H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1994
12/27/1994	US5375517 Method and apparatus for screen printing
12/27/1994	US5375322 Method of manufacturing circuit board having lateral conductive pattern
12/27/1994	US5375321 Selectively etching one side of double-clad, dielectric substrate to form connectors subsequently positioned near the bottom of the grooves by folding and pressing
12/24/1994	WO1994029093A1 Process for manufacture by endothermic heating of plastic laminates in a continuous band pressed in cycles
12/23/1994	CA2126278A1 Continuous drier for board-shaped piece material and coating installation comprising such a continuous drier
12/22/1994	WO1994030034A1 Method of electrical connection and electric circuit mounting board, and paste for executing the method
12/22/1994	WO1994029900A1 Heat dissipative means for integrated circuit chip package
12/22/1994	WO1994029897A1 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
12/22/1994	WO1994029887A1 Molded electric part and its manufacture
12/22/1994	WO1994029397A1 Electrically conductive adhesive compositions
12/22/1994	WO1994029115A1 Method of producing patterns on objects, especially ceramic articles
12/22/1994	WO1994029038A1 Method for degreasing solid objects
12/22/1994	DE4419874A1 Alkalilösliches Harz und Harzzusammensetzung Alkali-soluble resin and resin composition
12/22/1994	CA2162499A1 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
12/21/1994	EP0630176A1 Electrical assembly
12/21/1994	EP0630174A1 High-density packaging for multiple removable electronics subassemblies
12/21/1994	EP0630173A2 Process for preparing printed circuit board
12/21/1994	EP0630072A2 Anchor pin
12/21/1994	EP0629595A2 Hot pressing ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates
12/21/1994	EP0629467A1 Lead free, tin-bismuth solder alloys
12/21/1994	EP0629466A1 High temperature, lead-free, tin based solder composition
12/21/1994	EP0629465A1 Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium
12/21/1994	EP0629464A1 Lead-free, tin, antimony, bismuth, copper solder alloy
12/21/1994	EP0629463A1 Lead-free, high-temperature, tin based multi-component solder
12/21/1994	EP0605712A4 Packaging electrical components.
12/21/1994	EP0423190B1 Metallized polymers and method
12/21/1994	CN1096623A Jig for detecting warp of pringed circuit board and method of producing printed circuit board
12/20/1994	US5375039 Circuit board heat dissipation layering arrangement
12/20/1994	US5375035 Capacitor mounting structure for printed circuit boards
12/20/1994	US5375003 Method of connecting a tab film and a liquid crystal display panel
12/20/1994	US5374848 Thermal stress resistant semiconductor device mounting arrangement
12/20/1994	US5374788 Printed wiring board and manufacturing method therefor
12/20/1994	US5374500 Positive photoresist composition containing photoacid generator and use thereof
12/20/1994	US5374469 Flexible printed substrate
12/20/1994	US5374454 Method for conditioning halogenated polymeric materials and structures fabricated therewith
12/20/1994	US5374453 Particulate filled composite film and method of making same
12/20/1994	US5374346 Dissolving metal surface underlying semiconductor coating; removing coating by high pressure water spray
12/20/1994	US5374344 Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate
12/20/1994	US5374338 Selective electroetch of copper and other metals
12/20/1994	US5374331 Preflux coating method
12/20/1994	US5374196 High-density/long-via laminated connector
12/20/1994	US5373985 Upward soldering method
12/20/1994	US5373984 Reflow process for mixed technology on a printed wiring board
12/20/1994	US5373786 Metal mask plate for screen printing
12/20/1994	US5373629 Through-hole plate printed circuit board with resist and process for manufacturing same
12/20/1994	US5373628 Automatic wiring method
12/20/1994	US5373626 For use in positioning pins to be affixed to a substrate
12/20/1994	US5373625 Method for making thermal heads
12/20/1994	CA1333578C Production of metallic patterns
12/15/1994	DE4420060A1 Stripline filter
12/15/1994	DE4331185C1 Method for filling contact holes in a semiconductor layer structure
12/15/1994	DE4319563A1 Arrangement for the wave soldering of a printed circuit board to be soldered
12/15/1994	DE4319046A1 Supporting frame for printed circuit boards
12/14/1994	EP0629110A2 Method of forming conductive pattern on substrate
12/14/1994	EP0629109A1 Method of drilling a hole for printed wiring board
12/14/1994	EP0629108A1 Supply distribution bus bar for component support, the component support and distribution strips for joining the busbar with the support
12/14/1994	EP0629107A2 Multiple wiring and X section printed circuit board technique
12/14/1994	EP0628999A1 Sealed feedthrough for a thickfilm ceramic substrate and method of making the same
12/14/1994	EP0628615A1 Method for coating using molten organosiloxane compositions
12/14/1994	EP0628180A1 Pliable, aqueous processable, photoimageable permanent coatings for printed circuits
12/13/1994	US5373418 Electrical device for mounting electrical components with enhanced thermal radiating properties
12/13/1994	US5373276 Self centering coil
12/13/1994	US5373187 Package body for integrated circuit
12/13/1994	US5373114 Circuit substrate
12/13/1994	US5373113 Solder reflow mounting board
12/13/1994	US5373112 Multilayered wiring board having printed inductor
12/13/1994	US5373111 Bond pad having a patterned bonding surface
12/13/1994	US5373110 Multilayer circuit board with repaired I/O pin and process for repairing I/O pin on multilayer circuit board
12/13/1994	US5373108 Dual durometer ribbon and method of manufacture
12/13/1994	US5373101 Electrical interconnect apparatus
12/13/1994	US5373077 Hydrosilation and crosslinking of a mixture of an unsaturated cyclic polysiloxane, a hydrogen-silicon bond-containing organo silicon compound, and an unsaturated hydrocarbon, e.g. dicyclopentadiene; storage stability
12/13/1994	US5372912 Radiation-sensitive resist composition and process for its use
12/13/1994	US5372883 Die attach adhesive film, application method and devices incorporating the same
12/13/1994	US5372872 Multilayer printed circuit board
12/13/1994	US5372848 Process for creating organic polymeric substrate with copper
12/13/1994	US5372699 Method and apparatus for selective electroplating of metals on products
12/13/1994	US5372685 Sputtering chromium layer on polyimide substrate followed by layer of copper; integrated circuits; improved adhesion
12/13/1994	US5372670 System for wet application of a dry film to a panel
12/13/1994	US5372666 Method of manufacturing a multilayered circuit board
12/13/1994	US5372512 Electrical interconnect system for a flexible circuit
12/08/1994	WO1994028602A1 Connector assembly
12/08/1994	WO1994028598A1 Planar cable array
12/08/1994	WO1994028597A1 Electrical interconnect assembly
12/08/1994	WO1994028580A1 Solder ball feeder
12/08/1994	WO1994028459A1 Electrical connection of devices incorporating multiple liquid crystal cells
12/08/1994	WO1994028196A1 Multiple solvent cleaning system
12/08/1994	WO1994028046A1 Thermally cross-linkable heat-sealing adhesive
12/08/1994	WO1994027777A1 Tin-bismuth solder paste and method of use
12/08/1994	DE4419521A1 Alignment method and device for an exposure process
12/08/1994	DE4418453A1 Device for producing printed circuit board assemblies
12/08/1994	DE4417633A1 Mesh pressure device
12/08/1994	CA2163756A1 A thermally crosslinkable heat-sealing adhesive
12/08/1994	CA2163531A1 Connector assembly
12/08/1994	CA2163351A1 Multiple solvent cleaning system
12/07/1994	EP0627875A1 Process for manufacturing metal-ceramic substrate
12/07/1994	EP0627874A1 Process for making through-hole connections in printed circuit boards
12/07/1994	EP0627873A1 Expansion compensated precision extrusion apparatus and method
12/07/1994	EP0627872A2 Process for manufacturing metallized ceramic substrates
12/07/1994	EP0627760A1 Subdivisible substrate and method of making the same
12/07/1994	EP0627500A1 Defluxing agent, cleaning method and cleaning apparatus

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