Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/12/2003EP1290067A1 Flexible, insulating and heat-stable composite materials
03/12/2003EP1289707A1 Variable melting point solders and brazes
03/12/2003EP1289701A2 High-speed fabrication of highly uniform metallic micro spheres
03/12/2003EP1289678A1 Process for improving the adhesion of polymeric materials to metal surfaces
03/12/2003EP1289676A1 Component of printed circuit board
03/12/2003EP1027739B1 Housing for piezoelectric transformer device
03/12/2003EP0953205B1 Substrate treatment device
03/12/2003EP0916144B1 Method for making a transponder coil
03/12/2003EP0781079B1 Method of fabricating electronic circuit
03/12/2003CN2540051Y Small connect-disconnect transmit-receive module shell
03/12/2003CN1402959A Multilayered printed circuit board
03/12/2003CN1402753A Impregnated glass fiber strands and products including same
03/12/2003CN1402695A Impregnated glass fibre strands and products including same
03/12/2003CN1402608A Method for plating via hole with copper
03/12/2003CN1402607A Method for selectively plating metal by screen printing
03/12/2003CN1402606A Printed circuit board with protruding end on electroplated conductive layer and mfg. method thereof
03/12/2003CN1402605A Electromagnetic interference inverter circuit of circuit board with direct assembled chip therein
03/12/2003CN1402604A Wiring layer of silver or silver alloy, mfg. method thereof and display screen substrate therewith
03/12/2003CN1402602A Printed circuit board fixing pin assembly and assembling method thereof
03/12/2003CN1402426A Multi-layer LC composite element and mfg. method thereof
03/12/2003CN1402320A Circuit device mfg. method
03/12/2003CN1402186A Upper chip for secondary board of optic mouse
03/12/2003CN1402086A Pattern, wiring, circuit board, electron source and image forming device mfg. method
03/12/2003CN1401822A Coating method
03/12/2003CN1103137C Piezoelectric resonator and electronic component device using the same
03/12/2003CN1103065C Photoimageable composition having improved photoinitiator system
03/11/2003US6532439 Method for determining the desired decoupling components for power distribution systems
03/11/2003US6531944 Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same
03/11/2003US6531928 High-frequency module
03/11/2003US6531775 High-frequency module
03/11/2003US6531772 Electronic system including memory module with redundant memory capability
03/11/2003US6531770 Electronic part unit attached to a circuit board and including a cover member covering the electronic part
03/11/2003US6531766 Improved moisture resistance and high reliability; solder resist, encapsulating resin
03/11/2003US6531764 Vertically mountable semiconductor device, assembly, and methods
03/11/2003US6531760 Semiconductor device
03/11/2003US6531678 Method for processing ceramic green sheet and laser beam machine used therefor
03/11/2003US6531677 Method and apparatus for drilling printed wiring boards
03/11/2003US6531664 Controlling height of solder connections, and preventing shorting between adjacent connections
03/11/2003US6531663 Solder stop for an electrical connection and method therefor
03/11/2003US6531662 Circuit board, battery pack, and method of manufacturing circuit board
03/11/2003US6531661 Multilayer printed circuit board and method of making the same
03/11/2003US6531660 Printed substrate board
03/11/2003US6531370 Method for manufacturing circuit devices
03/11/2003US6531257 Organic binder having an acid functional group, a copper powder with a surface layer of thickness .1 mu m and copper oxide as a main component, and a photosensitive organic component
03/11/2003US6531191 Method of manufacturing a sintered structure on a substrate
03/11/2003US6531045 Acid resistance
03/11/2003US6531026 Method for mounting electronic elements
03/11/2003US6531022 Mounting method of semiconductor element
03/11/2003US6530804 Battery holder
03/11/2003US6530790 Electrical connector
03/11/2003US6530412 Surface mount technology with masked cure
03/11/2003US6530147 Forming glass fiber reinforced resin coated copper prepreg
03/10/2003CA2402055A1 Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
03/06/2003WO2003020004A1 Layered circuit boards and methods of production thereof
03/06/2003WO2003020003A2 Horizontal component retention socket
03/06/2003WO2003020001A1 Multi-milling method for the production of printed circuits and the printed circuits thus obtained
03/06/2003WO2003020000A1 Method for improving bonding of circuit substrates to metal and articles formed thereby
03/06/2003WO2003019999A1 Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards
03/06/2003WO2003019998A1 Thermosetting electroconductive paste for electroconductive bump use
03/06/2003WO2003019997A1 Improved heat sink for surface mounted power devices
03/06/2003WO2003019733A1 Electromagnetic emission reduction technique for shielded connectors
03/06/2003WO2003019656A2 Interconnect module with reduced power distribution impedance
03/06/2003WO2003019651A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
03/06/2003WO2003019579A1 Conductive paste and conductive film using it, plating method and production method for fine metal component
03/06/2003WO2003019506A1 Illuminated sign or display apparatus and mounting of circuit devices
03/06/2003WO2003019210A1 Sensor for inspection instrument and inspection instrument
03/06/2003WO2003018878A2 Segmented counterelectrode for an electrolytic treatment system
03/06/2003WO2003018509A1 Enhanced ceramic layers for laminated ceramic devices
03/06/2003WO2003018285A1 Method and device for forming module electronic component and module electronic component
03/06/2003WO2003018213A2 Silanated copper foils, method of making, and use thereof
03/06/2003WO2002103848A3 Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
03/06/2003WO2002101730A3 Attachment of a head-gimbal assembly to a printed circuit board actuator arm using z-axis conductive adhesive film
03/06/2003WO2002093595A3 Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies
03/06/2003WO2002069679A3 Stacked panel processing apparatus and methods
03/06/2003US20030045757 Reacting a precursory modified polyphenylene ether with a phenolic compound in the presence of a radical generator
03/06/2003US20030045669 Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it,and production methods therefor
03/06/2003US20030045164 Non-woven fabric material and prepreg, and circuit board using the same
03/06/2003US20030045137 Electric junction box for vehicle
03/06/2003US20030045047 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
03/06/2003US20030045024 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
03/06/2003US20030044699 Check board replacement systems
03/06/2003US20030044631 Thermally conductive elastomeric pad and method of manufacturing same
03/06/2003US20030044597 Thermally fusion-bonded with liquid crystal polymer.
03/06/2003US20030044590 X-ray printing personalization technique
03/06/2003US20030044588 Insulating resin composition for multi-layered printed circuit wiring board, multi-layerd printed circuit wiring board using the particular resin composition, and manufacturing the same
03/06/2003US20030044582 Screen printing process
03/06/2003US20030044248 Circuit board production method and circuit board production data
03/06/2003US20030043570 Spread illuminating apparatus with flexible printed circuit
03/06/2003US20030043560 Printed circuit board having a microelectronic semiconductor device mount area for trace routing therethrough
03/06/2003US20030043558 Mounting structure of high-frequency wiring board
03/06/2003US20030043557 System and method for reducing apparent height of a board system
03/06/2003US20030043556 Wiring board and process for producing the same
03/06/2003US20030043554 Method and apparatus for building and testing electronic circuits
03/06/2003US20030043508 Flex on suspension with actuator dynamic function
03/06/2003US20030043465 Vehicle mirror system with vehicle heading sensor assembly
03/06/2003US20030042912 Hybrid conductor-board for multi-conductor routing
03/06/2003US20030042626 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
03/06/2003US20030042618 Semiconductor device and a method of manufacturing the same
03/06/2003US20030042601 Electronic module and communication module using the same
03/06/2003US20030042595 Spring bias electrical contactors; lamination sheet