Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/06/2003US20030042585 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
03/06/2003US20030042467 Powder coating; containing metallic fibers; antistatic agent
03/06/2003US20030042306 Electronic verification machine for documents
03/06/2003US20030042295 Self-adhesive flexible repair circuit
03/06/2003US20030042294 Method and device for pressing workpiece
03/06/2003US20030042289 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method
03/06/2003US20030042287 Solder ball attracting mask and its manufacturing method
03/06/2003US20030042230 Multiple beam micromachining system for removing at least two different layers of a substrate
03/06/2003US20030042224 Method for preparing ball grid array board
03/06/2003US20030042144 Multilayer coating of copper and silver, nickel alloy
03/06/2003US20030042047 Solder bonding method, and electronic device and process for fabricating the same
03/06/2003US20030042046 Laminate circuit structure and method of fabricating
03/06/2003US20030042045 Embedded electrical traces and method for making
03/06/2003US20030042043 Structure and method for shadow mask electrode
03/06/2003US20030042042 Flexible printed circuit board with reinforcing plate
03/06/2003US20030042041 Connection structure of coaxial cable
03/06/2003US20030042031 Clamp to secure carrier to device for electromagnetic coupler
03/06/2003US20030041966 Method of joining laminates for z-axis interconnection
03/06/2003US20030041947 Method for sinter distortion control
03/06/2003US20030041929 2,4,-Hexadienoic acid, its alkali salts and/or derivatives for preventing oxidative corrosion of metals
03/06/2003US20030041762 Method for preventing distortions in a flexibly transferred feature pattern
03/06/2003US20030041761 Method for removing unwanted particles from a surface used in the process of flexibly transferring a feature pattern from an inked surface to a substrate
03/06/2003US20030041753 Printing stencils for electronic substrates
03/06/2003US20030041710 Cutting system
03/06/2003US20030041455 Connection of electrical contacts utilizing a combination laser and fiber optic push connect system
03/06/2003US20030041452 Filling plugs through chemical mechanical polish
03/06/2003CA2456769A1 Interconnect module with reduced power distribution impedance
03/06/2003CA2449807A1 Segmented counterelectrode for an electrolytic treatment system
03/05/2003EP1289356A1 Method and device for drying materials and method of producing circuit boards using the same
03/05/2003EP1289355A1 Method for producing ceramic substrate
03/05/2003EP1289354A1 Multilayer printed circuit board and process for manufacturing holes therein
03/05/2003EP1289353A1 Surface mounting type electronic component
03/05/2003EP1289352A2 High-frequency circuit device and method for manufacturing the same
03/05/2003EP1287540A1 Electroluminescent lamp devices and their manufacture
03/05/2003EP1287182A1 Cathode for electrochemical regeneration of permanganate etching solutions
03/05/2003EP1287179A2 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part
03/05/2003EP1286789A2 High-speed fabrication of highly uniform ultra-small metallic microspheres
03/05/2003EP1219150B1 Method and device for laser drilling laminates
03/05/2003EP1218566B1 Method for producing a conductor pattern on a dielectric substrate
03/05/2003EP1155603B1 Method for making electronic modules with ball connector or with integrated preforms capable of being soldered on a printed circuit and implementing device
03/05/2003EP1125483A4 Case for circuit board for horizontal or vertical mounting
03/05/2003EP1038420B1 Method for making circuit elements for a z-axis interconnect
03/05/2003EP1005261B1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
03/05/2003EP0860033B1 Solder-holding clips for applying solder to connectors
03/05/2003EP0852014B1 Method of controlling printed circuits
03/05/2003CN2538472Y Soldering tin stove capable of regulating surge up, surge quantity and surge face height
03/05/2003CN1401210A Method of printing and printing machine
03/05/2003CN1401209A Copper clad laminated sheet
03/05/2003CN1401138A Ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
03/05/2003CN1401137A Electronic device and method of manufacturing the electronic device
03/05/2003CN1401127A Electronic component-use substrate and electronic component
03/05/2003CN1401107A Method and system for detecting defects on a printed circuit board
03/05/2003CN1400935A Method for producing prepreg, prepreg, metal-clad laminate and printed wiring board
03/05/2003CN1400857A Method of filling fluid material into hole
03/05/2003CN1400856A Device with contact made of conductive carbon black and its contact producing process
03/05/2003CN1400854A Electronic device and its design method and making process, circuit substrate and electronic equipment
03/05/2003CN1400697A Manufacture of electrical contact
03/05/2003CN1400696A Manufacture of electrical contact
03/05/2003CN1400101A Circuit board connector, integrated circuit chip and ink cartridge with the chip
03/05/2003CN1400081A Lead-free welding flux alloy
03/05/2003CN1102498C Laminate material and method for sealing and packaging
03/04/2003US6529624 Apparatus for inspecting cream solder on PCB and method thereof
03/04/2003US6529385 Component array adapter
03/04/2003US6529365 Multiple terminal SMT BGA-style wound capacitor
03/04/2003US6529027 Interposer and methods for fabricating same
03/04/2003US6529026 Method for fabricating an interconnect for making temporary electrical connections to semiconductor components
03/04/2003US6529016 Apparatus monitoring the deposition of a liquid-to-pasty medium on a substrate
03/04/2003US6528894 Use of nitrides for flip-chip encapsulation
03/04/2003US6528877 Semiconductor component having a chip carrier with openings for making contact
03/04/2003US6528874 Wiring circuit substrate and manufacturing method thereof
03/04/2003US6528873 Ball grid assembly with solder columns
03/04/2003US6528870 Semiconductor device having a plurality of stacked wiring boards
03/04/2003US6528869 Semiconductor package with molded substrate and recessed input/output terminals
03/04/2003US6528866 High-frequency module
03/04/2003US6528769 Connection of a junction to an electrical conductor track on a plate
03/04/2003US6528737 Midplane configuration featuring surface contact connectors
03/04/2003US6528736 Multi-layer printed circuit board and method of making same
03/04/2003US6528734 Semiconductor device and process for fabricating the same
03/04/2003US6528733 Multi-layer circuit board and method of manufacturing same
03/04/2003US6528732 Circuit device board, semiconductor component, and method of making the same
03/04/2003US6528552 Permanent protective coating of a printed wiring board; aluminum hydroxide, inorganic molybdenum compound, zinc stannate or zinc hydroxystannate in a resin
03/04/2003US6528407 Process for producing electrical-connections on a semiconductor package, and semiconductor package
03/04/2003US6528350 Method for fabricating a metal plated spring structure
03/04/2003US6528346 Bump-forming method using two plates and electronic device
03/04/2003US6528343 Semiconductor device its manufacturing method and electronic device
03/04/2003US6528236 Photosensitive resin composition, multilayer printed wiring board and process for production thereof
03/04/2003US6528218 Method of fabricating circuitized structures
03/04/2003US6528184 Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings
03/04/2003US6528179 Reduction of chip carrier flexing during thermal cycling
03/04/2003US6528145 Polymer and ceramic composite electronic substrates
03/04/2003US6527999 Using clamping fixture constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board
03/04/2003US6527984 Low temperature-curable connecting material for anisotropically electroconductive connection
03/04/2003US6527963 Method of manufacturing multilayer wiring boards
03/04/2003US6527920 Copper electroplating apparatus
03/04/2003US6527890 Multilayered ceramic micro-gas chromatograph and method for making the same
03/04/2003US6527840 Consisting of palladium ions, gold ions and rhodium ions, the silver ions and at least one metal ion having a concentration of 0.001 to 0. 01 mol/l
03/04/2003US6527686 Variable pitch spindle line drilling machine
03/04/2003US6527563 Grid interposer
03/04/2003US6527162 Connecting method and connecting structure of printed circuit boards
03/04/2003US6527159 Surface mounting to an irregular surface
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