Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1998
08/12/1998EP0834243A4 Photolithographically patterned spring contact
08/12/1998EP0757885B1 Method of forming metallic conductive patterns on insulating substrates
08/12/1998CN1190423A Adhesive containing electrically conductive agent
08/12/1998CN1190324A Method of attaching flexible circuit to substrate
08/12/1998CN1190253A Selectively filled adhesive film containing fluxing agent
08/12/1998CN1190198A Camera, its checking device and method, device for checking printed circuit board thereof
08/12/1998CN1190047A Laser processing device and method
08/11/1998US5794085 Exposure controlling device for camera
08/11/1998US5793537 Lens barrel having a linear guide mechanism
08/11/1998US5793116 Microelectronic packaging using arched solder columns
08/11/1998US5793105 Inverted chip bonded with high packaging efficiency
08/11/1998US5793099 Semiconductor device
08/11/1998US5792985 Terminal for electronic component and method of manufacturing the same
08/11/1998US5792814 Method for preparing modified resins and their applications
08/11/1998US5792716 Thick film having acid resistance
08/11/1998US5792595 Exposing photoresist layer to light, developing to form resist pattern, forming electrolytically plated layer, superposing photosensitive sheet on substrate, forming metal pattern
08/11/1998US5792375 Microetching one surface, abutting the two surfaces together, laminating at 300 degrees and 1500 psi; bond strength
08/11/1998US5792333 Subjecting at least one side of foil to electroplating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid/copper sulfate bath is used as electrolyte
08/11/1998US5792293 Preventing the green sheet deforming by conveying with a carrier film or plates, sintering
08/11/1998US5792277 N-propyl bromide based cleaning solvent and ionic residue removal process
08/11/1998US5792268 Printered circuit board screen printer vacuum holding apparatus
08/11/1998US5791911 Coaxial interconnect devices and methods of making the same
08/11/1998US5791552 For attaching a chip carrying assembly to a daughter board assembly
08/11/1998US5791484 Assembly of chip parts
08/11/1998US5791243 For solder paste printing machines
08/11/1998CA2110354C Monitoring electroless plating baths
08/11/1998CA2102276C Adapter for drilling machines
08/10/1998WO1998044067A1 Circuit connecting material, and structure and method of connecting circuit terminal
08/06/1998WO1998034447A1 Printed wiring board and its manufacturing method
08/06/1998WO1998034446A1 New process for modification of surfaces
08/06/1998WO1998034445A1 Method and apparatus for metallizing high aspect ratio silicon semiconductor device contacts
08/06/1998WO1998034444A1 A manufacturing process for printed circuits
08/06/1998WO1998034443A1 Printed wiring board and manufacturing method therefor
08/06/1998WO1998034442A1 Printed circuit assembly with flexible support
08/06/1998WO1998034273A1 Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method
08/06/1998WO1998034237A1 Through-hole interconnect device with isolated wire-leads and component barriers
08/06/1998WO1998034194A1 Modular data medium
08/06/1998WO1998033951A1 Composition and method for priming substrate materials
08/06/1998WO1998033600A1 Ipc (chip) termination machine
08/06/1998DE19804617A1 Soluble siloxane-polyimide for heat-resistant adhesive
08/06/1998DE19804031A1 Light conductor connection casing
08/06/1998DE19703990A1 Modular aufgebauter, elektronischer Datenträger Modular, electronic media
08/06/1998CA2279949A1 Printed circuit assembly with flexible support
08/06/1998CA2279340A1 A manufacturing process for printed circuits
08/06/1998CA2278580A1 Composition and method for priming substrate materials
08/06/1998CA2228848A1 Suffering anvil for use in a component insertion machine
08/05/1998EP0857010A1 Manufacturing process for printed circuits
08/05/1998EP0856740A1 PCB testing system
08/05/1998EP0856556A2 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method
08/05/1998EP0856529A1 Electronic article having fluoropolymer thin film
08/05/1998EP0856447A2 Control device for an antilock braking system
08/05/1998EP0856376A1 Article comprising fine-grained solder compositions with dispersoid particles
08/05/1998EP0730528B1 Alignment systems
08/05/1998EP0651696B1 A method of manufacturing a ud-reinforced pwb laminate
08/05/1998EP0539597B1 Liquid crystal module
08/05/1998CN1189760A Printed circuit board and electronic components
08/05/1998CN1189702A Light emitting display element, method for connecting same to electric wiring substrate and method of manufacturing same
08/05/1998CN1189689A Improved polytetrafluoroethyelen thin film chip carrier
08/05/1998CN1189677A 叠层电子元件 Laminated electronic components
08/04/1998US5790905 Exposure controlling device for camera
08/04/1998US5790383 Printed circuit board
08/04/1998US5790381 Integrated circuit package assembly
08/04/1998US5790377 Electronic device
08/04/1998US5789930 Apparatus and method to test for known good die
08/04/1998US5789920 Position sensor housing having duroplastic molding compound and thermoplastic molding compound
08/04/1998US5789853 Method of patterned eroding of a coating provided on a substrate
08/04/1998US5789811 Surface mount peripheral leaded and ball grid array package
08/04/1998US5789799 High frequency noise and impedance matched integrated circuits
08/04/1998US5789757 Packaging for electronics
08/04/1998US5789359 Rinsing, drying; water and air pollution control
08/04/1998US5789280 Leadframe having secured outer leads, semiconductor device using the leadframe and method of making them
08/04/1998US5789278 Using electroconductive adhesive to join semiconductor die to substrate
08/04/1998US5789271 Method for fabricating microbump interconnect for bare semiconductor dice
08/04/1998US5789142 Depositing photodefinable resin containing cuprous oxide to a printed ciruit layer of a circuit board
08/04/1998US5789121 Acrylic polymer and ultraviolet light absorbing material coatings; high resolution; stripping with halogen-free solvent
08/04/1998US5789068 Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
08/04/1998US5789064 Electromagnetic radiation absorbing and shielding compositions
08/04/1998US5788854 Methods for fabrication of thin film inductors, inductor networks, inductor/capactor filters, and integration with other passive and active devices, and the resultant devices
08/04/1998US5788830 Applying carbon or palladium compound; preferential microetching using aqueous solution of sulfuric acid, hydrogen peroxide, phosphonic group-containing amine
08/04/1998US5788544 Multi-pole variable SMD terminal arrangement and method for its mounting on a circuit substrate
08/04/1998US5788514 Device for connecting electrical components having wire leads
08/04/1998US5788512 Electrical connectors
08/04/1998US5788511 Universal connector pad
08/04/1998US5788143 Method of making an electrical interconnect assembly
08/04/1998US5787581 Methods of making semiconductor connection components with releasable load support
08/04/1998US5787580 Method for making radio-frequency module by ball grid array package
08/04/1998US5787578 Annealing, ultrasonic removal
08/04/1998CA2135241C Cavity and bump interconnection structure for electronic packages
08/04/1998CA2117873C Boardlock clip
07/1998
07/30/1998WO1998033366A1 Method and device for manufacturing multilayered wiring board and wiring board
07/30/1998WO1998033365A1 A circuit board assembly having surface-mount radio frequency components
07/30/1998WO1998033364A1 Method and circuit board for preventing delamination and sagging
07/30/1998WO1998033363A1 Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board
07/30/1998WO1998033212A1 Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment
07/30/1998WO1998033210A1 Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package
07/30/1998WO1998032901A1 Product conveyance mechanism of electroplating apparatus
07/30/1998WO1998032886A1 Lead-free tin alloy
07/30/1998DE19703152A1 Encapsulation level control system for electronic circuit(s)
07/30/1998CA2278143A1 Lead-free tin alloy
07/29/1998EP0855851A2 Discharge lamp unit
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