| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/19/2003 | CN1398154A 印刷电路板 A printed circuit board |
| 02/19/2003 | CN1398153A Mfg. method of circuit device |
| 02/19/2003 | CN1398152A Method for mfg. printed circuit board |
| 02/19/2003 | CN1398151A Process for preparing sealing resin of circuit board for shielding electromagnetic waves |
| 02/19/2003 | CN1398150A 布线电路板 Wiring circuit board |
| 02/19/2003 | CN1398149A Printed circuit board with radiating element, its mfg. method and device contg. it |
| 02/19/2003 | CN1398018A Connector and its mfg. method |
| 02/19/2003 | CN1397657A Copper alloy foil for laminated board |
| 02/19/2003 | CN1397428A Silk-screen printing equipment and silk-screen printing method |
| 02/19/2003 | CN1397420A Local welding method for parts otd. by jet moulding process |
| 02/18/2003 | US6522555 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein |
| 02/18/2003 | US6522518 Reconfigurable multichip module stack interface |
| 02/18/2003 | US6522466 Apparatus for observing interior from an ultramicropore space |
| 02/18/2003 | US6522378 Liquid crystal display and manufacture therefore |
| 02/18/2003 | US6522073 Plasma display panel with an auxiliary bonding pad |
| 02/18/2003 | US6522017 Wiring board and semiconductor device |
| 02/18/2003 | US6522014 Fabrication of a metalized blind via |
| 02/18/2003 | US6521997 Chip carrier for accommodating passive component |
| 02/18/2003 | US6521993 Semiconductor memory module having double-sided stacked memory chip layout |
| 02/18/2003 | US6521984 Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate |
| 02/18/2003 | US6521866 Laser beam machining and laser beam machine |
| 02/18/2003 | US6521845 Thermal spreading enhancements for motherboards using PBGAs |
| 02/18/2003 | US6521844 Through hole in a photoimageable dielectric structure with wired and uncured dielectric |
| 02/18/2003 | US6521843 Multilayer printed circuit board having signal, power and ground through holes |
| 02/18/2003 | US6521842 Hybrid surface mount and pin thru hole circuit board |
| 02/18/2003 | US6521841 Test coupon in printed wiring board |
| 02/18/2003 | US6521838 Heat-resistant, flex-resistant flexible flat cable and process for producing the same |
| 02/18/2003 | US6521830 Housing for electrical or electronic devices with integrated conductor tracks |
| 02/18/2003 | US6521530 Composite interposer and method for producing a composite interposer |
| 02/18/2003 | US6521480 Method for making a semiconductor chip package |
| 02/18/2003 | US6521355 Fluorescent dye, electronic component |
| 02/18/2003 | US6521328 Copper etching compositions and products derived therefrom |
| 02/18/2003 | US6521324 Thermal transfer of microstructured layers |
| 02/18/2003 | US6521287 Method for manufacturing improved stencil/screen |
| 02/18/2003 | US6521285 Method for printing a catalyst on substrates for electroless deposition |
| 02/18/2003 | US6521176 Tin, bismuth, silver |
| 02/18/2003 | US6521153 Method for in-situ green sheet slitting |
| 02/18/2003 | US6521144 A conductive adhesive comprising a thermoplastic or thermosetting binder resin contains a functional group in its molecular chain that forms multidentate bonding with electrode metal after binder is adhered, and a metal filler |
| 02/18/2003 | US6521139 Composition for circuit board manufacture |
| 02/18/2003 | US6521069 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board |
| 02/18/2003 | US6521068 Method and device for detaching a segment of a material layer |
| 02/18/2003 | US6520780 Power relay module |
| 02/18/2003 | US6520778 Microelectronic contact structures, and methods of making same |
| 02/18/2003 | US6520402 High-speed direct writing with metallic microspheres |
| 02/18/2003 | US6520109 Heat insulation arrangement of indicating instrument |
| 02/18/2003 | US6519845 Wire bonding to dual metal covered pad surfaces |
| 02/18/2003 | US6519843 Method of forming a chip carrier by joining a laminate layer and stiffener |
| 02/18/2003 | US6519842 Method for mounting semiconductor device |
| 02/18/2003 | US6519824 Electric wiring forming system |
| 02/13/2003 | WO2003013201A1 Method for forming device-landing pad of multi-layered printed circuit board |
| 02/13/2003 | WO2003013200A1 Circuit module |
| 02/13/2003 | WO2003012897A1 Cell with terminals |
| 02/13/2003 | WO2003012868A1 Semiconductor device and its manufacturing method |
| 02/13/2003 | WO2003012802A1 Method for producing nanocomposite magnet using atomizing method |
| 02/13/2003 | WO2003011607A1 Method for placing indicia on substrates |
| 02/13/2003 | WO2003011589A1 Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| 02/13/2003 | WO2003011479A1 Selective electroless deposition and interconnects made therefrom |
| 02/13/2003 | WO2003011141A1 Ultrasound probe wiring method and apparatus |
| 02/13/2003 | WO2002052910A3 Manufacture of printed circuits using single layer processing techniques |
| 02/13/2003 | WO2002039463A9 Methods and system for attaching substrates using solder structures |
| 02/13/2003 | US20030032337 Adapter for a light source |
| 02/13/2003 | US20030032217 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 02/13/2003 | US20030031888 Copper foil excellent in laser beam drilling performance and production method therefor |
| 02/13/2003 | US20030031830 Printed circuit boards and printed circuit board based substrates structures with multiple core layers |
| 02/13/2003 | US20030031803 Coating with layer of polymer matrix doped with photoreducer material dielectric particles, irradiating the surface to be metallized with laser, and immersing the irradiated part in an autocatalytic bath containing metal ions |
| 02/13/2003 | US20030031424 Optical connector and optical element |
| 02/13/2003 | US20030031418 Ball grid array element and optical communication module using the same |
| 02/13/2003 | US20030031365 Multiple-exposure drawing apparatus and method thereof |
| 02/13/2003 | US20030031356 Pattern inspection apparatus and method |
| 02/13/2003 | US20030031001 Flat panel display and printed circuit board used therein |
| 02/13/2003 | US20030031000 Electrical device allowing for increased device densities |
| 02/13/2003 | US20030030999 High dielectric constant composite material and multilayer wiring board using the same |
| 02/13/2003 | US20030030994 Substrate for electronic part and electronic part |
| 02/13/2003 | US20030030985 Laminated ceramic electroni component, production method therefor, and electronic device |
| 02/13/2003 | US20030030794 Confocal 3D inspection system and process |
| 02/13/2003 | US20030030533 Printed circuit board |
| 02/13/2003 | US20030030510 Multilayered LC composite component and method for manufacturing the same |
| 02/13/2003 | US20030030429 Method and apparatus for evaluating a set of electronic components |
| 02/13/2003 | US20030030154 Resin-sealed type semiconductor device |
| 02/13/2003 | US20030030149 Semiconductor device having solder bumps reliably reflow solderable |
| 02/13/2003 | US20030030143 Electronic component with stacked electronic elements and method for fabricating an electronic component |
| 02/13/2003 | US20030030122 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/13/2003 | US20030029908 Bumps made with adhesive film instead of gold plating |
| 02/13/2003 | US20030029907 Transfer film for use with a flexible circuit compression connector |
| 02/13/2003 | US20030029860 Electrical, thin film termination |
| 02/13/2003 | US20030029832 Method for forming large integration and ultra-fine lines on a substrate |
| 02/13/2003 | US20030029830 Method for producing multilayer substrate and electronic part, and multilayer electronic part |
| 02/13/2003 | US20030029782 Solder dross removal apparatus and method |
| 02/13/2003 | US20030029730 Copper on INVAR® composite |
| 02/13/2003 | US20030029729 Method of fabricating inter-layer solid conductive rods |
| 02/13/2003 | US20030029717 Treatment of circuit support with impulse excitation |
| 02/13/2003 | US20030029638 Discrete solder ball contact and circuit board assembly utilizing same |
| 02/13/2003 | US20030029637 Circuit board assembly with ceramic capped components and heat transfer vias |
| 02/13/2003 | US20030029636 Coupling of conductive vias to complex power-signal substructures |
| 02/13/2003 | US20030029634 Aromatic liquid-crystalline polyester metal laminate |
| 02/13/2003 | US20030029633 Interconnecting substrates for electrical coupling of microelectronic components |
| 02/13/2003 | US20030029559 Adhesive for connecting electrodes and adhesion methods with the use of the same |
| 02/13/2003 | US20030029556 Adhesive-coated electronic parts on a connection sheet |
| 02/13/2003 | US20030029336 Method for placing indicia on substrates |
| 02/13/2003 | US20030029273 Method and apparatus for manufacturing minute metallic sphere |