Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/1998
09/17/1998WO1998040914A1 Printed wiring board and method for manufacturing the same
09/17/1998WO1998040897A1 Electrical component, specially a chip inductive resistor
09/17/1998WO1998040792A1 System and method for optically aligning films and substrates used in printed circuit boards
09/17/1998WO1998040754A1 Mounting structure of electric parts on circuit board
09/17/1998DE19710047A1 Flexible circuit board for electronic circuit
09/17/1998DE19710034A1 Double sided flexible printed circuit board manufacturing method
09/17/1998DE19709985A1 Smart card for data transmission using contact- or contactless technology
09/16/1998EP0865232A2 Mounting of chip modules on printed writing boards
09/16/1998EP0865231A1 Method for producing printed circuit boards with through-platings
09/16/1998EP0865118A1 Electrical assembly
09/16/1998EP0865102A2 Solder connection for electrical connections
09/16/1998EP0864398A1 Machine tool with tool store with improved capacity and tool store for equipping a machine tool
09/16/1998EP0864397A2 High throughput hole forming system with multiple spindles per station
09/16/1998EP0864119A1 Photosensitive composition
09/16/1998EP0864118A1 Donor elements and processes for thermal dye transfer by laser
09/16/1998EP0787224B1 Process for separating metal coatings
09/16/1998EP0628180B1 Pliable, aqueous processable, photoimageable permanent coatings for printed circuits
09/16/1998EP0624261B1 Process for preparing photohardenable elastomeric element having increased exposure latitude
09/16/1998EP0618309B1 Metal powder composition for metallization and metallized substrate
09/16/1998EP0511305B1 Method, system and composition for soldering by induction heating
09/16/1998CN1193452A Method for making a debossed conductive film composite
09/16/1998CN1193200A Dendritic interconnection system
09/16/1998CN1193188A Semiconductor device, assembling method, and circuit baseboard and soft baseboard and mfg. method therefor
09/15/1998US5809361 Flexible printed circuit board
09/15/1998US5809348 Zoom compact camera
09/15/1998US5808898 Method of placing and extracting modules
09/15/1998US5808875 Integrated circuit solder-rack interconnect module
09/15/1998US5808873 Electronic component assembly having an encapsulation material and method of forming the same
09/15/1998US5808853 Capacitor with multi-level interconnection technology
09/15/1998US5808529 Printed circuit board layering configuration for very high bandwidth interconnect
09/15/1998US5808521 Printed wiring board with the characteristic impedance of wiring pattern changed on the way thereof
09/15/1998US5808360 Microbump interconnect for bore semiconductor dice
09/15/1998US5808358 Packaging electrical circuits
09/15/1998US5808351 Programmable/reprogramable structure using fuses and antifuses
09/15/1998US5808259 Thick film apparatus and method for customizing IC test PCB
09/15/1998US5807910 Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive
09/15/1998US5807766 Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process
09/15/1998US5807626 Ceramic circuit board
09/15/1998US5807612 Forming decorative or protective overcoating
09/15/1998US5807610 Flex tab thick film metal mask to deposit coating material
09/15/1998US5807606 Applying adhesive to substrates
09/15/1998US5807493 Microetching method for copper or copper alloy
09/15/1998US5807455 System and method for uniform product compressibility in a high throughput uniaxial lamination press
09/15/1998US5807453 Fabrication of leads on semiconductor connection components
09/15/1998US5807437 Three dimensional printing system
09/15/1998US5807122 Adaptor for mounting on a circuit board
09/15/1998US5806753 Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
09/15/1998US5806423 Printing squeegee apparatus
09/15/1998US5806179 Method for connecting a cable to a printed circuit board
09/15/1998US5806178 Circuit board with enhanced rework configuration
09/15/1998US5806177 Process for producing multilayer printed circuit board
09/15/1998CA2068419C Method for measuring degree of cure of resin in a composite material and process for making the same
09/11/1998WO1998039784A1 Ceramic multilayer printed circuit boards with embedded passive components
09/11/1998WO1998039781A1 Vertically interconnected electronic assemblies and compositions useful therefor
09/11/1998WO1998039732A2 Chip card module and chip card comprising the latter
09/11/1998WO1998039105A1 Metal-plating of cured and sintered transient liquid phase sintering pastes
09/11/1998CA2280778A1 Transport apparatus for thin, board-shaped substrates
09/10/1998DE19758452A1 Metal-ceramic substrate for electrical circuit
09/10/1998DE19755398A1 Multi-layer 3D printed circuit board manufacturing method
09/10/1998DE19732645A1 Combination chip card manufacturing method
09/10/1998DE19709551A1 Electrical printed circuit board
09/10/1998DE19708325A1 Adhesive joint method of electrically conductive assembly components
09/09/1998EP0863550A2 Metallurgical interconnect composite
09/09/1998EP0863530A2 Electric circuit board and method of producing the same
09/09/1998EP0863437A1 A method for forming a resist layer on a circuit base plate
09/09/1998EP0863426A1 Liquid crystal display device
09/09/1998EP0863116A1 Low-temperature sinterable ceramic composition, and monolithic ceramic substrate using the same
09/09/1998EP0862962A2 Method and apparatus for controlling a time/temperature profile inside a reflow oven
09/09/1998EP0862791A1 Method of manufacturing and transferring metallic droplets
09/09/1998EP0862665A1 Process for the electrolytic deposition of metal layers
09/09/1998EP0694220B1 Solder-bearing lead
09/09/1998CN1192717A Debossable films
09/09/1998CN1192716A Conductive film composite
09/08/1998US5805431 Surface Mountable transformer
09/08/1998US5805428 Transistor/resistor printed circuit board layout
09/08/1998US5805427 Ball grid array electronic package standoff design
09/08/1998US5805426 Microelectronic assemblies including Z-axis conductive films
09/08/1998US5805425 Microelectronic assemblies including Z-axis conductive films
09/08/1998US5805424 Microelectronic assemblies including Z-axis conductive films
09/08/1998US5805423 Battery contact and retention apparatus for printed circuit boards
09/08/1998US5805422 Semiconductor package with flexible board and method of fabricating the same
09/08/1998US5805417 For an electronic equipment
09/08/1998US5805402 Integrated interior trim and electrical assembly for an automotive vehicle
09/08/1998US5805249 Liquid crystal display device having video signal driving circuit mounted on one side
09/08/1998US5805037 Distributed transmission line structure
09/08/1998US5804882 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
09/08/1998US5804880 For electrical connection to a die
09/08/1998US5804876 Electronic circuit bonding interconnect component and flip chip interconnect bond
09/08/1998US5804801 Adhesive bonding using variable frequency microwave energy
09/08/1998US5804771 For an integrated circuit package assembly
09/08/1998US5804672 Thermally crosslinkable heat-sealing adhesive
09/08/1998US5804308 Heat lag media
09/08/1998US5804256 Method and device for coating printed-circuit boards
09/08/1998US5804248 Solder paste deposition
09/08/1998US5804052 Method and device for continuous uniform electrolytic metallizing or etching
09/08/1998US5804013 Process for manufacture by endothermic heating of plastic laminates in a continuous band pressed in cycles
09/08/1998US5803344 Dual-solder process for enhancing reliability of thick-film hybrid circuits
09/08/1998US5803343 Solder process for enhancing reliability of multilayer hybrid circuits
09/08/1998US5803340 Formulation has chip mount reflow temperature that is higher than the corresponding bumping reflow temperature; suitable for high temperature applications yet can be deposited using dry film photoresist masking methods
09/08/1998US5803339 For electrical connection to an integrated circuit
1 ... 901 902 903 904 905 906 907 908 909 910 911 912 913 914 915 916 917 918 919 920 921 ... 1185