01/04/1995EP0632684A2 Process for manufacturing metal-ceramic substrate
01/04/1995EP0632683A2 Rigid-flex board with anisotropic interconnect and method of manufacture
01/04/1995EP0632682A1 Compliant lead for surface mounting a chip package to a substrate
01/04/1995EP0632393A1 Hot pluggable motherboard bus connector method
01/04/1995EP0632330A2 A process for forming a photosensitive material and an exposure apparatus used for the process
01/04/1995EP0632146A1 Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
01/04/1995EP0631839A1 Procedure for the realization of an aluminium layer structure on a substrate of alumium nitride
01/04/1995EP0631713A1 Process for soldering printed circuit boards under low pressure.
01/04/1995EP0615679A4 Electronic module assembly.
01/03/1995US5379193 Parallel processor structure and package
01/03/1995US5379189 Electrical assemblies
01/03/1995US5379188 Arrangement for mounting an integrated circuit chip carrier on a printed circuit board
01/03/1995US5379186 Encapsulated electronic component having a heat diffusing layer
01/03/1995US5378869 Method for forming an integrated circuit package with via interconnection
01/03/1995US5378859 Film wiring board
01/03/1995US5378858 Two-layer or multilayer printed circuit board
01/03/1995US5378857 Circuit board
01/03/1995US5378737 Tooth restoration composition, structure and methods
01/03/1995US5378662 Glass, dielectric composition, multilayer wiring substrate, and multilayer ceramic capacitor
01/03/1995US5378658 Patterning process including simultaneous deposition and ion milling
01/03/1995US5378657 Method for making an aluminum clad leadframe and a semiconductor device employing the same
01/03/1995US5378583 Exposure and development with thinning of sheets to form patterns
01/03/1995US5378581 Integrated circuits
01/03/1995US5378508 Laser direct writing
01/03/1995US5378507 Smoothness
01/03/1995US5378405 Surface comprising ionic conductive material formed from electrolyte base polymer and ionic salt; antistatic
01/03/1995US5378314 Nonmetal material with metal layers with apertures, etching passageways
01/03/1995US5378313 Hybrid circuits and a method of manufacture
01/03/1995US5378310 Chromium barrier prevents copper diffusion and side etching
01/03/1995US5378307 Fluid treatment apparatus
01/03/1995US5378306 Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
01/03/1995US5378298 Radiation sensitive adhesive composition and method of photoimagingsame
01/03/1995US5378160 Compliant stacking connector for printed circuit boards
01/03/1995US5378158 Light emitting diode and socket assembly
01/03/1995US5378090 Adapter for drilling machines
01/03/1995US5377961 Electrodynamic pump for dispensing molten solder
01/03/1995US5377902 Method of making solder interconnection arrays
01/03/1995US5377425 Vacuum drying apparatus
01/03/1995US5377406 Process for producing a printed circuit board
01/03/1995US5377404 Method for fabricating a multi-layer printed circuit board
12/1994
12/29/1994CA2126807A1 Process for producing aluminized structures on an aluminium nitride substrate
12/28/1994EP0631461A1 Electronic circuit device
12/28/1994EP0631460A2 Printed circuit board
12/28/1994EP0631314A1 Multiple-metal-level integrated device and fabrication process thereof
12/28/1994EP0631312A1 Single inline package
12/28/1994EP0631311A2 Pinned ceramic chip carrier
12/28/1994EP0631303A2 Method for fabricating multilayer circuits
12/28/1994EP0631098A1 Continuous dryer for plane-shaped articles, and coating apparatus incorporating such a continuous dryer
12/28/1994EP0630952A1 Method for bonding substrates with silicone rubber
12/28/1994EP0549619B1 Process for manufacturing circuits
12/28/1994CN1096744A Process for manufacture by endothermic heating of plastic laminates in a continuous band pressed in cycles
12/27/1994US5377124 Field programmable printed circuit board
12/27/1994US5377081 Surface mountable electronic part
12/27/1994US5377079 Electronic device and its production method
12/27/1994US5376759 Multiple layer printed circuit board
12/27/1994US5376746 Acrylic adhesive composition and organoboron initiator system
12/27/1994US5376586 Method of curing thin films of organic dielectric material
12/27/1994US5376584 Process of making pad structure for solder ball limiting metallurgy having reduced edge stress
12/27/1994US5376502 Photogenerated conducting organic polymers
12/27/1994US5376414 Expansion compensated precision extrusion method
12/27/1994US5376404 Passing board through nip rolls at least one of which is coated with liquid varnish transferred from applicator roll at specified viscosity and thickness
12/27/1994US5376403 Blend of solder powder, blocked crosslinking agent with fluxing properties and a reactive monomer or polymer
12/27/1994US5376326 Methods for making multilayer printed circuit boards
12/27/1994US5376248 Direct metallization process
12/27/1994US5376236 Oxidized titanium forms a complex in etchant; when concentration reaches solubility limit, it precipitates and forms film on surface
12/27/1994US5376232 Method of manufacturing a printed circuit board
12/27/1994US5376189 Composition and process for treatment of metallic surfaces
12/27/1994US5376183 Method for cleaning industrial and domestic articles and surfaces contaminated with organic or lipophilic wastes
12/27/1994US5376026 Method of mounting a tab type male terminal and an assembly of tab type male terminals