| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/15/1998 | EP0853342A1 Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
| 07/15/1998 | EP0852983A1 Brazing parts forming device used for soft soldering of semiconductor chips |
| 07/15/1998 | EP0852897A1 Method for surface mounting a heatsink to a printed circuit board |
| 07/15/1998 | EP0852896A2 Method and circuit board panel for preventing assembly-line delamination and sagging for circuit board manufacturing |
| 07/15/1998 | EP0852806A1 Apparatus and method for making laminated electrical and electronic devices |
| 07/15/1998 | EP0788726B1 Current supply module for mounting on a component-carrying printed circuit board |
| 07/15/1998 | EP0703951B1 Electrically conductive adhesive compositions |
| 07/15/1998 | EP0662019A4 Method for making a ceramic metal composite. |
| 07/15/1998 | CN1187932A Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| 07/15/1998 | CN1187847A Cold cleaning composition based on alkanes or cycloalkanes and organic compound comprising ketone group |
| 07/15/1998 | CN1187751A Printed circuit board for large current |
| 07/15/1998 | CA2227078A1 Electrical contact device |
| 07/14/1998 | US5781817 Exposure controlling device and encoder for camera |
| 07/14/1998 | US5781446 System for computer aided design |
| 07/14/1998 | US5781412 Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
| 07/14/1998 | US5781264 Liquid crystal display device |
| 07/14/1998 | US5781110 Electronic article surveillance tag product and method of manufacturing same |
| 07/14/1998 | US5781091 Electronic inductive device and method for manufacturing |
| 07/14/1998 | US5781022 Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die |
| 07/14/1998 | US5780931 Surface mounting semiconductor device and semiconductor mounting component |
| 07/14/1998 | US5780776 Multilayer circuit board unit |
| 07/14/1998 | US5780366 Technique for forming resin-impregnated fiberglass sheets using multiple resins |
| 07/14/1998 | US5780143 Circuit board |
| 07/14/1998 | US5779921 Coating, imaging, stripping, masking, electrically bussing, electroplating |
| 07/14/1998 | US5779870 Method of manufacturing laminates and printed circuit boards |
| 07/14/1998 | US5779844 Continuous lamination of electronic structures |
| 07/14/1998 | US5779836 Method for making a printed wiring board |
| 07/14/1998 | US5779794 Universal fixture for holding printed circuit boards during processing |
| 07/14/1998 | US5779488 Socket for mounting an electrical component to a board |
| 07/14/1998 | US5779134 Method for surface mounting a heatsink to a printed circuit board |
| 07/14/1998 | US5778964 Solid spherical body manufacturing apparatus |
| 07/14/1998 | US5778638 Process for preserving solder paste |
| 07/14/1998 | US5778526 Method for mounting a power-dissipating component |
| 07/14/1998 | CA2125688C Solder paste formulations for use in the electronics industry |
| 07/14/1998 | CA2089240C Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography |
| 07/10/1998 | CA2194830A1 Low profile toroidal core header for use with pcb component vacuum placement machines |
| 07/09/1998 | WO1998030075A2 Method and arrangement for heating a component |
| 07/09/1998 | WO1998030073A1 Method and device for mounting electronic component on circuit board |
| 07/09/1998 | WO1998029740A1 Micro system for biological analyses and method for making same |
| 07/09/1998 | WO1998029579A1 Method of depositing a metallic film |
| 07/09/1998 | WO1998019938A3 Conveyor system with lifting mechanism |
| 07/09/1998 | DE19757634A1 Flexible printed circuit for use in electric and electronic device functional modules |
| 07/08/1998 | EP0852457A2 Apparatus for heat removal using a flexible backplane |
| 07/08/1998 | EP0852397A1 Cantilevered ball connection for integrated circuit chip package |
| 07/08/1998 | EP0852395A2 Method of multiplexed joining of solder bumps to a substrate during assembly of an integrated circuit package |
| 07/08/1998 | EP0852107A2 Method of detecting the position and displacement of layers on multilayered circuit boards |
| 07/08/1998 | EP0852014A1 Machine for the opposite control of printed circuits |
| 07/08/1998 | EP0851902A1 Method for coating |
| 07/08/1998 | CN1187038A Bottom lead semiconductor package and fabrication method thereof |
| 07/08/1998 | CN1187030A Method for packaging integrated circuit |
| 07/08/1998 | CN1039077C Spacer for light emitting diode |
| 07/08/1998 | CN1039075C Multiple layer printed circuit board |
| 07/08/1998 | CN1038992C Copper and resin bonding method |
| 07/07/1998 | US5777855 Method and apparatus for connecting flexible circuits to printed circuit boards |
| 07/07/1998 | US5777853 Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size |
| 07/07/1998 | US5777852 Clamping device for securing an electrical component to a circuit board |
| 07/07/1998 | US5777851 Circuit board having a wiring structure buried in a resin layer |
| 07/07/1998 | US5777850 Built-in control device for actuating loads with conductor foil-covered printed circuit board |
| 07/07/1998 | US5777610 Small-sized, lightweight display device easy to rework and method of assembling the same |
| 07/07/1998 | US5777553 Electronic article surveillance protection for printed circuit boards |
| 07/07/1998 | US5777386 Semiconductor device and mount structure thereof |
| 07/07/1998 | US5777381 Semiconductor devices method of connecting semiconductor devices and semiconductor device connectors |
| 07/07/1998 | US5777277 Printed circuit board |
| 07/07/1998 | US5777276 For mounting within a computer apparatus |
| 07/07/1998 | US5777275 Bendable circuit board having improved resistance to bending strain and increased element mounting area |
| 07/07/1998 | US5776824 Method for producing laminated film/metal structures for known good die ("KG") applications |
| 07/07/1998 | US5776663 Multilayer element with polyimide support on pattern seed layers, treatment with light beams and development |
| 07/07/1998 | US5776662 Multilayer electroconductive material, lamination and chips |
| 07/07/1998 | US5776587 Electronic package comprising a substrate and a semiconductor device bonded thereto |
| 07/07/1998 | US5776551 Use of plasma activated NF3 to clean solder bumps on a device |
| 07/07/1998 | US5776406 Moldings of polyurethane hotmelt adhesives |
| 07/07/1998 | US5776370 Charge transfer complexes between polyaniline and organic electron acceptors and method of fabrication |
| 07/07/1998 | US5775945 Splicing of discrete components or assemblies related applications |
| 07/07/1998 | US5775569 Method for building interconnect structures by injection molded solder and structures built |
| 07/07/1998 | US5775568 Wave solder method for attaching components to a printed circuit board |
| 07/07/1998 | US5775403 Incorporating partially sintered preforms in metal matrix composites |
| 07/07/1998 | US5775219 Squeegee for screen printing |
| 07/03/1998 | WO1998033133A1 Method and apparatus for channel-routing of an electronic device |
| 07/02/1998 | WO1998028959A1 Method and device for connecting electrical components to printed circuit boards |
| 07/02/1998 | WO1998028958A1 Method of making a printed circuit board having a tin/lead coating |
| 07/02/1998 | WO1998028957A1 Conducting foil |
| 07/02/1998 | WO1998028956A1 Conducting foil for conductively connecting electric and/or electronic components |
| 07/02/1998 | WO1998028819A1 Component for contacting a measuring unit and method for its production |
| 07/02/1998 | WO1998028793A1 Interface structures for electronic devices |
| 07/02/1998 | WO1998028791A1 Method and device for connecting a semiconductor component on a substrate provided with conductors |
| 07/02/1998 | WO1998028790A1 Mounting arrangement for a semiconductor component on a printed circuit board |
| 07/02/1998 | WO1998028787A1 Method and device for connecting electrical components to circuit boards |
| 07/02/1998 | WO1998028709A1 Non-conductive substrate forming a band or panel, on which are formed a plurality of support elements |
| 07/02/1998 | WO1998028468A1 Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductor foils in continuous systems |
| 07/02/1998 | WO1998011765A3 Improvements relating to inductive assemblies in electronic circuits |
| 07/02/1998 | DE19757850A1 Light emitting display element e.g. LED chip |
| 07/02/1998 | DE19743767A1 Surface mountable semiconductor chip housing |
| 07/02/1998 | DE19703057A1 Carrier element for semiconductor chip esp. for combination chip card |
| 07/02/1998 | DE19653054A1 Opto-electronic SMD component for data transmission |
| 07/02/1998 | CA2275653A1 Method and device for connecting electrical components to circuit boards |
| 07/02/1998 | CA2275651A1 Method and device for connecting electrical components to printed circuit boards |
| 07/02/1998 | CA2275261A1 Process and appliance for precise electrolytic precipitating and etching of metal layers on printed-circuit boards and films in continuous-cycle plants |
| 07/02/1998 | CA2246989A1 Interface structures for electronic devices |
| 07/02/1998 | CA2209709A1 Apparatus for heat removal using a flexible backplane |
| 07/01/1998 | EP0851726A2 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |