Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/04/2003US6527158 Method and apparatus for forming solder bumps
03/04/2003US6527041 Methods and apparatus for forming solder balls
03/04/2003US6526654 Method of producing double-sided circuit board
02/2003
02/27/2003WO2003017740A1 Configurations and methods for improved copper distribution uniformity in printed wiring boards
02/27/2003WO2003017722A2 Micro-electro mechanical system and method of making
02/27/2003WO2003017435A1 Adapter for power transfer
02/27/2003WO2003017432A1 Cable assembly module with compressive connector
02/27/2003WO2003017367A1 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
02/27/2003WO2003017290A1 Production method for conductive paste and production method for printed circuit board
02/27/2003WO2003016066A1 Connection module
02/27/2003WO2002100135A3 Flexible polyimide circuitsubstrates having predeterminded slopedvias
02/27/2003WO2002093990A3 Polyimide adhesion enhancement to polyimide film
02/27/2003WO2002064301A3 Laser micromachining and electrical structures
02/27/2003WO2002057075A3 Multi-level web structure in use for thin sheet processing
02/27/2003WO2002049404A3 Liquid crystalline polymer bond plies and circuits formed therefrom
02/27/2003US20030040229 Wire bonding surface
02/27/2003US20030040226 Sectional connector substituting for PC104 & PC104 PLUS industrial computer connectors
02/27/2003US20030040218 Electrical connector for mounting on PC board
02/27/2003US20030040166 Apparatus and method for stacking integrated circuits
02/27/2003US20030040145 Method for transferring and stacking of semiconductor devices
02/27/2003US20030040139 Spring contact for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate, apparatus including same and method of use
02/27/2003US20030040138 Method of manufacturing circuit device
02/27/2003US20030039901 Precision fiducial
02/27/2003US20030039841 Enhanced ceramic layers for laminated ceramic devices and method
02/27/2003US20030039811 Circuit board and production method thereof
02/27/2003US20030039760 Copper on polymer component having improved adhesion
02/27/2003US20030039107 Operating mechanism
02/27/2003US20030039106 Double-sided wiring board and its manufacture method
02/27/2003US20030039102 Semiconductor chip mounting substrate and semiconductor device using it
02/27/2003US20030039101 Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
02/27/2003US20030038705 Mounting structure for thermistor with positive resistance-to-temperature characteristic
02/27/2003US20030038686 Electromagnetic emission reduction technique for shielded connectors
02/27/2003US20030038647 Probe card for probing wafers with raised contact elements
02/27/2003US20030038585 Wiring substrate, manufacturing method therefor, and image display device
02/27/2003US20030038379 Laminate film for mounting electronic devices and film carrier tape for mounting electronic devices
02/27/2003US20030038378 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein
02/27/2003US20030038375 Bonded anisotropic conductive film
02/27/2003US20030038372 Electronic component and production method thereof
02/27/2003US20030038367 Semiconductor device and method for manufacturing the same
02/27/2003US20030038344 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
02/27/2003US20030038292 Multiple led chip package
02/27/2003US20030038280 For connecting throughhole-type conductive bumps between printed circuit layers
02/27/2003US20030038165 Method for making an electroconductive joint
02/27/2003US20030038160 Ceramic electronic component having lead wires
02/27/2003US20030038158 Bonding apparatus and bonding tool for component
02/27/2003US20030038157 Electronic component with a semiconductor chip and method for producing the electronic component
02/27/2003US20030038124 Compact heating module with soft start
02/27/2003US20030037961 E-Z circut board
02/27/2003US20030037960 Layered circuit boards and methods of production thereof
02/27/2003US20030037959 Bismaleimide- triazine copolymer and epoxy resin laminate having a plurality of solder pads on the surface and the solder pads contain no more than 20 weight % tin and has a reflow temperature of not greater than about 270 degree C.
02/27/2003US20030037946 Horizontal component retention socket
02/27/2003US20030037870 Electrical connector
02/27/2003US20030037804 Method of cleaning solder paste
02/27/2003US20030037745 Connection of wire to printed circuit board (PCB)
02/27/2003US20030037702 Electronically addressable microencapsulated ink and display thereof
02/27/2003US20030037435 Methods for trimming electrical parameters in an electrical circuit
02/27/2003US20030037434 Method of manufacturing a metal-ceramic circuit board
02/27/2003DE29924232U1 Wet cleaning of objects using a mixture of water and an organic solvent which is miscible with water within a defined range of concentrations and temperature and shows a miscibility gap outside this range
02/27/2003DE10131431C1 Electrical circuit board housing has elastic bearing plate supporting circuit board provided with electrically-conductive region providing electrical connection path
02/26/2003EP1286579A1 Multilayer printed wiring board
02/26/2003EP1286578A2 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
02/26/2003EP1286577A1 Method of fixing electronic part
02/26/2003EP1286576A2 Method for manufacturing copper-resin composite material
02/26/2003EP1286575A2 Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
02/26/2003EP1286464A1 Coupling adjusting structure for double-tuned circuit
02/26/2003EP1286423A2 An electrical connector for a printed-circuit board
02/26/2003EP1285979A1 Displacement gold plating solution
02/26/2003EP1285462A2 Semiconductor component comprising a surface metallization
02/26/2003EP1190608B1 Porous power and ground planes for reduced pcb delamination and better reliability
02/26/2003EP0754356B1 Electrical lead for surface mounting of substrates
02/26/2003CN1399861A Printed circuit boards with solid interconnect and method of producing the same
02/26/2003CN1399509A Prepn process of soldering bead lattice array board
02/26/2003CN1399507A Circuit board making process
02/26/2003CN1399506A Bad area eliminating and filling method suitable for various printed circuit board
02/26/2003CN1399139A Printed circuit board characteristic test set
02/26/2003CN1398918A Thermosetting resin composition
02/26/2003CN1398698A Clean-free liquid flux
02/26/2003CN1102329C Method of attaching flexible circuit to substrate
02/25/2003US6526519 Method and apparatus for reducing signal timing skew on a printed circuit board
02/25/2003US6525921 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
02/25/2003US6525718 Flexible circuit board and liquid crystal display device incorporating the same
02/25/2003US6525635 Multilayer inductor
02/25/2003US6525631 System and method for improved microstrip termination
02/25/2003US6525628 Surface mount RC array with narrow tab portions on each of the electrode plates
02/25/2003US6525623 Multi-layer microwave circuits and methods of manufacture
02/25/2003US6525622 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure
02/25/2003US6525526 Method and device for testing printed circuit boards
02/25/2003US6525429 Methods of making microelectronic assemblies including compliant interfaces
02/25/2003US6525424 Semiconductor device and its manufacturing method
02/25/2003US6525414 Semiconductor device including a wiring board and semiconductor elements mounted thereon
02/25/2003US6525408 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
02/25/2003US6525275 High densification of solder pads; reduced wiring layers; mounting of flip chips
02/25/2003US6525009 Such as sodium polyacrylate in excess alkali; removal of conductive paste residue from screening masks used in ceramic semiconductor substrate manufacture
02/25/2003US6524943 Method of forming metal bumps
02/25/2003US6524892 Method of fabricating multilayer flexible wiring boards
02/25/2003US6524889 Method of transcribing a wiring pattern from an original substrate to a substrate with closely matched thermal expansion coefficients between both substrates for dimensional control of the transcribed pattern
02/25/2003US6524767 Electronic parts and lithographic printing plates; inclusion of a radiation absorbing compound in a coating of a thermally decomposable metal reduces energy needed to decompose to the metal; direct writing process
02/25/2003US6524758 Method of manufacture of printed wiring boards and flexible circuitry
02/25/2003US6524723 Copper foil for printed circuit boards and its surface treatment method
02/25/2003US6524721 Conductive adhesive and packaging structure using the same
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