Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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12/07/1994 | EP0627499A1 Agent for treating surfaces of copper and copper alloys |
12/07/1994 | EP0627467A1 A platinum catalyst and a curable organopolysiloxane composition containing said platinum catalyst |
12/07/1994 | EP0627021A1 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process. |
12/07/1994 | EP0572540A4 Arrangement for driving a rotary tool. |
12/07/1994 | EP0557278B1 A method of making a multilayer thin film structure |
12/07/1994 | EP0525060B1 Miniature multiple conductor electrical connector |
12/07/1994 | EP0418333B1 Composition and method for stripping tin or tin-lead alloy from copper surfaces |
12/07/1994 | CN2184526Y Automatic precision cutter for laminar materials |
12/06/1994 | US5371653 Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus |
12/06/1994 | US5371407 Electronic circuit with diamond substrate and conductive vias |
12/06/1994 | US5371328 Component rework |
12/06/1994 | US5371327 Heat-sealable connector sheet |
12/06/1994 | US5371324 Lightweight, noncorrosive and excellent electroconductivity; used for telephones, electrostatic copying machine, printers, electronic calculators, video tapes, and electronic ranges |
12/06/1994 | US5371175 Heat resistance, bonding strength |
12/06/1994 | US5371118 Two-component film-forming reactive system for bonding and coating substrates |
12/06/1994 | US5371029 Process for making a leadless chip resistor capacitor carrier using thick and thin film printing |
12/06/1994 | US5370971 Epoxy based photopolymerizable composition |
12/06/1994 | US5370766 Forming conductive layer on substrate, forming patterned dielectric layer thereon, formed patterned thin film conductor above the dielectric layer to provide inductor |
12/06/1994 | US5370745 Apparatus for performing related operations on workpieces |
12/06/1994 | US5370540 Circuit board connector and a board using the same |
12/06/1994 | US5370297 Soldering apparatus |
12/06/1994 | US5369881 Method of forming circuit wiring pattern |
12/06/1994 | US5369880 Method for forming solder deposit on a substrate |
11/30/1994 | EP0626702A1 Flat cable |
11/30/1994 | EP0626259A1 Printer system for printing circuit patterns or like on base board |
11/30/1994 | EP0626226A1 Apparatus for continuously soldering the connections of electronic circuits |
11/30/1994 | EP0626125A1 Process and apparatus for printing a printed circuit board. |
11/30/1994 | EP0626124A1 High density conductive networks and method and apparatus for making same |
11/30/1994 | EP0626019A1 Method of producing a metal film |
11/30/1994 | EP0413808B1 Control arrangement for a seat heater |
11/30/1994 | EP0331718B1 Multiple electrode plasma reactor power distribution system |
11/30/1994 | CN1095848A Magnetic head unit |
11/30/1994 | CN1095693A Method of cleaning waste water and recovery of contaminants therefrom |
11/29/1994 | US5369551 Surface mount stress relief interface system and method |
11/29/1994 | US5369491 Method for measuring the reciprocal displacement of the layers of a multilayer arrangement and apparatus for performing this method |
11/29/1994 | US5369219 Multi-layer printed circuit board apparatus and method for making same |
11/29/1994 | US5369058 Warp-resistent ultra-thin integrated circuit package fabrication method |
11/29/1994 | US5369056 Thinning by removal of casings, supporting and thinning |
11/29/1994 | US5368922 Prepreg of thermoplastic polymer particles in liquid thermosettable resin |
11/29/1994 | US5368902 Method for making patterned thin film |
11/29/1994 | US5368899 Automatic vertical dip coater with simultaneous ultraviolet cure |
11/29/1994 | US5368884 Method of forming solder mask |
11/29/1994 | US5368883 Method and stencil design for printing non-planar hybrid circuits |
11/29/1994 | US5368814 Lead free, tin-bismuth solder alloys |
11/29/1994 | US5368717 Metallization of electronic insulators |
11/29/1994 | US5368674 Method of treating glass fiber-based prepreg |
11/29/1994 | US5368643 Coating apparatus for boards |
11/29/1994 | US5368491 High density electrical connector |
11/29/1994 | US5368222 Wavesoldering device and procedure |
11/29/1994 | US5368220 Sealed conductive active alloy feedthroughs |
11/29/1994 | US5368219 Method and apparatus for applying solder flux to a printed circuit |
11/29/1994 | US5367764 Method of making a multi-layer circuit assembly |
11/24/1994 | WO1994027421A1 Electrical interconnect apparatus |
11/24/1994 | WO1994027319A1 Power semiconductor device with stress buffer layer |
11/24/1994 | WO1994027190A1 Process and device for coating printed circuit boards |
11/24/1994 | WO1994027189A1 Process and device for coating printed circuit boards |
11/24/1994 | WO1994027188A1 Device for masking substrates to be processed |
11/24/1994 | WO1994026958A1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
11/24/1994 | WO1994026954A1 Palladium layers deposition process |
11/24/1994 | WO1994026950A1 Metallic films and articles using same |
11/24/1994 | WO1994026864A1 Cleaning agent, cleaning method and cleaning apparatus |
11/24/1994 | WO1994026518A1 Clamping-stretching system for stencils for screen printers, with printing table for pc boards |
11/24/1994 | WO1994026495A1 Apparatus and process for the production of fine line metal traces |
11/24/1994 | WO1994026466A1 High speed drill bit quality and position control |
11/24/1994 | WO1994026422A1 Metalized coating process |
11/24/1994 | CA2162905A1 Carbon compositions and processes for preparing a non-conductive substrate for electroplating |
11/24/1994 | CA2162714A1 Process and apparatus for coating printed circuit boards |
11/24/1994 | CA2162712A1 Process and apparatus for coating printed circuit boards |
11/24/1994 | CA2162473A1 Metallic films and articles using same |
11/23/1994 | EP0625590A1 Improvement of adhesion of metal coatings to resinous articles |
11/23/1994 | EP0625537A1 Adhesives for electroless plating and printed circuit boards |
11/23/1994 | EP0625402A1 Suspension for coating substrates with thin solder layers |
11/23/1994 | EP0555407A4 Stacked configuration for integrated circuit devices |
11/22/1994 | USRE34794 Gull-wing zig-zag inline lead package having end-of-package anchoring pins |
11/22/1994 | US5367435 Electronic package structure and method of making same |
11/22/1994 | US5367253 Clamped carrier for testing of semiconductor dies |
11/22/1994 | US5367195 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
11/22/1994 | US5367192 Package for integrated devices |
11/22/1994 | US5367124 Compliant lead for surface mounting a chip package to a substrate |
11/22/1994 | US5367006 Superior thermal transfer adhesive |
11/22/1994 | US5366846 Crosslinking agents and compositions for photoresists |
11/22/1994 | US5366814 Copper foil for printed circuits and process for producing the same |
11/22/1994 | US5366664 Electromagnetic shielding materials |
11/22/1994 | US5366588 Method of manufacturing an electrically conductive pattern of tin-doped indium oxide (ITO) on a substrate |
11/22/1994 | US5366389 Connector peg holdown |
11/22/1994 | US5366381 Electrical connector with antirotation feature |
11/22/1994 | US5366380 Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
11/22/1994 | US5366140 Patterned array of uniform metal microbeads |
11/22/1994 | US5366027 Circuit board having a bonded metal support |
11/22/1994 | US5365656 Surface mount assembly of devices using AdCon interconnections |
11/22/1994 | CA2031562C Three-dimensional printing techniques |
11/17/1994 | EP0625001A2 Process for image-wise metallising structured printed circuit boards |
11/17/1994 | EP0624921A1 Electrical connection arrangement and associated process of manufacture |
11/17/1994 | EP0624904A2 A multi-layer wiring board and a manufacturing method thereof |
11/17/1994 | EP0624902A1 Thixotropic conductive paste |
11/17/1994 | EP0624826A1 Method of forming relief patterns by i-line light irradiation |
11/17/1994 | EP0624824A1 Resist ink composition and cured article prepared therefrom |
11/17/1994 | EP0624416A2 Method and apparatus for assessing and restoring solderability |
11/17/1994 | EP0624405A1 Megasonic cleaning system using compressed, condensed gases |
11/17/1994 | EP0624305A1 Carrier strip head interconnect assembly |