| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/30/2003 | CN2548296Y Soket connector pick-and-plate apparatus |
| 04/30/2003 | CN1414828A Electronic module and its producing method |
| 04/30/2003 | CN1414827A Substrate conducting wiring cutting method and device, electronic device manufacturing method and device |
| 04/30/2003 | CN1414826A Surface mounting base for printed circuit board assembly |
| 04/30/2003 | CN1414824A Improved structure of circuit anti-interference device |
| 04/30/2003 | CN1414823A Substrate detecting device |
| 04/30/2003 | CN1414822A Preimpregnation material block and circuit substrate and their manufacture method |
| 04/30/2003 | CN1414630A Semiconductor chip and wiring base plate and manufactaring method, semiconductor chip, semiconductor device |
| 04/30/2003 | CN1414431A Marking equipment used in manufacturing process of multi-layer printed circuit board |
| 04/30/2003 | CN1107421C Matrix patch board and its producing method |
| 04/30/2003 | CN1107336C Multi-layer circuit substrate and mfg. method thereof |
| 04/30/2003 | CN1106905C Method for encapsulating solder metal powders and solder metal powders produced to this method |
| 04/30/2003 | CA2410328A1 A device for exposing a face of a panel |
| 04/29/2003 | US6557154 Printed circuit board design support system, printed circuit board design method and storage medium storing control program for same |
| 04/29/2003 | US6556455 Ultra-low impedance power interconnection system for electronic packages |
| 04/29/2003 | US6556419 Electronic component and method for producing same |
| 04/29/2003 | US6556293 Optical inspection of laser vias |
| 04/29/2003 | US6556269 Connection assembly for reflective liquid crystal display and method |
| 04/29/2003 | US6556268 Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB |
| 04/29/2003 | US6555920 Vertical electronic circuit package |
| 04/29/2003 | US6555914 Comprises reduced parasitic capacitance; constructed as electroconductive laminated layers |
| 04/29/2003 | US6555913 Electronic component having a coil conductor with photosensitive conductive paste |
| 04/29/2003 | US6555908 Compliant, solderable input/output bump structures |
| 04/29/2003 | US6555906 Microelectronic package having a bumpless laminated interconnection layer |
| 04/29/2003 | US6555782 Laser machining method, laser machining apparatus, and its control method |
| 04/29/2003 | US6555763 Multilayered circuit board for semiconductor chip module, and method of manufacturing the same |
| 04/29/2003 | US6555762 Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition |
| 04/29/2003 | US6555761 Printed circuit board with solder-filled via |
| 04/29/2003 | US6555760 Electronic circuit interconnection system using a virtual mirror cross over package |
| 04/29/2003 | US6555758 Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like |
| 04/29/2003 | US6555757 Pin solder jointed to a resin substrate, made having a predetermined hardness and dimensions |
| 04/29/2003 | US6555756 Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof |
| 04/29/2003 | US6555746 Horizontal component retention socket |
| 04/29/2003 | US6555592 Epoxidized novolak phenolic resin modified with an unsaturated monobasic carboxylic acid, a dibasic acid, and an acid anhydride, a photopolymerizable monomer, photoinitiator and an epoxy novolak resin; use as solder mask |
| 04/29/2003 | US6555462 Semiconductor device having stress reducing laminate and method for manufacturing the same |
| 04/29/2003 | US6555444 Device and method for core buildup using a separator |
| 04/29/2003 | US6555415 Electronic configuration with flexible bonding pads |
| 04/29/2003 | US6555414 Flip-chip assembly of semiconductor devices using adhesives |
| 04/29/2003 | US6555296 Providing wafer that has contact pads exposed by a passivation layer formed on surface of wafer; forming a first mask film having a openings; filling solder material in openings; reflowing solder material into solder posts |
| 04/29/2003 | US6555239 Polymer-coated metal composites by dip autopolymerization |
| 04/29/2003 | US6555209 Method of manufacturing multilayer wiring board |
| 04/29/2003 | US6555208 Printed wiring board and method of manufacturing the same |
| 04/29/2003 | US6555178 Process and apparatus for nickel plating and nickel-plated product |
| 04/29/2003 | US6555174 Impregnating a glass fiber substrate; curing; heating |
| 04/29/2003 | US6555170 Coating substrate with solution of film forming amine and acid prior to plating; increased speed and efficiency |
| 04/29/2003 | US6555158 Removing organic material from a plating region, surface hydrophilizing the plating region, bonding a coupling agent to the surface, bonding catalytic metal with the coupling agent, exposing said metal and electrolessly plating |
| 04/29/2003 | US6555052 Electron device and semiconductor device |
| 04/29/2003 | US6555016 Method of making multilayer substrate |
| 04/29/2003 | US6555015 Multi-layer printed circuit board and method of making same |
| 04/29/2003 | US6554948 Treating copper surfaces with an oxidizer, an acid, a corrosion inhibitor, and a benzotriazole with an electron withdrawing group in the 1-position which is a stronger electron withdrawer than a hydrogen group |
| 04/29/2003 | US6554654 Multi-pin edge connector for circuit board |
| 04/29/2003 | US6554244 Device for thermally, stably supporting a miniaturized component |
| 04/29/2003 | US6554195 Dual processor adapter card |
| 04/29/2003 | US6554180 Tombstoning prevented by the use of a twin-peak solder alloy. |
| 04/29/2003 | US6553905 Sliding and pressurizing feeders having solders or conductive pastes to create patterns on substrates |
| 04/29/2003 | US6553662 Method of making a high-density electronic circuit |
| 04/29/2003 | US6553660 Electronic device and a method of manufacturing the same |
| 04/24/2003 | WO2003034798A1 Method of manufacturing circuit formed substrate |
| 04/24/2003 | WO2003034636A2 High speed, controlled impedance air dielectric electronic backplane systems |
| 04/24/2003 | WO2003034494A1 Module component |
| 04/24/2003 | WO2003034488A1 Substrate and method for producing the same |
| 04/24/2003 | WO2003034446A2 Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby |
| 04/24/2003 | WO2003034130A2 Methods of fabricating patterned layers on a substrate |
| 04/24/2003 | WO2003033776A1 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields. |
| 04/24/2003 | WO2003033775A1 Method of copper-plating small-diameter holes |
| 04/24/2003 | WO2003033774A1 Submerged transfer plating device with plating fluid jetting tube |
| 04/24/2003 | WO2003033773A1 Selective plating of printed circuit boards |
| 04/24/2003 | WO2003033770A2 System and method for electrolytic plating |
| 04/24/2003 | WO2003033764A2 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 04/24/2003 | WO2003005784A3 Conductor track structures and method for the production thereof |
| 04/24/2003 | WO2003005437A3 Interconnect system and method of fabrication |
| 04/24/2003 | WO2002090117B1 Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink |
| 04/24/2003 | US20030078482 Diagnosis probe |
| 04/24/2003 | US20030078322 Conductive resin compositions and electronic parts using the same |
| 04/24/2003 | US20030077924 High-frequency wiring board |
| 04/24/2003 | US20030077852 Method of fabricating reliable laminate flip-chip assembly |
| 04/24/2003 | US20030077846 Positioning arrangement and method |
| 04/24/2003 | US20030077529 Preetching; exposure of photoresist, calibration; automatic optics detection |
| 04/24/2003 | US20030076667 Vertical surface mount assembly |
| 04/24/2003 | US20030076665 Electrical device allowing for increased device densities |
| 04/24/2003 | US20030076663 Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein |
| 04/24/2003 | US20030076660 Electronic device and a circuit arrangement |
| 04/24/2003 | US20030076649 Method of forming an electronic device |
| 04/24/2003 | US20030075798 Transcribing original substrate for a wiring pattern |
| 04/24/2003 | US20030075724 Wing-shaped surface mount package for light emitting diodes |
| 04/24/2003 | US20030075589 Method of mounting components on a plurality of abutted circuit board |
| 04/24/2003 | US20030075532 Circuit formation by laser ablation of ink |
| 04/24/2003 | US20030075450 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields |
| 04/24/2003 | US20030075357 Structure of a ball-grid array package substrate and processes for producing thereof |
| 04/24/2003 | US20030075356 Electronic device and method of manufacturing the same |
| 04/24/2003 | US20030075353 Anti-abrasive flat flexible cable |
| 04/24/2003 | US20030075270 Disposing an adhesion promoting elastomer layer between a copper foil and a circuit substrate material and laminating to form circuit material |
| 04/24/2003 | US20030075162 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements |
| 04/24/2003 | US20030075102 System for inverting substrates |
| 04/24/2003 | US20030074790 Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board |
| 04/24/2003 | DE20121710U1 Mounting frame for templates used in the production of printed circuit electronic boards |
| 04/24/2003 | DE20120478U1 Mounting elements for circuit boards has ends of boards locating on retaining features |
| 04/24/2003 | DE10203803C1 Printed antenna, used for chip card or transponder, comprises an intrinsically-conducting plastic |
| 04/23/2003 | EP1304912A1 Holding device for at least two electronic components placed on opposite sides of a circuit board |
| 04/23/2003 | EP1304910A1 Switching circuit with improved signal blocking effect in off mode |