Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/17/1994 | EP0624261A1 Process for preparing photohardenable elastomeric element having increased exposure latitude |
11/17/1994 | EP0574451B1 Device for screening off lines of electric flux in an installation for electrolytically processing essentially flat elements |
11/17/1994 | DE4416660A1 Verfahren zum Abscheiden eines Metalls auf einem Substrat aus einem Galvanisierbad A method for depositing a metal on a substrate from a plating bath |
11/16/1994 | CN2183069Y Pneumatic device for introducing integrated circuit |
11/16/1994 | CN2183068Y Electric control arrangement for hot wind processing machine |
11/16/1994 | CN1095016A Process for the production of plastic laminates with metal laminae, especiall for printed circuits using double-band laminae |
11/16/1994 | CN1026647C Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a ... |
11/15/1994 | US5365403 Packaging electrical components |
11/15/1994 | US5365268 Circuit board of solid-state image sensor for electronic endoscope |
11/15/1994 | US5365203 Delay line device and method of manufacturing the same |
11/15/1994 | US5364737 Latex binder polymer with carboxylic acid and unsaturated monomers, photoinitiators and polyether polyurethane thickener |
11/15/1994 | US5364736 Solder masks for printed circuits |
11/15/1994 | US5364707 Metal-film laminate resistant to delamination |
11/15/1994 | US5364705 Hybrid resistance cards and methods for manufacturing same |
11/15/1994 | US5364703 Copper-clad polyetherimide laminates with high peel strength |
11/15/1994 | US5364493 Metal substrate with metal foil, masking and etching, light |
11/15/1994 | US5364474 Spray cleaning while rotating workpiece surface to adjust impact velocity; electronics, integrated circuits |
11/15/1994 | US5364460 Electroless gold plating bath |
11/15/1994 | US5364280 Printed circuit board connector assembly |
11/15/1994 | US5364225 Method of printed circuit panel manufacture |
11/15/1994 | US5364011 Micro soldering system for electronic components |
11/15/1994 | US5363553 Preetching |
11/15/1994 | US5363551 Method and apparatus for mounting components with angled terminals |
11/10/1994 | WO1994026085A1 Improvements relating to component mounting arrangements |
11/10/1994 | WO1994026082A1 Process for throughplating printed circuit boards using conductive plastics for direct plating |
11/10/1994 | WO1994026081A1 Process for producing printed circuit boards |
11/10/1994 | WO1994026023A1 Self-shielding microstrip assembly |
11/10/1994 | WO1994025984A1 Ic package and method of its manufacture |
11/10/1994 | WO1994025976A1 Method of making field emission tips using physical vapor deposition of random nuclei as etch mask |
11/10/1994 | WO1994025518A1 Surface mount conductive adhesives |
11/10/1994 | WO1994025320A1 Electro-hydraulic pressure regulating device |
11/10/1994 | WO1994025276A1 Printing screen and method for printing a variable thickness pattern |
11/10/1994 | DE4314665A1 Circuit arrangement |
11/09/1994 | EP0624054A2 Printed circuit boards |
11/09/1994 | EP0624053A2 Mounting device and method of connecting miniaturized electronic components by bump connections |
11/09/1994 | EP0623954A1 Molded plastic packaging of electronic devices |
11/09/1994 | EP0623852A1 Resist compositions for circuit boards |
11/09/1994 | EP0494153B1 Compound arrangement with printed circuit board |
11/09/1994 | EP0469920B1 Method of manufacturing insulated substrate for semiconductor devices and patterned metal plate used therefor |
11/09/1994 | CN2182513Y Automatic mounting machine for integrated circuit |
11/09/1994 | CN2182512Y Setup device for integrated circuit use |
11/08/1994 | US5363280 Printed circuit board or card thermal mass design |
11/08/1994 | US5363278 Surface of ceramic substrate oxidized prior to bonding |
11/08/1994 | US5363277 Structure and method for mounting semiconductor device |
11/08/1994 | US5363275 Modular component computer system |
11/08/1994 | US5363274 Memory card |
11/08/1994 | US5362985 Packaged integrated circuit add-on card and method of manufacture |
11/08/1994 | US5362940 Use of Fresnel zone plates for material processing |
11/08/1994 | US5362679 Plastic package with solder grid array |
11/08/1994 | US5362551 Crystallized glass with through-hole filled with copper; high density circuit boards |
11/08/1994 | US5362550 Thin film circuit board and its manufacturing process |
11/08/1994 | US5362547 Film carrier |
11/08/1994 | US5362534 Multiple layer printed circuit boards and method of manufacture |
11/08/1994 | US5362513 Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same |
11/08/1994 | US5362421 Curable epoxy resin, organometallic complex salt initiator |
11/08/1994 | US5362359 Circuit board and process for producing same |
11/08/1994 | US5362334 Composition and process for treatment of metallic surfaces |
11/08/1994 | US5361969 Gas shrouded wave improvement |
11/08/1994 | US5361967 Monolithic circuit fabrication method |
11/08/1994 | US5361966 Solder-bonded structure |
11/08/1994 | US5361963 Dispenser |
11/08/1994 | US5361789 Washing/drying method and apparatus |
11/08/1994 | US5361695 Screen printing plate for limiting the spread of ink on an object |
11/08/1994 | US5361491 Process for producing an IC-mounting flexible circuit board |
11/08/1994 | CA1332895C Metallized polymers and method |
11/08/1994 | CA1332890C Mass soldering system providing an improved fluid blast |
11/08/1994 | CA1332885C Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
11/03/1994 | DE4313006A1 Electrical conductor track made of metal |
11/02/1994 | EP0622981A1 Wiring board for electrical tests and method of manufacturing the same |
11/02/1994 | EP0622980A1 Method for mounting electronic component on a flexible printed circuit board |
11/02/1994 | EP0622866A2 Electrical interconnect system |
11/02/1994 | EP0622847A2 Three dimensional package and architecture for high performance computer |
11/02/1994 | EP0622838A1 Method of making an article comprising solder bump bonding |
11/02/1994 | EP0622235A2 Reliable contact pad arrangement on plastic print cartridge |
11/02/1994 | EP0622193A2 An improved unitary interconnect system for an inkjet printer |
11/02/1994 | EP0622151A1 An Article comprising a pb-free solder having improved mechanical properties |
11/02/1994 | EP0622129A2 Dual jet spray cleaner |
11/02/1994 | EP0622125A1 Fluid treatment apparatus |
11/02/1994 | EP0621907A1 Method for cleaning articles |
11/02/1994 | EP0489759B1 Process for producing a plated-through printed circuit board |
11/02/1994 | EP0472653B1 Preparation of cyano-containing perfluoropolymers having iodine curesites |
11/01/1994 | US5360946 Flex tape protective coating |
11/01/1994 | US5360943 Electrical connection structure |
11/01/1994 | US5360672 Press rolling a copolylactone |
11/01/1994 | US5360508 Applying apparatus |
11/01/1994 | US5360471 Electroless solder plating bath |
11/01/1994 | US5360146 Liquid dispenser plunger |
11/01/1994 | US5359928 Method for preparing and using a screen printing stencil having raised edges |
11/01/1994 | US5359768 Method for mounting very small integrated circuit package on PCB |
11/01/1994 | US5359767 Method of making multilayered circuit board |
11/01/1994 | CA1332849C Three dimensionally interconnected module assembly |
11/01/1994 | CA1332817C Electroplating process |
10/27/1994 | WO1994024838A1 Contacting of electrically conducting films in a film system |
10/27/1994 | WO1994024730A1 Hold-down element for electrical and/or electronic components |
10/27/1994 | WO1994024705A1 Metal sheet processing method and lead frame processing method, and lead frame and semiconductor device manufacturing method and semiconductor device |
10/27/1994 | WO1994024704A1 Area bonding conductive adhesive preforms |
10/27/1994 | WO1994024693A1 Method and apparatus for making printed circuit boards |
10/27/1994 | WO1994023888A1 Non lead soldering in a substantially oxygen free atmosphere |
10/27/1994 | WO1994021097A3 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
10/27/1994 | DE4313389A1 Multilayer printed circuit board |