| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/20/1995 | CA2111124A1 Hydrogen assisted reduced oxide soldering system |
| 02/18/1995 | CA2130134A1 Adhesion promoting additives and low temperature curing organosiloxane compositions containing same |
| 02/16/1995 | WO1995005061A2 Method for producing a conductive circuit |
| 02/16/1995 | WO1995005005A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 02/16/1995 | DE4426109A1 Laser drawing apparatus |
| 02/16/1995 | DE4426107A1 Laser drawing apparatus |
| 02/16/1995 | DE4425803A1 Printed circuit board |
| 02/16/1995 | DE4327099A1 Coupling element for the connection of microstrip lines (striplines) which are routed on film |
| 02/15/1995 | EP0748261A4 Layered chip structure |
| 02/15/1995 | EP0639043A1 Process for manufacturing plated through-hole printed circuit boards having very small solder lands |
| 02/15/1995 | EP0639042A1 A printed circuit board with a coverlay film |
| 02/15/1995 | EP0638931A2 Multi-chip module |
| 02/15/1995 | EP0638926A1 Process of fabricating semiconductor unit employing bumps to bond two components |
| 02/15/1995 | EP0638924A1 Process for fabricating TAB tape carriers |
| 02/15/1995 | EP0638669A1 Electroplating process and composition |
| 02/15/1995 | EP0638656A1 Alloy to be plated, its plating method and plating solution |
| 02/15/1995 | EP0638225A1 Feedthrough via connection method and apparatus |
| 02/15/1995 | EP0638094A1 Concentration of fluoropolymer dispersions using acrylic polymers of high acid content. |
| 02/15/1995 | EP0638001A1 Ultrasonic spray coating system and method |
| 02/15/1995 | CN1098820A Wire dispensing board for electric test and manufacture of same |
| 02/14/1995 | US5390080 Tin-zinc solder connection to a printed circuit board of the like |
| 02/14/1995 | US5390079 Tape carrier package |
| 02/14/1995 | US5390078 Apparatus for using an active circuit board as a heat sink |
| 02/14/1995 | US5390025 Method of locating work in automatic exposing apparatus |
| 02/14/1995 | US5389743 Rivet design for enhanced copper thick-film I/O pad adhesion |
| 02/14/1995 | US5389573 Method of making narrow metal electrode |
| 02/14/1995 | US5389497 Method for forming patterned solder mask |
| 02/14/1995 | US5389496 Processes and compositions for electroless metallization |
| 02/14/1995 | US5389495 Waterborne photoresists having non-ionic fluorocarbon surfactants |
| 02/14/1995 | US5389446 Having coating layer of chromium oxide, nickel and either or both of zinc and zinc oxide |
| 02/14/1995 | US5389408 Method for curing metal particles into continuous conductors |
| 02/14/1995 | US5389270 Composition and process for preparing a non-conductive substrate for electroplating |
| 02/14/1995 | US5389191 Mounting apparatus for deploying an electronic component mounts formed on a tape carrier |
| 02/14/1995 | US5389160 Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
| 02/14/1995 | US5389148 Spray apparatus utilizing porous sheet |
| 02/14/1995 | US5389010 Connector for electrical components |
| 02/14/1995 | US5388754 Method utilizing water soluble masking formulation for producing an article |
| 02/14/1995 | US5388752 Method and apparatus for soldering a workpiece in a non-oxidizing gas atmosphere |
| 02/14/1995 | US5388509 Method for making a printing screen and printing a variable thichness pattern |
| 02/14/1995 | US5388468 Solder wave parameters analyzer |
| 02/14/1995 | US5388328 Process for fabricating an interconnected multilayer board |
| 02/14/1995 | US5388327 Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package |
| 02/14/1995 | CA1334457C Protective coating for an electrical or electronic circuit |
| 02/09/1995 | WO1995004392A1 Multi-position electrical connector and electrical devices incorporating same |
| 02/09/1995 | WO1995004391A1 Connector device for electrically interconnecting printed circuit board like members |
| 02/09/1995 | WO1995004387A1 An electrical connecting structure and a method for electrically connecting terminals to each other |
| 02/09/1995 | WO1995004370A1 Method for electrodeposition of photosensitive resist |
| 02/09/1995 | WO1995004356A1 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
| 02/09/1995 | WO1995004286A1 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly |
| 02/09/1995 | WO1995004103A1 Process for treating plastic surfaces and swelling solution |
| 02/09/1995 | WO1995004100A1 Thermoplastic polyimide polymer, thermoplastic polyimide film, polyimide laminate, and process for producing the laminate |
| 02/09/1995 | DE4417586A1 Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern Family of removable hybrid arrays of different sizes with microwave bandwidth connectors |
| 02/09/1995 | DE4416962A1 Gerät zum Schneiden von Verdrahtungen bzw. Leiterbahnen Device for cutting wires or traces |
| 02/09/1995 | DE4326506A1 Electrical appliance, in particular a switching device or controller for motor vehicles |
| 02/09/1995 | DE4326104A1 Electrical assembly |
| 02/09/1995 | DE4325980A1 Device for making common electrical contact between a plurality of units, which can be excited (energised) electrically, of internal combustion engines |
| 02/09/1995 | CA2166996A1 Connector device for electrically interconnecting printed circuit board like members |
| 02/09/1995 | CA2165799A1 Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
| 02/09/1995 | CA2143760A1 Apparatus and method for detecting alignment of contacts in a multi-substrate electronic assembly |
| 02/08/1995 | EP0637902A1 Metallic foil with adhesion promoting layer |
| 02/08/1995 | EP0637828A2 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics of the same |
| 02/08/1995 | EP0637638A1 Tungsten metallization of CVD diamond |
| 02/08/1995 | CN2189374Y High precision universal machine for soldering circuit plate with no oxidation |
| 02/08/1995 | CN1098588A Multilayered metallic printed board and molded module |
| 02/08/1995 | CN1098346A Kinetic solder paste composition |
| 02/07/1995 | US5388029 Semiconductor chip carrier capable of stably mounting a semiconductor chip |
| 02/07/1995 | US5388024 Trapezoid chip capacitor |
| 02/07/1995 | US5387816 Hybrid integrated circuit device |
| 02/07/1995 | US5387762 Resin-packaged electronic component having bent lead terminals |
| 02/07/1995 | US5387495 Coating top surface of substrate with insulating layer of tetrafluoroethylene, depositing conductive seed layer, lines, patterned layer of posts, removing portions of seed layer, depositing liquid fluorinated hydrocarbon dielectric |
| 02/07/1995 | US5387494 Includes a latex binder polymer having carboxylic acid functionality, a photopolymerizable monomer fraction and a photoinitiator |
| 02/07/1995 | US5387493 Fine conductor pattern |
| 02/07/1995 | US5387486 Radiation-polymerizable mixture and process for producing a solder resist mask |
| 02/07/1995 | US5387474 Reducing X-Y shrinkage and distortion on firing |
| 02/07/1995 | US5387444 Ultrasonic method for coating workpieces, preferably using two-part compositions |
| 02/07/1995 | US5387380 Three-dimensional printing techniques |
| 02/07/1995 | US5387361 Etching liquid for aluminium, method of etching aluminium and etched aluminium product |
| 02/07/1995 | US5387332 Cleaner/conditioner for the direct metallization of non-conductors and printed circuit boards |
| 02/07/1995 | US5387306 Manufacturing integrated circuit cards |
| 02/07/1995 | US5387139 Method of making a pin grid array and terminal for use therein |
| 02/07/1995 | US5387137 Electrical connector having a body surrounding the connecting pins |
| 02/07/1995 | US5387112 Versatile terminal members for ribbon cable connectors |
| 02/07/1995 | US5387111 Circuit board assembly |
| 02/07/1995 | US5386641 Taping alignment tool for printed circuit boards |
| 02/07/1995 | US5386627 Method of fabricating a multi-layer integrated circuit chip interposer |
| 02/07/1995 | US5386626 Method for manufacturing a circuit board with a plurality of conductive terminal pins |
| 02/07/1995 | US5386625 Tab type IC assembling method and an IC assembled thereby |
| 02/07/1995 | US5386624 Method for underencapsulating components on circuit supporting substrates |
| 02/07/1995 | CA2001982C Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same |
| 02/03/1995 | CA2117404A1 Method and apparatus for aligning and attaching a surface mount component |
| 02/02/1995 | WO1995003685A1 Semiconductor inner lead bonding tool |
| 02/02/1995 | WO1995003684A1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprising same |
| 02/02/1995 | WO1995003683A1 Space-saving memory module |
| 02/02/1995 | WO1995003168A1 Circuit board material with barrier layer |
| 02/02/1995 | WO1995003152A1 Shaped lead structure and method |
| 02/02/1995 | DE4325661A1 Method and device for flattening remelted solder deposits |
| 02/02/1995 | DE4325499A1 Externally fitted controller |
| 02/02/1995 | CA2167534A1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprinsing same |
| 02/01/1995 | EP0637197A1 Process for making through-connections in multilayer printed circuit boards |
| 02/01/1995 | EP0637079A1 Upgradable multi-chip module |