Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/20/2003WO2002045162A3 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer
03/20/2003US20030055121 Adhesives
03/20/2003US20030054678 Slanted connector
03/20/2003US20030054674 Connection of coaxial cable to a circuit board
03/20/2003US20030054635 Fabrication of a metalized blind via
03/20/2003US20030054633 Method of electroless plating copper on nitride barrier
03/20/2003US20030054293 Heat resistance, dimensional stability;printed circuits
03/20/2003US20030054190 Very ultra thin conductor layers for printed wiring boards
03/20/2003US20030054146 Epoxy resin composition and laminate using the same
03/20/2003US20030054094 Using glycolic acid reducing agent
03/20/2003US20030053765 Photo-electric combined substrate
03/20/2003US20030053303 Circuit board assembly having a compact structure
03/20/2003US20030053302 Printed circuit board routing and power delivery for high frequency integrated circuits
03/20/2003US20030053301 High-g mounting arrangement for electronic chip carrier
03/20/2003US20030053258 Hard disk drive suspension with integral flexible circuit
03/20/2003US20030053056 Mark for visual inspection upon assembling a display
03/20/2003US20030052968 Inspecting apparatus of printed state or the like in flexible printed circuit board
03/20/2003US20030052655 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive
03/20/2003US20030052416 A hybrid integrated circuit have the welded connection between a lead and a conductor by a thermoplastic epoxy containing conductive metallic particles; resist to oxidation at elevated operating temperature
03/20/2003US20030052395 Semiconductor device and design support method of electronic device using the same
03/20/2003US20030052157 Method for producing solderable and functional surfaces on circuit carriers
03/20/2003US20030052156 A soldering means having a curved exterior surface enclosing a first volume, and an interior cavity having a displacement constituting a second volume, useful for electrical and mechaincal connecting two metal planer surfaces
03/20/2003US20030052155 Universal ball attach manufacturing process
03/20/2003US20030052104 Laser processing apparatus
03/20/2003US20030052099 System and method for unveiling targets embedded in a multi-layered electrical circuit
03/20/2003US20030052078 Production process of electronic component using wet etching, electronic component, and suspension for hard disk
03/20/2003US20030052077 Method for forming a product sensor, and a product sensor
03/20/2003US20030051999 Elastic contact element
03/20/2003US20030051995 Plating device and plating method
03/20/2003US20030051912 Solder pads and method of making a solder pad
03/20/2003US20030051911 Post in ring interconnect using 3-D stacking
03/20/2003US20030051909 Ball grid array attaching means having improved reliability and method of manufacturing same
03/20/2003US20030051907 Retaining ring interconnect used for 3-d stacking
03/20/2003US20030051906 Post in ring interconnect using for 3-d stacking
03/20/2003US20030051905 Method of mounting electronic component on substrate without generation of voids in bonding material
03/20/2003US20030051904 Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
03/20/2003US20030051903 Retaining ring interconnect used for 3-D stacking
03/20/2003US20030051902 Multi-layer interconnection board
03/20/2003US20030051893 Surface-mounting connector and semiconductor module using the same
03/20/2003US20030051807 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
03/20/2003US20030051806 Security tag and process for making same
03/20/2003US20030051801 Screen printing plate, method and device for manufacturing the same, screen printing method and device, and screen-printed matter
03/20/2003US20030051799 Printed circuit techniques for polyethylene surfaces
03/20/2003US20030051790 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
03/20/2003US20030051617 Continuous printing and mounting apparatus for film-like printing body
03/20/2003US20030051340 Apparatus and method for providing a ground reference potential
03/20/2003US20030051338 Method of assembling a land grid array module and alignment tool for use therewith
03/20/2003DE20300688U1 Electrical connection clamp for an electronic circuit board
03/20/2003CA2776343A1 Sensor substrate and method of fabricating same
03/20/2003CA2459401A1 Sensor substrate and method of fabricating same
03/19/2003EP1294218A1 Flux applying method, flow soldering method and devices therefor and electronic circuit board
03/19/2003EP1294217A1 Method of mounting electronic part
03/19/2003EP1293508A1 Organometallic precursor for forming metal pattern
03/19/2003EP1293492A1 Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same
03/19/2003EP1293283A2 Method for local application of solder to preselected areas on a printed circuit board
03/19/2003EP1293271A2 Method and device for pressing workpiece
03/19/2003EP1293110A1 Electronic ballast for a discharge lamp
03/19/2003EP1293009A1 Multi-layer microwave circuits and methods of manufacture
03/19/2003EP1292999A1 Cylindrical battery clip for key fobs
03/19/2003EP1292718A2 Method for depositing metal and metal oxide films and patterned films
03/19/2003EP1129511B1 Electric components for printed boards and method for automatically inserting said components in printed boards
03/19/2003EP1035758B1 Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
03/19/2003EP0678216B1 Electroluminescent lamp devices and their manufacture
03/19/2003CN1404624A Pattern forming method and device and semiconductor device, electric circuit, display element module and luminous element
03/19/2003CN1404535A Composite copper foil and manufacturing method thereof
03/19/2003CN1404494A Modified polyphenylene ether
03/19/2003CN1404354A Electronic element assembling examining method
03/19/2003CN1404353A Making process of printed circuit board with solid copper pins for interconnection
03/19/2003CN1404352A Flexible printing circuit board
03/19/2003CN1404350A Flexible electronic circuit board
03/19/2003CN1404120A Method for removing stain from through-hole
03/19/2003CN1403874A Photo-sensitive conducting resin, conductor pattern forming method and manufacturing method of ceramic laminated structural parts
03/19/2003CN1403628A Method of activating non-conducting base plate for non-electric plating
03/19/2003CN1403561A Diluent composition for washing photosensitive resin
03/19/2003CN1403242A Machining process of aluminium frame for optical mask protecting film
03/19/2003CN1103503C Method for connection beween electronic element and circuit board and its finished products
03/18/2003US6535845 Processing an audio bitstream signal
03/18/2003US6535782 Automatic optioning method for printed circuit boards
03/18/2003US6535602 Telecommunications wiring device
03/18/2003US6535396 Combination circuit board and segmented conductive bus substrate
03/18/2003US6535395 Processor power delivery system
03/18/2003US6535393 Electrical device allowing for increased device densities
03/18/2003US6535237 Manufacture of fluid ejection device
03/18/2003US6535012 Universal wafer carrier for wafer level die burn-in
03/18/2003US6534968 Integrated circuit test vehicle
03/18/2003US6534877 Semiconductor copper bond pad surface protection
03/18/2003US6534875 Semiconductor part for component mounting, mounting structure and mounting method
03/18/2003US6534873 Semiconductor package and printed wiring board for semiconductor package
03/18/2003US6534872 Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging
03/18/2003US6534856 Sockets for “springed” semiconductor devices
03/18/2003US6534848 Electrical coupling of a stiffener to a chip carrier
03/18/2003US6534799 Surface mount light emitting diode package
03/18/2003US6534726 Module substrate and method of producing the same
03/18/2003US6534724 Enhanced design and process for a conductive adhesive
03/18/2003US6534723 Multilayer printed-circuit board and semiconductor device
03/18/2003US6534707 Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating
03/18/2003US6534681 Method for preparing highly stabilized hydroxylamine solutions
03/18/2003US6534419 Method and apparatus for reducing IC die mass and thickness while improving strength characteristics
03/18/2003US6534410 Method for forming conductor members, manufacturing method of semiconductor element and manufacturing method of thin-film magnetic head
03/18/2003US6534391 Semiconductor package having substrate with laser-formed aperture through solder mask layer
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