| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/29/1998 | EP0855454A1 Microetching composition for copper or copper alloy |
| 07/29/1998 | EP0855090A1 Multichip module |
| 07/29/1998 | EP0855049A1 A method of forming a monolayer of particles, and products formed thereby |
| 07/29/1998 | EP0855037A1 Loaded board drop pin fixture |
| 07/29/1998 | EP0854768A1 Soldering methods and compositions |
| 07/29/1998 | EP0733129B1 Process for producing and adhesive bond between copper layers and ceramics |
| 07/29/1998 | CN1189287A Method for forming fiducial mark in resin stencil and stencil formed thereby |
| 07/29/1998 | CN1189125A Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| 07/29/1998 | CN1189084A Gas flow controlling device and soldering apparatus using same |
| 07/29/1998 | CN1188967A Novel flat plexible cable |
| 07/28/1998 | US5787498 Integrated circuit memory with verification unit which resets an address translation register upon failure to define one-to-one correspondences between addresses and memory cells |
| 07/28/1998 | US5787098 Complete chip I/O test through low contact testing using enhanced boundary scan |
| 07/28/1998 | US5786989 Printed circuit board mounting structure and electronic device using the same |
| 07/28/1998 | US5786986 Multi-level circuit card structure |
| 07/28/1998 | US5786985 Semiconductor device and semiconductor device unit |
| 07/28/1998 | US5786785 Electromagnetic radiation absorptive coating composition containing metal coated microspheres |
| 07/28/1998 | US5786745 Electronic package and method |
| 07/28/1998 | US5786306 Alloying metals, melting, melt writing, controlling thickness and forming patterns then oxidation |
| 07/28/1998 | US5786270 Method of forming raised metallic contacts on electrical circuits for permanent bonding |
| 07/28/1998 | US5786239 Method of manufacturing a semiconductor package |
| 07/28/1998 | US5786238 Laminated multilayer substrates |
| 07/28/1998 | US5786073 Soldering projections having oxidation resistant protective coatings containing fluoride of tin and/or lead, for flip chips |
| 07/28/1998 | US5785879 Concurrently firing ceramic and melting internal conductive powder |
| 07/28/1998 | US5785789 Applying first microsphere filled resin layer to first removable carrier, partiall-curing resin layer prior to introduction to multilayer structure and lamination of multilayer and first and second microspheres filled resins |
| 07/28/1998 | US5785787 Forming holes through low dielectric constant porous polymeic layer containing additives, metallizing and patterning the surface, then removing additives |
| 07/28/1998 | US5785786 Ultrasonic welding method |
| 07/28/1998 | US5785535 Computer system with surface mount socket |
| 07/28/1998 | US5785484 Method and apparatus for orienting miniature components |
| 07/28/1998 | US5785465 Entry overlay sheet and method for drilling holes |
| 07/28/1998 | US5785418 Thermally protected LED array |
| 07/28/1998 | US5785237 Differential multi-flow control nozzles, apparatus and process |
| 07/28/1998 | US5785234 Method of surface-contacting electronic components |
| 07/28/1998 | US5785233 Apparatus and method for solder reflow bottom cooling |
| 07/28/1998 | US5784782 Method for fabricating printed circuit boards with cavities |
| 07/28/1998 | US5784781 Manufacturing process for organic chip carrier |
| 07/28/1998 | US5784779 Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate |
| 07/23/1998 | WO1998032314A2 Solder joints for surface mount chips |
| 07/23/1998 | WO1998032213A2 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 07/23/1998 | WO1998032159A2 Mounting structure and mounting process from semiconductor devices |
| 07/23/1998 | WO1998032098A1 Chip card module |
| 07/23/1998 | WO1998031738A1 Thermosetting resin compositions |
| 07/23/1998 | WO1998031475A1 Fluid delivery apparatus and method |
| 07/23/1998 | WO1998020535A3 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| 07/23/1998 | DE19800234A1 Brushless motor e.g.for vehicle air-conditioner fan |
| 07/23/1998 | DE19756569A1 Forming laminated ceramic substrate with conductive contacts on one main surface |
| 07/23/1998 | DE19708615C1 Chip-card module design and manufacture |
| 07/23/1998 | DE19702125A1 Production of treatment gas used in printed circuit board assemblies |
| 07/23/1998 | DE19702124A1 Workpiece surface cleaning, activating, wetting and/or coating |
| 07/23/1998 | CA2278019A1 Solder joints for surface mount chips |
| 07/23/1998 | CA2278006A1 Mounting structure and mounting process from semiconductor devices |
| 07/23/1998 | CA2275330A1 Fluid delivery apparatus and method |
| 07/22/1998 | EP0854665A2 Inert gas air horn distribution device |
| 07/22/1998 | EP0854548A2 Electric contact device |
| 07/22/1998 | EP0854541A1 Connector and wiring structure for high current |
| 07/22/1998 | EP0854511A2 Resin sealing type semiconductor device |
| 07/22/1998 | EP0854001A1 Gas flow controlling device and soldering apparatus using same |
| 07/22/1998 | EP0794847B1 Process for bonding wires to oxidation-sensitive metal substrates which can be soldered |
| 07/22/1998 | EP0752154B1 Printed circuit board relay with insert connections |
| 07/22/1998 | EP0726925B1 Electrically conductive adhesives |
| 07/22/1998 | CN1188589A Organic-metallic composite coating for copper surface protection |
| 07/22/1998 | CN1188439A Solder and soldered electronic component and electronic circuit board |
| 07/22/1998 | CN1188438A Gas knife cooling system |
| 07/22/1998 | CN1188389A Circuit-board connecting structure |
| 07/22/1998 | CN1188388A Flexible printed circuit and process for producing the same |
| 07/21/1998 | US5784653 Electronically controlled camera |
| 07/21/1998 | US5784264 MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form |
| 07/21/1998 | US5784262 Arrangement of pads and through-holes for semiconductor packages |
| 07/21/1998 | US5784261 Microchip module assemblies |
| 07/21/1998 | US5784259 Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel |
| 07/21/1998 | US5784258 Wiring board for supporting an array of imaging chips |
| 07/21/1998 | US5784248 Method of mounting solid electrolytic capacitor onto printed circuit board, and assembly of the capacitor and the board |
| 07/21/1998 | US5784206 Moving lens position detecting device |
| 07/21/1998 | US5783938 Method and apparatus for the quantitative measurement of the corrosivity effect of residues present on the surface of electronic circuit assemblies |
| 07/21/1998 | US5783870 Method for connecting packages of a stacked ball grid array structure |
| 07/21/1998 | US5783865 Wiring substrate and semiconductor device |
| 07/21/1998 | US5783639 Composition of epoxy group-containing cycloolefin resin |
| 07/21/1998 | US5783551 Paraffinic cleaning solutions |
| 07/21/1998 | US5783465 Forming bonding pad on first element, depositing a layer of photodefinable polymer on the surface of second element, masking the polymer, exposing, developing the photodefinable layer to produce bumps, encasing with copper metal layer |
| 07/21/1998 | US5783370 Panelized printed circuit cables for high volume printed circuit cable manufacturing |
| 07/21/1998 | US5783368 Method of forming conductive paths on a substrate containing depressions |
| 07/21/1998 | US5783252 Technique for forming resin-impregnated fiberglass sheets |
| 07/21/1998 | US5783059 Depositing a tin-bismuth alloy; presence of a zinc salt in bath increases wettability and decreases surface oxidation; lead-free |
| 07/21/1998 | US5783026 Apparatus for stacking sheets by carriers |
| 07/21/1998 | US5783017 Applying a hologram to a substrate |
| 07/21/1998 | US5783008 Apparatus and method for embedding conductors in a non-planar substrate |
| 07/21/1998 | US5782984 Aqueous claner containing hydrogen fluoride nd hydrogen peroxide |
| 07/21/1998 | US5782555 Heat dissipating L.E.D. traffic light |
| 07/21/1998 | US5782399 Method and apparatus for attaching spherical and/or non-spherical contacts to a substrate |
| 07/16/1998 | WO1998031204A1 Printed wiring board and method of manufacturing the same |
| 07/16/1998 | WO1998031203A1 Improvements in or relating to thermal trip arrangements |
| 07/16/1998 | WO1998031027A1 Power-driven device |
| 07/16/1998 | WO1998030967A2 Flexible touchpad circuit with mounted circuit board |
| 07/16/1998 | WO1998030937A1 Articulated platform mechanism for laser pattern generation on a workpiece |
| 07/16/1998 | WO1998030647A1 Reducing void formation in curable adhesive formulations |
| 07/16/1998 | WO1998030352A1 Non-contact type soldering iron capable of intermittent soldering |
| 07/16/1998 | WO1998030351A1 Soldering method and soldering iron |
| 07/16/1998 | DE19701163A1 Electrical circuit with contact track layer especially for chip card |
| 07/16/1998 | DE19700963A1 Verfahren zur Herstellung eines Leistungsmoduls mit einer aktive Halbleiterbauelemente und passive Halbleiterbauelemente aufweisenden Schaltungsanordnung Method for producing a power module having a semiconductor active devices and passive semiconductor devices having circuitry |
| 07/16/1998 | CA2276737A1 Reducing void formation in curable adhesive formulations |
| 07/16/1998 | CA2248002A1 Articulated platform mechanism for laser pattern generation on a workpiece |