Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1994
11/17/1994EP0624261A1 Process for preparing photohardenable elastomeric element having increased exposure latitude
11/17/1994EP0574451B1 Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements
11/17/1994DE4416660A1 Verfahren zum Abscheiden eines Metalls auf einem Substrat aus einem Galvanisierbad A method for depositing a metal on a substrate from a plating bath
11/16/1994CN2183069Y Pneumatic device for introducing integrated circuit
11/16/1994CN2183068Y Electric control arrangement for hot wind processing machine
11/16/1994CN1095016A Process for the production of plastic laminates with metal laminae, especiall for printed circuits using double-band laminae
11/16/1994CN1026647C Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a ...
11/15/1994US5365403 Packaging electrical components
11/15/1994US5365268 Circuit board of solid-state image sensor for electronic endoscope
11/15/1994US5365203 Delay line device and method of manufacturing the same
11/15/1994US5364737 Latex binder polymer with carboxylic acid and unsaturated monomers, photoinitiators and polyether polyurethane thickener
11/15/1994US5364736 Solder masks for printed circuits
11/15/1994US5364707 Metal-film laminate resistant to delamination
11/15/1994US5364705 Hybrid resistance cards and methods for manufacturing same
11/15/1994US5364703 Copper-clad polyetherimide laminates with high peel strength
11/15/1994US5364493 Metal substrate with metal foil, masking and etching, light
11/15/1994US5364474 Spray cleaning while rotating workpiece surface to adjust impact velocity; electronics, integrated circuits
11/15/1994US5364460 Electroless gold plating bath
11/15/1994US5364280 Printed circuit board connector assembly
11/15/1994US5364225 Method of printed circuit panel manufacture
11/15/1994US5364011 Micro soldering system for electronic components
11/15/1994US5363553 Preetching
11/15/1994US5363551 Method and apparatus for mounting components with angled terminals
11/10/1994WO1994026085A1 Improvements relating to component mounting arrangements
11/10/1994WO1994026082A1 Process for throughplating printed circuit boards using conductive plastics for direct plating
11/10/1994WO1994026081A1 Process for producing printed circuit boards
11/10/1994WO1994026023A1 Self-shielding microstrip assembly
11/10/1994WO1994025984A1 Ic package and method of its manufacture
11/10/1994WO1994025976A1 Method of making field emission tips using physical vapor deposition of random nuclei as etch mask
11/10/1994WO1994025518A1 Surface mount conductive adhesives
11/10/1994WO1994025320A1 Electro-hydraulic pressure regulating device
11/10/1994WO1994025276A1 Printing screen and method for printing a variable thickness pattern
11/10/1994DE4314665A1 Circuit arrangement
11/09/1994EP0624054A2 Printed circuit boards
11/09/1994EP0624053A2 Mounting device and method of connecting miniaturized electronic components by bump connections
11/09/1994EP0623954A1 Molded plastic packaging of electronic devices
11/09/1994EP0623852A1 Resist compositions for circuit boards
11/09/1994EP0494153B1 Compound arrangement with printed circuit board
11/09/1994EP0469920B1 Method of manufacturing insulated substrate for semiconductor devices and patterned metal plate used therefor
11/09/1994CN2182513Y Automatic mounting machine for integrated circuit
11/09/1994CN2182512Y Setup device for integrated circuit use
11/08/1994US5363280 Printed circuit board or card thermal mass design
11/08/1994US5363278 Surface of ceramic substrate oxidized prior to bonding
11/08/1994US5363277 Structure and method for mounting semiconductor device
11/08/1994US5363275 Modular component computer system
11/08/1994US5363274 Memory card
11/08/1994US5362985 Packaged integrated circuit add-on card and method of manufacture
11/08/1994US5362940 Use of Fresnel zone plates for material processing
11/08/1994US5362679 Plastic package with solder grid array
11/08/1994US5362551 Crystallized glass with through-hole filled with copper; high density circuit boards
11/08/1994US5362550 Thin film circuit board and its manufacturing process
11/08/1994US5362547 Film carrier
11/08/1994US5362534 Multiple layer printed circuit boards and method of manufacture
11/08/1994US5362513 Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same
11/08/1994US5362421 Curable epoxy resin, organometallic complex salt initiator
11/08/1994US5362359 Circuit board and process for producing same
11/08/1994US5362334 Composition and process for treatment of metallic surfaces
11/08/1994US5361969 Gas shrouded wave improvement
11/08/1994US5361967 Monolithic circuit fabrication method
11/08/1994US5361966 Solder-bonded structure
11/08/1994US5361963 Dispenser
11/08/1994US5361789 Washing/drying method and apparatus
11/08/1994US5361695 Screen printing plate for limiting the spread of ink on an object
11/08/1994US5361491 Process for producing an IC-mounting flexible circuit board
11/08/1994CA1332895C Metallized polymers and method
11/08/1994CA1332890C Mass soldering system providing an improved fluid blast
11/08/1994CA1332885C Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
11/03/1994DE4313006A1 Electrical conductor track made of metal
11/02/1994EP0622981A1 Wiring board for electrical tests and method of manufacturing the same
11/02/1994EP0622980A1 Method for mounting electronic component on a flexible printed circuit board
11/02/1994EP0622866A2 Electrical interconnect system
11/02/1994EP0622847A2 Three dimensional package and architecture for high performance computer
11/02/1994EP0622838A1 Method of making an article comprising solder bump bonding
11/02/1994EP0622235A2 Reliable contact pad arrangement on plastic print cartridge
11/02/1994EP0622193A2 An improved unitary interconnect system for an inkjet printer
11/02/1994EP0622151A1 An Article comprising a pb-free solder having improved mechanical properties
11/02/1994EP0622129A2 Dual jet spray cleaner
11/02/1994EP0622125A1 Fluid treatment apparatus
11/02/1994EP0621907A1 Method for cleaning articles
11/02/1994EP0489759B1 Process for producing a plated-through printed circuit board
11/02/1994EP0472653B1 Preparation of cyano-containing perfluoropolymers having iodine curesites
11/01/1994US5360946 Flex tape protective coating
11/01/1994US5360943 Electrical connection structure
11/01/1994US5360672 Press rolling a copolylactone
11/01/1994US5360508 Applying apparatus
11/01/1994US5360471 Electroless solder plating bath
11/01/1994US5360146 Liquid dispenser plunger
11/01/1994US5359928 Method for preparing and using a screen printing stencil having raised edges
11/01/1994US5359768 Method for mounting very small integrated circuit package on PCB
11/01/1994US5359767 Method of making multilayered circuit board
11/01/1994CA1332849C Three dimensionally interconnected module assembly
11/01/1994CA1332817C Electroplating process
10/1994
10/27/1994WO1994024838A1 Contacting of electrically conducting films in a film system
10/27/1994WO1994024730A1 Hold-down element for electrical and/or electronic components
10/27/1994WO1994024705A1 Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device
10/27/1994WO1994024704A1 Area bonding conductive adhesive preforms
10/27/1994WO1994024693A1 Method and apparatus for making printed circuit boards
10/27/1994WO1994023888A1 Non lead soldering in a substantially oxygen free atmosphere
10/27/1994WO1994021097A3 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
10/27/1994DE4313389A1 Multilayer printed circuit board