Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2003
02/25/2003US6524711 Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition
02/25/2003US6524709 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
02/25/2003US6524663 Method for selective activation and metallization of materials
02/25/2003US6524654 Method of controlling the spread of an adhesive on a circuitized organic substrate
02/25/2003US6524645 Process for the electroless deposition of metal on a substrate
02/25/2003US6524644 Process for selective deposition of OSP coating on copper, excluding deposition on gold
02/25/2003US6524490 Method for electroless copper deposition using a hypophosphite reducing agent
02/25/2003US6524462 Electroplating electroconductive regions with tool
02/25/2003US6524461 Electrodeposition of metals in small recesses using modulated electric fields
02/25/2003US6524352 Printed circuit boards
02/25/2003US6524346 High degree of precision; protective and alignment structures to a substrate
02/25/2003US6524122 Retractable connector for use with electronic devices
02/25/2003US6524115 Compliant interconnect assembly
02/25/2003US6523801 Component placement
02/25/2003US6523764 Heating, pulverization, separation of wastes from printed circuits
02/25/2003US6523757 Compact spray valve
02/25/2003US6523736 Methods and apparatus for forming solder balls
02/25/2003US6523734 Covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection steps of putting said first and second
02/25/2003US6523258 Method of manufacturing printed circuit board
02/25/2003US6523257 Method for forming fine through hole conduction portion of circuit board
02/25/2003US6523256 Method of manufacturing a wiring board
02/25/2003US6523253 Z-axis processor power delivery system
02/25/2003US6523252 Coaxial cable, method for manufacturing a coaxial cable, and wireless communication device
02/25/2003US6523251 Method for removing insulation from a flat cable
02/25/2003US6523250 Method of attaching a slider with head transducer to a suspension
02/25/2003US6523235 Ceramic capacitor comprising a plurality of ceramic capacitor elements and at least a pair of metal plate terminals, with said ceramic capacitor elements each having terminal electrodes at two side end surfaces facing opposite each
02/20/2003WO2003015490A2 Method for fabricating large area flexible electronics
02/20/2003WO2003015487A1 A method of providing radio frequency screening for electric components
02/20/2003WO2003015486A1 Stencil for use with stencil mounting frame
02/20/2003WO2003015485A1 Welded leadframe
02/20/2003WO2003015484A1 Card manufacturing technique and resulting card
02/20/2003WO2003015483A1 Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil
02/20/2003WO2003015482A2 A system and method for unveiling targets embedded in a multi-layered electrical circuit
02/20/2003WO2003015218A1 Batch electrically connecting sheet
02/20/2003WO2003015146A1 Process and apparatus for treating a workpiece such as a semiconductor wafer
02/20/2003WO2003014754A1 Apparatus and methods for testing bare circuit boards
02/20/2003WO2003014751A2 Method and apparatus for evaluating a set of electronic components
02/20/2003WO2003014425A1 Copper on invar composite and method of making
02/20/2003WO2003014210A1 Flame retardant molding compositions
02/20/2003WO2003014177A1 Resin composition, composition for solder resist, and cured article obtained therefrom
02/20/2003WO2002096176A3 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
02/20/2003WO2002073322B1 Quasi-cw diode-pumped, solid-state uv laser system and method employing same
02/20/2003WO2002054837A3 Direct pattern writer
02/20/2003WO2002035897A9 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
02/20/2003WO2001081657A3 Elastic contact element
02/20/2003US20030036304 Cable assembly module with compressive connector
02/20/2003US20030036301 Topside Installation apparatus for land grid array modules
02/20/2003US20030036295 Method of making of electronic parts mounting board
02/20/2003US20030036288 Method for forming a metal pattern on a dielectric substrate
02/20/2003US20030036269 Method of removing smear from via holes
02/20/2003US20030036262 Method for manufacturing multilayer ceramics with improved interlayer bonding
02/20/2003US20030036255 Method of forming metal bumps
02/20/2003US20030036229 Chip package and method for manufacturing the same
02/20/2003US20030036220 Printed circuit board having plating conductive layer with bumps and its manufacturing method
02/20/2003US20030036020 Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element
02/20/2003US20030036016 Particularly sub-170 nm such as 157 nm.; a fluorine-containing polymer, a photoactive component, and a solvent component that is a mixture of least two distinct solvents
02/20/2003US20030035948 Reflow resistance; for use in tape automated bonding; electrical properties; mechanical properties
02/20/2003US20030035903 Solventless thermosetting photosensitive via-filling ink
02/20/2003US20030035886 Method for depositing conductive paste using stencil
02/20/2003US20030035280 Daughter-card structural support
02/20/2003US20030035275 Device and method for interstitial components in a printed circuit board
02/20/2003US20030035272 Solid via layer to layer interconnect
02/20/2003US20030035252 Circuit board capable of preventing electrostatic breakdown and magnetic head using the same
02/20/2003US20030035026 Connection module
02/20/2003US20030034868 Coupling adjusting structure for double-tuned circuit
02/20/2003US20030034782 Electric connection-inspection device
02/20/2003US20030034566 Reduction of chip carrier flexing during thermal cycling
02/20/2003US20030034565 Flip chip substrate with metal columns
02/20/2003US20030034554 Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate
02/20/2003US20030034441 Sub chip on board for optical mouse
02/20/2003US20030034382 Solder sheet with a bump grid array, process for manufacturing the solder sheet, and process for producing an electronic device using the sholder sheet
02/20/2003US20030034381 Packaging method using lead-free solder
02/20/2003US20030034380 Method for removing solder bumps from LSI
02/20/2003US20030034250 Reverse voltage bias for electro-chemical plating system and method
02/20/2003US20030034239 Micro-electro mechanical system
02/20/2003US20030034175 Configurations and methods for improved copper distribution uniformity in printed wiring boards
02/20/2003US20030034174 Circuit board and a method for making the same
02/20/2003US20030034173 Bump-attached wiring circuit board and method for manufacturing same
02/20/2003US20030034169 Conductor strip formed with slit, cutout or grooves
02/20/2003US20030034127 Mixture of anisotropic conductive paste and polymer
02/20/2003US20030034125 Film with metal foil
02/20/2003US20030034122 Unfired-ceramic-body procesing method
02/20/2003US20030033943 Screen printing apparatus
02/20/2003DE20215298U1 Stencil for screen printing of circuit board components, made of paper and affixed to rigid frame or tensioned on frame
02/20/2003DE10209365C1 Process for electrolytically metallizing the walls of holes in e.g. circuit boards, conductor foils and strips comprises inserting the material into a working container, contacting with an electrolyte, and further processing
02/20/2003DE10131610C1 Verfahren zur Kalibrierung des optischen Systems einer Lasermaschine zur Bearbeitung von elektrischen Schaltungssubstraten Method of calibrating the optical system of a laser machine for processing electrical circuit substrates
02/20/2003CA2453336A1 Batch electrically connecting sheet
02/20/2003CA2449052A1 Flame retardant molding compositions
02/19/2003EP1284590A1 Device for connecting connection lines with a resilient layered connecting element
02/19/2003EP1284523A2 Discrete solder ball contact and circuit board assembly utilizing same
02/19/2003EP1284502A1 Device having resin package and method of producing the same
02/19/2003EP1284501A1 Device having resin package and method of producing the same
02/19/2003EP0889775B1 Heating of composites using microwave energy
02/19/2003EP0770260B1 Variable voltage protection structures and methods for making same
02/19/2003CN1398506A Appts. for coupling power to electronics module
02/19/2003CN1398453A Electronic device, semiconductor device comprising such device and method of mfg. such device
02/19/2003CN1398448A Contact structure and prodn. method thereof and probe contact assembly using same
02/19/2003CN1398413A Coil assembly with circuit board and coil body
02/19/2003CN1398279A Resin compsn. adhesives prepared therewith for bonding circuit members, and circuit boards
02/19/2003CN1398274A Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound
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