| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/01/1995 | EP0637057A1 Method and apparatus for depositing metal fine lines on a substrate |
| 02/01/1995 | EP0637032A2 Parallel processor structure and package |
| 02/01/1995 | EP0637031A2 Parallel processor and method of fabrication |
| 02/01/1995 | EP0637030A2 Solder bonded parallel package structure and method of solder bonding |
| 02/01/1995 | EP0511334B1 Solder or conductive paste printing device |
| 02/01/1995 | CN2188843Y Carrier of angle cutter for PC plate |
| 02/01/1995 | CN1098225A Method and apparatus for use in forming prepositioned solder bumps on a pad arrangement |
| 01/31/1995 | US5386430 Excimer laser processing method and apparatus |
| 01/31/1995 | US5386339 Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
| 01/31/1995 | US5386309 Liquid crystal display module with positioning marks on circuit substrate and heat seal |
| 01/31/1995 | US5386087 Printed circuit board having U-shaped solder mask layer separating respective contacts |
| 01/31/1995 | US5386085 Multilayer electrical circuit structure including partially embedded pins for external connection |
| 01/31/1995 | US5386001 Reacting a pi-arene complexed arylene dihalide with the dianion of an arylene dithiol |
| 01/31/1995 | US5385937 Preventing peroxide generation from mercaptan groups and endothelial injury |
| 01/31/1995 | US5385787 Pretreatment metal with ureidosilane |
| 01/31/1995 | US5385660 Forming metal dendrites on bottom af article to facilitate gripping, removal from mandrel |
| 01/31/1995 | US5385291 Method employing an elevating of atmospheric pressure during the heating and/or cooling phases of ball grid array (BGA) soldering of an IC device to a PCB |
| 01/31/1995 | US5385290 Soldering material and procedure |
| 01/31/1995 | US5385289 Embedded features for registration measurement in electronics manufacturing |
| 01/31/1995 | US5384990 Saturated solution of water soluble particulate abrasive |
| 01/31/1995 | US5384955 Method for replacing IC chip package interposer |
| 01/31/1995 | US5384953 Structure and a method for repairing electrical lines |
| 01/31/1995 | CA2018208C Method of manufacturing printed circuit boards |
| 01/26/1995 | WO1995002900A1 Aluminum-palladium alloy for initiation of electroless plating |
| 01/26/1995 | WO1995002715A1 Method for metallising non-conductive substrates |
| 01/26/1995 | WO1995002509A1 Method of laminate manufacture |
| 01/26/1995 | WO1995002472A1 Post treatment of a coated substrate with a gas containing excited halogen to remove residues |
| 01/26/1995 | DE4324214A1 Electrical appliance |
| 01/26/1995 | DE4320316C1 Printed circuit board, multilayer printed circuit board inner layer and multilayer printed circuit board as well as a method for producing the same |
| 01/26/1995 | CA2143685F Pcmcia standard memory card package |
| 01/25/1995 | EP0635995A1 Flexible circuit for connecting printed circuit |
| 01/25/1995 | EP0635878A1 Wiring forming, restoring and pattern changing method |
| 01/25/1995 | EP0635760A1 Process for making microstructures |
| 01/25/1995 | EP0635585A1 Process for producing a thick and strongly adhering metallic layer on sintered aluminium nitride and metallised product thus obtained |
| 01/25/1995 | EP0635192A1 Circuit board connections |
| 01/25/1995 | EP0635035A1 A high performance epoxy based laminating adhesive |
| 01/25/1995 | EP0634972A1 Process and device for producing a three-dimensional object |
| 01/25/1995 | EP0546172B1 Circuit card assembly conduction converter and method |
| 01/25/1995 | EP0489118B1 Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
| 01/24/1995 | US5384711 Method of and apparatus for inspecting pattern on printed board |
| 01/24/1995 | US5384690 Flex laminate package for a parallel processor |
| 01/24/1995 | US5384484 Electronic read-only memory module |
| 01/24/1995 | US5384435 Electronic device |
| 01/24/1995 | US5384433 Printed circuit structure including power, decoupling and signal termination |
| 01/24/1995 | US5384432 Two-layered tape lead wire for magnetic head |
| 01/24/1995 | US5384230 Process for fabricating printed circuit boards |
| 01/24/1995 | US5384229 Photoimageable compositions for electrodeposition |
| 01/24/1995 | US5384204 Tape automated bonding in semiconductor technique |
| 01/24/1995 | US5384181 Fluoropolymer with ceramic fillers and silane coatings |
| 01/24/1995 | US5384154 Efficiency, simplification |
| 01/24/1995 | US5384153 Monitoring electroless plating baths |
| 01/24/1995 | US5383788 Electrical interconnect assembly |
| 01/19/1995 | WO1995002312A1 Structured printed circuit boards and films and process for producing them |
| 01/19/1995 | DE4422876A1 Electrical or electronic connecting contact for printed circuit boards, a method for its production and a way of fastening it on the printed circuit |
| 01/19/1995 | DE4323698A1 Device for stabilising printed circuit boards |
| 01/19/1995 | DE4321065A1 Connecting strip |
| 01/19/1995 | CA2143833A1 Structured printed circuit boards and foil printed circuit boards and process for the manufacture thereof |
| 01/18/1995 | EP0634888A1 Plug-in unit, particularly relay module for motor vehicles |
| 01/18/1995 | EP0634085A1 Process for applying a plastic coating and device for implementing it |
| 01/18/1995 | EP0633822A1 Methods of manufacturing perforated foils |
| 01/18/1995 | EP0437606B1 Electrical connectors |
| 01/17/1995 | US5383148 Single in-line memory module |
| 01/17/1995 | US5383095 Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge |
| 01/17/1995 | US5383094 Connection lead stucture for surface mountable printed circuit board components |
| 01/17/1995 | US5383093 Hybrid integrated circuit apparatus |
| 01/17/1995 | US5382874 Self-aligning light directing surface mountable miniature incandescent lamp |
| 01/17/1995 | US5382759 Massive parallel interconnection attachment using flexible circuit |
| 01/17/1995 | US5382758 Diamond substrates having metallized vias |
| 01/17/1995 | US5382757 Multilayer printed wiring board and process for manufacturing the same |
| 01/17/1995 | US5382754 Electronic part of surface mounted type and its mounting method |
| 01/17/1995 | US5382505 Method of making a laminated structure with shear force delamination resistance |
| 01/17/1995 | US5382471 Adherent metal coating for aluminum nitride surfaces |
| 01/17/1995 | US5382447 Electroless depositing of capping metal over conductive metal; oxidation; coating with polyimide precursor; heating, curing |
| 01/17/1995 | US5382333 Copper foil laminate with copper oxide films formed in oxygen |
| 01/17/1995 | US5382315 Direct-write deposition, semiconductors |
| 01/17/1995 | US5382300 Solder paste mixture |
| 01/17/1995 | US5382282 Ink composition and method of making, using and recovering such composition |
| 01/17/1995 | US5381945 Process for soldering materials like printed circuit boards or sets of components in electronics or metals in engineering work |
| 01/17/1995 | US5381848 Casting of raised bump contacts on a substrate |
| 01/17/1995 | US5381598 Method of preparing a large-current printed circuit board |
| 01/17/1995 | CA2037063C Optical machining apparatus |
| 01/17/1995 | CA2006776C Method of manufacturing multilayered printed-wiring-board |
| 01/16/1995 | CA2127905A1 Pluggable assembly, particularly a relay module for motor vehicles |
| 01/12/1995 | WO1995001613A1 A method of encapsulating components on a printed circuit |
| 01/12/1995 | WO1995001464A1 Metal-coated polyimide |
| 01/12/1995 | WO1995001305A1 Method of treating aqueous alkaline effluents derived from cleaning electronic circuit assemblies |
| 01/12/1995 | DE4422827A1 Layered potted (encapsulated) winding and a method for its production |
| 01/12/1995 | DE4322764A1 Production of an inorganic printed circuit board base material composed of an enamelled metal foil |
| 01/12/1995 | DE4322378A1 Method and device for the surface treatment, in the horizontal operating position, of workpieces which are primarily in the form of boards |
| 01/12/1995 | CA2140909A1 Method of treating aqueous alkaline effluents derived from cleaning electronic circuit assemblies |
| 01/11/1995 | EP0633717A1 Process for manufacturing solderable printed circuit board |
| 01/11/1995 | EP0633716A1 Method for drying resist film formed by electrodeposition |
| 01/11/1995 | EP0633715A2 Printed circuit board |
| 01/11/1995 | EP0633624A2 High temperature connection |
| 01/11/1995 | EP0633503A1 Photopolymerizable compositions |
| 01/11/1995 | EP0633330A1 Contact device for printed circuit boards frame in an electroplating installation |
| 01/11/1995 | EP0633328A1 Method for depositing conductive metal traces on diamond |
| 01/11/1995 | EP0632825A1 Method of cleaning epoxy articles. |
| 01/11/1995 | EP0516670B1 Device for masking off the flux lines in a galvanic bath |
| 01/11/1995 | EP0489008B1 Rotation lock and wipe connector |