Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/26/2003EP1295516A2 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures
03/26/2003EP1295344A2 Direct printing of thin-film conductors using metal-chelate inks
03/26/2003EP1295337A1 Process for the manufacture of printed circuit boards with plated resistors
03/26/2003EP1294791A1 Functionalised $g(p)-conjugated polymers, based on 3,4-alkylenedioxythiophene
03/26/2003EP1294443A1 Microcurrent therapy device
03/26/2003EP1245138B1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product
03/26/2003EP1159725B1 Display and backlighting assembly
03/26/2003EP1097618B1 Post-treatment for copper on printed circuit boards
03/26/2003EP1067598B1 Method of packaging semiconductor device using anisotropic conductive adhesive
03/26/2003EP1019986A4 Wiring board constructions and methods of making same
03/26/2003EP0979542B1 Button and dovetail connector actuation mechanism
03/26/2003EP0792519B1 Interconnection elements for microelectronic components
03/26/2003EP0737125B1 Apparatus and process for resin impregnation of a porous web
03/26/2003CN2542020Y Re-current welder
03/26/2003CN1406457A Radio communication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
03/26/2003CN1406454A Production method of circuit board module
03/26/2003CN1406453A 印制电路板 Printed circuit board
03/26/2003CN1406452A A method of forming an opening or cavity in a substrate for receiving an electronic component
03/26/2003CN1406451A Electronic printed-circuit board for electronic devices, especially communications terminals
03/26/2003CN1406385A Laminated circuit board and prodroduction method for electronic part, and laminated electronic part
03/26/2003CN1406288A Pretreating agent for plating and method for metal plating using the same
03/26/2003CN1406262A Adhesive polyimide resin and adhesive laminate
03/26/2003CN1406107A Surface treatment method to improve adhesive force of organic low dielectric constant layer
03/26/2003CN1406106A Hydrogen and scaling-powder-free welding conducted through electronic adsorption
03/26/2003CN1405868A Composite high-density structured substrate and its forming method
03/26/2003CN1405797A Method for forming noble metal film pattern
03/26/2003CN1405339A Method and apparatus for separating oxide
03/26/2003CN1405261A Resin composition, film with adhesive for semiconductor device and semiconductor device with laminated film of metal foil and using same
03/26/2003CN1404987A Metal-foil laminate and producing method thereof, and method for mounting circuit baseboard by same
03/26/2003CN1404969A Operation table for punching device and punching device thereof
03/26/2003CN1104185C Method for manufacturing electronic parts and electronic parts using the method
03/26/2003CN1104184C Vibrator holding device
03/26/2003CN1104182C Terminal installation structure for printed circuit board
03/26/2003CN1104181C Printed circuit board with integrated twisted pair conductor
03/26/2003CN1104180C Method and apparatus for solder stenciling circuit board
03/26/2003CN1103803C Adhesive, liquid crystal device, method of manufacturing liquid crystal device and electronic apparatus
03/26/2003CN1103644C Manual electronic-part mounting apparatus and method
03/25/2003WO2002027746A1 Lamp base comprising an electronic component and a method for producing a lamp base
03/25/2003US6538896 Surface mount type electronic component
03/25/2003US6538878 Bus bar assembly
03/25/2003US6538871 Connecting structure of flat circuit member with reinforced connection boundary
03/25/2003US6538801 Electrophoretic displays using nanoparticles
03/25/2003US6538538 High frequency printed circuit board via
03/25/2003US6538335 Semiconductor apparatus and a semiconductor device mounting method
03/25/2003US6538325 Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics
03/25/2003US6538316 High frequency semiconductor device housing package
03/25/2003US6538311 Two-stage transfer molding method to encapsulate MMC module
03/25/2003US6538310 LSI package with internal wire patterns to connect and mount bare chip to substrate
03/25/2003US6538305 BGA type semiconductor device having a solder-flow damping/stopping pattern
03/25/2003US6538230 Method and apparatus for improving laser hole resolution
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6538213 High density design for organic chip carriers
03/25/2003US6538212 Circuit board for semiconductor device and manufacturing method thereof
03/25/2003US6538211 Multi-layer circuits and methods of manufacture thereof
03/25/2003US6538209 Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin
03/25/2003US6538205 Cable and method of manufacturing it
03/25/2003US6537851 Method of connecting a bumped compliant conductive trace to a semiconductor chip
03/25/2003US6537735 Functionalized polymeric substance has the property that it is developer insoluble prior to delivery of infrared radiation and developer soluble thereafter
03/25/2003US6537720 Transferring a contrasting pattern of intelligence from an ablation-transfer imaging medium to a receptor element in contiguous registration therewith
03/25/2003US6537675 Protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film
03/25/2003US6537608 Protection of a plated through hole from chemical attack
03/25/2003US6537482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
03/25/2003US6537412 Process and apparatus for producing multilayers
03/25/2003US6537411 Simultaneous with graft interfacial free radical polymeri-zation of monomer and crosslinking agent
03/25/2003US6537087 Electrical connector
03/25/2003US6537085 Portable electronic apparatus having external connector fixed at internal circuit board
03/25/2003US6537082 Electrical connector
03/25/2003US6537051 Encapsulation mold with a castellated inner surface
03/25/2003US6536872 Connection module
03/25/2003US6536653 One-step bumping/bonding method for forming semiconductor packages
03/25/2003US6536105 Method for mounting conductive balls on a substrate
03/25/2003CA2423466A1 Lamp base comprising an electronic assembly, and a method for producing a lamp base
03/25/2003CA2174076C Continuous flow dip tinning system
03/20/2003WO2003024174A1 Mulitilayer circuit board, resin base material, and its production method
03/20/2003WO2003024173A1 Method for making conductive circuits using powdered metals
03/20/2003WO2003024172A2 A method of etching copper on cards
03/20/2003WO2003024171A2 Method of treating photoresists using electrodeless uv lamps
03/20/2003WO2003024170A1 An electronic assembly and a method of constructing an electronic assembly
03/20/2003WO2003024168A1 Ceramic electronic component and production method therefor
03/20/2003WO2003024167A1 Pin-free socket compatible with optical-electrical interconnects
03/20/2003WO2003024165A1 Heat dissipating element for electronic components
03/20/2003WO2003024164A2 Clip for replaceable surface mounted devices
03/20/2003WO2003023906A1 Solderless method for transferring high frequency, radio frequency signals between printed circuit boards
03/20/2003WO2003023903A1 Printed wiring board with high density inner layer structure
03/20/2003WO2003023823A2 Stacking of multilayer modules
03/20/2003WO2003023820A2 Boat for ball attach manufacturing process and method of fabricating reliable flip-chip assembly
03/20/2003WO2003023787A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof
03/20/2003WO2003023768A1 Flex on suspension with actuator dynamic function
03/20/2003WO2003023428A1 Test fixture glass etch
03/20/2003WO2003023388A1 Sensor substrate and method of fabricating same
03/20/2003WO2003023082A2 System and process for automated microcontact printing
03/20/2003WO2003022929A1 Flame-retardant heat-resistant resin composition and adhesive film comprising the same
03/20/2003WO2003022778A2 Low temperature cofired ceramics (ltcc) temperature stability
03/20/2003WO2003022581A2 Inkjet deposition apparatus and method
03/20/2003WO2003022571A1 Process for the production of patterned ceramic green-sheets and multilayered ceramic devices
03/20/2003WO2003022569A1 Copper foil with low profile bond enhancement
03/20/2003WO2003022453A1 Apparatus for and method of applying a substance to a substrate
03/20/2003WO2003005616A3 System and method for integrating optical layers in a pcb for inter-board communications
03/20/2003WO2002100140A3 Circuit board with at least one electronic component
03/20/2003WO2002079542A9 Improved adhesion of polymeric materials to metal surfaces
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