| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/17/2003 | US20030073328 Interconnection system |
| 04/17/2003 | US20030072929 Low signal loss bonding ply for multilayer circuit boards |
| 04/17/2003 | US20030072928 Self-aligned corrosion stop for copper C4 and wirebond |
| 04/17/2003 | US20030072927 Method for manufacturing solder mask of printed circuit board |
| 04/17/2003 | US20030072143 Structure for circuit board attaching portion |
| 04/17/2003 | US20030072142 Wiring board with terminals and method for manufacturing the same |
| 04/17/2003 | US20030072140 Resistive element apparatus and method |
| 04/17/2003 | US20030072136 Circuit board and production method therefor |
| 04/17/2003 | US20030072129 Double-sided copper clad laminate for capacitor layer formation and its manufacturing method |
| 04/17/2003 | US20030071395 Conformal-coated pick and place compatible devices |
| 04/17/2003 | US20030071350 High-frequency semiconductor device |
| 04/17/2003 | US20030071349 Electronic circuit unit suitable for miniaturization |
| 04/17/2003 | US20030071330 Strength and durability of a spring structure is increased by providing a stress-balancing pad formed on the unlifted anchor portion of the spring metal finger |
| 04/17/2003 | US20030071112 Solder bump fabrication method and apparatus |
| 04/17/2003 | US20030071014 Method for manufacturing solder mask of printed circuit board |
| 04/17/2003 | US20030071013 Printed circuit board micro hole processing method |
| 04/17/2003 | US20030070934 A metal plating bath comprising metal salts and an additive consumption inhibitor(a heteroatom organic compounds which may contain sulfur, oxygen or nitrogen heteroatoms) improve the brightness of plated metal as well as the ductility |
| 04/17/2003 | US20030070931 Selective plating of printed circuit boards |
| 04/17/2003 | US20030070839 Interconnect structure and method of making same |
| 04/17/2003 | US20030070838 Multilayer printed wiring board and its manufacturing method |
| 04/17/2003 | US20030070837 Wiring connection structure and transmitter using the same |
| 04/17/2003 | US20030070836 PGA chip package and process for same |
| 04/17/2003 | US20030070835 Printed circuit board having permanent solder mask |
| 04/17/2003 | US20030070834 Integrated lead suspension and method of construction |
| 04/17/2003 | US20030070760 Method and apparatus having plate electrode for surface treatment using capillary discharge plasma |
| 04/17/2003 | US20030070747 Printing a pattern of a metal composition on a thermally resistant temporary substrate, curing and transferring the patterned metal objects to one side of the substrate |
| 04/17/2003 | US20030070292 Circuit board, method for manufacturing same, and high-output module |
| 04/17/2003 | US20030070290 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 04/17/2003 | US20030070288 Method and device for aligning an image sensor |
| 04/17/2003 | US20030070287 Method of attaching printed circuit boards within an electronic module housing |
| 04/17/2003 | DE20300336U1 Plastic film for integrated circuit boards comprises vertical metal wires which connect an integrated circuit to a conductor plate via soldered joints |
| 04/17/2003 | CA2391492A1 Circuit board, method for manufacturing same, and high-output module |
| 04/16/2003 | EP1303175A1 Device for plugging holes in printed circuit boards |
| 04/16/2003 | EP1303172A2 Fluid material filling apparatus and related filling method |
| 04/16/2003 | EP1303171A2 Electronic circuit unit suitable for miniaturization |
| 04/16/2003 | EP1302895A2 Conductive electrical element and antenna with ink additive technology |
| 04/16/2003 | EP1302894A2 Contactless chipcard and manufacturing process |
| 04/16/2003 | EP1302569A2 Stripping solution |
| 04/16/2003 | EP1302496A1 Insulating resin composition, adhesive resin composition and adhesive sheeting |
| 04/16/2003 | EP1302247A1 Device for plugging holes in printed circuit boards |
| 04/16/2003 | EP1302094A1 Method for producing an electrical and/or mechanical connection between flexible thin-film substrates |
| 04/16/2003 | CN2545794Y Location resilient piece |
| 04/16/2003 | CN1411593A Display and backlighting assembly |
| 04/16/2003 | CN1411333A Electronic element welder and method, circuit board and electronic element mounting device |
| 04/16/2003 | CN1411331A Fluid material filling device and filling method thereof |
| 04/16/2003 | CN1411330A Printed wiring substrate structure and mfg. method thereof |
| 04/16/2003 | CN1411329A Circuit substrate connecting structure, liquid crystal display with same and mounting method |
| 04/16/2003 | CN1411328A Flexible printed circuit board and mfg. method thereof |
| 04/16/2003 | CN1411327A Flexible printed circuid board |
| 04/16/2003 | CN1411056A Film substrate, semiconductor device, circuit substrate and mfg. method thereof |
| 04/16/2003 | CN1411055A Wiring substrate for small electronic unit and mfg. method thereof |
| 04/16/2003 | CN1411010A Method for mfg. laminated ceramic electronic device, assembly electronic device and laminated ceramic electronic device |
| 04/16/2003 | CN1410953A Wiring substrate and mfg. method and image display thereof |
| 04/16/2003 | CN1410262A High efficiency production method of double layer circuit soft board |
| 04/16/2003 | CN1410174A Method and apparatus for washing substrate and member mounting method |
| 04/16/2003 | CN1106135C Method for forming coarse inversion coating on metal surface |
| 04/16/2003 | CN1105988C Process for producing smart card module for contactless smart cards |
| 04/16/2003 | CN1105856C Conducting tape and mfg. method thereof |
| 04/16/2003 | CN1105749C Conductive epoxy resin compositions and application thereof |
| 04/16/2003 | CN1105619C Unleaded solder powder and production method therefor |
| 04/15/2003 | US6550037 Method for designing a decoupling circuit |
| 04/15/2003 | US6549427 Circuit trace termination and method |
| 04/15/2003 | US6549420 Method and apparatus for increasing memory capacity |
| 04/15/2003 | US6549419 Electronic substrate and method for manufacturing electronic equipment using the same |
| 04/15/2003 | US6549418 Land grid array integrated circuit device module |
| 04/15/2003 | US6549409 Power converter assembly |
| 04/15/2003 | US6549348 Optical scanning device |
| 04/15/2003 | US6548972 Control unit and method of manufacturing the same |
| 04/15/2003 | US6548909 Method of interconnecting electronic components using a plurality of conductive studs |
| 04/15/2003 | US6548898 External connection terminal and semiconductor device |
| 04/15/2003 | US6548897 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 04/15/2003 | US6548827 Electroconductivity; positioning; accuracy |
| 04/15/2003 | US6548790 Apparatus for manufacturing solid solder deposit PCBs |
| 04/15/2003 | US6548767 Multi-layer printed circuit board having via holes formed from both sides thereof |
| 04/15/2003 | US6548766 Printed wiring board for attachment to a socket connector, having recesses and conductive tabs |
| 04/15/2003 | US6548765 Mounting structure of electronic component on substrate board |
| 04/15/2003 | US6548758 Electronic component and manufacturing method thereof |
| 04/15/2003 | US6548602 Polymeric film compositions having controlled viscosity response to temperature and shear |
| 04/15/2003 | US6548576 Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 04/15/2003 | US6548393 Semiconductor chip assembly with hardened connection joint |
| 04/15/2003 | US6548328 Circuit device and manufacturing method of circuit device |
| 04/15/2003 | US6548224 Wiring substrate features having controlled sidewall profiles |
| 04/15/2003 | US6548207 Thin-profile battery circuits and constructions, button-type battery circuits and constructions |
| 04/15/2003 | US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| 04/15/2003 | US6548153 Composite material used in making printed wiring boards |
| 04/15/2003 | US6548152 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 04/15/2003 | US6548122 Depositing metal precursor on substrate, adding energy to reduce metal precursor and precipitate metal on substrate as a continuous metal layer |
| 04/15/2003 | US6548106 Providing mask formed in rear surface with recess and formed in given area with plurality of through-holes extending to recess, through holes being provided with mesh, disposing mask adjacent to circuit board, applying corrosion inhibitor |
| 04/15/2003 | US6547974 Method of producing fine-line circuit boards using chemical polishing |
| 04/15/2003 | US6547946 Processing a printed wiring board by single bath electrodeposition |
| 04/15/2003 | US6547879 Electrode forming apparatus for electric parts |
| 04/15/2003 | US6547597 Apparatus and method for incorporating surface mount components into connectors |
| 04/15/2003 | US6547124 Method for forming a micro column grid array (CGA) |
| 04/15/2003 | US6547122 Method of mounting components on a plurality of abutted circuit board |
| 04/15/2003 | US6546833 Flexible circuit cutting apparatus and method having indexing and registration mechanism |
| 04/15/2003 | US6546624 Drilling using Yag laser |
| 04/15/2003 | US6546622 Printed-wiring substrate and method for fabricating the same |
| 04/15/2003 | US6546620 Flip chip integrated circuit and passive chip component package fabrication method |
| 04/15/2003 | CA2425983A1 Coated particle |
| 04/15/2003 | CA2228152C Conductive device |