Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/18/2003US6534249 Method of making low cost integrated out-of-plane micro-device structures
03/18/2003US6534245 With cured photosensitive deielectric
03/18/2003US6534194 Method of making reactive multilayer foil and resulting product
03/18/2003US6534192 Multi-purpose finish for printed wiring boards and method of manufacture of such boards
03/18/2003US6534160 Dielectric is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impreganated with a thermoset material; printed circuits; good adhesion, dimensional stability, laser drillability
03/18/2003US6534124 Molding a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, air blasting the surface, catalyst coating, activation treatment and electroless plating.
03/18/2003US6534117 Electroless plating method and electroless plating solution
03/18/2003US6533915 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
03/18/2003US6533888 Apparatus and method for fabricating buried and flat metal features
03/18/2003US6533860 Process for preparing green pigment composition containing no halogen
03/18/2003US6533849 Electroless gold plated electronic components and method of producing the same
03/18/2003US6533620 Electrical connection method and connection site
03/18/2003US6533587 Circuit board riser
03/18/2003US6533586 Electromagnetic coupler socket
03/18/2003US6533470 Single-piece cage for pluggable fiber optic transceiver
03/18/2003US6533445 Vehicle light
03/18/2003US6533163 Solder ball pitcher
03/18/2003US6533162 Paste providing method, soldering method and apparatus and system therefor
03/18/2003US6533160 Device for providing balls or preforms for making flip-chip connections
03/18/2003US6533159 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
03/18/2003US6532683 Drying method for woven glass fabric
03/18/2003US6532652 Method for manufacturing wire harness with branch connection terminals
03/18/2003US6532651 Circuit board and method of manufacturing the same
03/13/2003WO2003022021A1 Liquid crystal polymers for flexible circuits
03/13/2003WO2003021672A2 An electronic package having a thermal stretching layer
03/13/2003WO2003021668A1 Wiring board, semiconductor device and method for producing them
03/13/2003WO2003021664A1 Semiconductor device, structural body and electronic device
03/13/2003WO2003021184A1 Rapid in-situ mastering of an aspheric fizeau
03/13/2003WO2003021005A1 Method of plating nonconductor product
03/13/2003WO2003021004A1 Process for making thin film porous ceramic-metal composites and composites obtained by this process
03/13/2003WO2003020816A1 Fluxing compositions
03/13/2003WO2003020527A2 Screen printing process
03/13/2003WO2002103751A3 Electroplating chemistry for the cu filling of submicron features of vlsi/ulsi interconnect
03/13/2003WO2002066205A8 Operating head for a machine tool with a spindle rotating on a vertical axis
03/13/2003WO2002065606A3 Energy pathway arrangements for energy conditioning
03/13/2003WO2002061787A3 Method and apparatus having pin electrode for surface treatment using capillary discharge plasma
03/13/2003WO2002056650A3 Forming a conducor circuit on a substrate
03/13/2003WO2002047856A3 Irregular shaped copper particles and methods of use
03/13/2003WO2002033752A3 Electronic module having canopy-type carriers
03/13/2003US20030050419 High thermal conductivity spin castable potting compound
03/13/2003US20030049955 Clip for replaceable surface mounted devices
03/13/2003US20030049952 Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
03/13/2003US20030049950 Solderless method for transferring high frequency, radio frequency signals between printed circuit boards
03/13/2003US20030049937 Apparatus and method for surface treatment to substrate
03/13/2003US20030049913 Process for the production of high-density printed wiring board
03/13/2003US20030049889 Method of manufacturing multilayer modules
03/13/2003US20030049886 Electronic system modules and method of fabrication
03/13/2003US20030049885 Semiconductor package, method of manufacturing the same, and semiconductor device
03/13/2003US20030049572 Method for forming patterned insulating elements and methods for making electron source and image display device
03/13/2003US20030049560 Wherein active primer is disposed between thermal transfer donor sheet and receptor to assist selective thermal transfer; binder improves adhesion
03/13/2003US20030049487 Process for preparing metal-coated aromatic polyimide film
03/13/2003US20030049425 Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same
03/13/2003US20030049424 Stacking of multilayer modules
03/13/2003US20030049412 Process of forming a pattern on a substrate
03/13/2003US20030049373 Apparatus for and method of applying a substance to a substrate
03/13/2003US20030049166 Sensor substrate and method of fabricating same
03/13/2003US20030048814 Laser energy delivery system outputting beams having a selectable energy
03/13/2003US20030048624 Low-height multi-component assemblies
03/13/2003US20030048620 Printed-circuit board with fuse
03/13/2003US20030048609 Stack of multilayer modules with heat-focussing metal layer
03/13/2003US20030048591 Desmearing process/apparatus for pulse-type D.C. plasma
03/13/2003US20030048457 Rapid in-situ mastering of an aspheric fizeau
03/13/2003US20030048377 Camera body for protecting components
03/13/2003US20030048329 Method and apparatus for cleaning inkjet cartridges
03/13/2003US20030048314 Direct write TM system
03/13/2003US20030048256 Computing device with roll up components
03/13/2003US20030048172 Composition and method for manufacturing integral resistors in printed circuit boards
03/13/2003US20030048111 Test Fixture Comprising Drilled and Etched Pin holes and Related Methods.
03/13/2003US20030048108 Structural design and processes to control probe position accuracy in a wafer test probe assembly
03/13/2003US20030047849 Method of modifying the temperature stability of a low temperature cofired ceramics (LTCC)
03/13/2003US20030047807 Electronic package having a thermal stretching layer
03/13/2003US20030047801 Semiconductor device and manufacturing method of the same
03/13/2003US20030047797 Bow control in an electronic package
03/13/2003US20030047591 Hydrogen fluxless soldering by electron attachment
03/13/2003US20030047546 Laser energy delivery system employing a beam splitter outputting a selectable number of sub-beams
03/13/2003US20030047545 Method for laser drilling
03/13/2003US20030047544 Method of laser drilling
03/13/2003US20030047541 Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same
03/13/2003US20030047535 System and process for automated microcontact printing
03/13/2003US20030047527 Boat for ball attach manufacturing process
03/13/2003US20030047458 Combined adhesion promotion and direct metallization process
03/13/2003US20030047357 Forming a through hole in a photoimageable dielectric structure
03/13/2003US20030047356 Electronic assembly and a method of constructing an electronic assembly
03/13/2003US20030047355 Printed wiring board with high density inner layer structure
03/13/2003US20030047353 Multilayer modules with flexible substrates
03/13/2003US20030047349 Integrated circuit package and printed circuit board arrangement
03/13/2003US20030047344 I-channel surface-mount connector with extended flanges
03/13/2003US20030047288 Low profile vacuum press
03/13/2003US20030047269 Method for manufacturing circuit board
03/13/2003US20030047108 Adhesion properties and high solderability
03/13/2003US20030046809 Method of connecting a device to a support, and pad for establishing a connection between a device and a support
03/13/2003DE10153157C1 Multi-layer circuit board lamination packet manufacturing method has separation layer stacked between outer layers on deposition table before transfer to lamination packet
03/12/2003EP1292022A1 Saw device and method of manufacture thereof
03/12/2003EP1291917A2 Electric circuit element, especially power module and associated process of manufacturing
03/12/2003EP1291911A1 Method having resin package and method of producing the same
03/12/2003EP1291577A1 Small portable flashlight
03/12/2003EP1291118A1 Process and device for deepening holes in a multilayer circuit board
03/12/2003EP1291117A1 Method and apparatus for producing a hole in a workpiece with a laser beam
03/12/2003EP1291111A1 Hydrogen fluxless soldering by electron attachment
03/12/2003EP1290753A1 Electronically tunable dielectric composite thick films
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