| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/23/2003 | EP1304909A1 High-frequency semiconductor device |
| 04/23/2003 | EP1304768A2 Spring structure |
| 04/23/2003 | EP1304740A2 Circuit board, method for manufacturing same, and high-output module |
| 04/23/2003 | EP1304543A1 Positioning with conductive indicia ( silicon optical bench ) |
| 04/23/2003 | EP1304022A1 Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration |
| 04/23/2003 | EP1303898A2 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 04/23/2003 | EP1303575A1 Liquid crystal polymers for flexible circuits |
| 04/23/2003 | EP1303553A2 Radiation-curable compositions and cured articles |
| 04/23/2003 | EP1177641A4 Energy conditioning circuit assembly |
| 04/23/2003 | EP1153309B1 Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board |
| 04/23/2003 | EP1138070B1 Low alpha emissive solder bumps |
| 04/23/2003 | EP1097614B1 Method for coating printed circuit boards or similar substrates |
| 04/23/2003 | EP1088345B1 System and method for determining the desired decoupling components for power distribution systems using a computer system |
| 04/23/2003 | EP1044082B1 Method for fixing miniaturised components onto a base plate by soldering |
| 04/23/2003 | EP1007980B1 Printed circuit board testing device |
| 04/23/2003 | EP0950082B1 Reducing void formation in curable adhesive formulations |
| 04/23/2003 | EP0880146B1 Anisotropic conductive composition |
| 04/23/2003 | EP0792518B1 Method for fabricating a self-limiting silicon based interconnect for testing bare semiconductor dice |
| 04/23/2003 | CN2547095Y Double-screw bolt package assembly capable of being absorbed by automatic tool |
| 04/23/2003 | CN2547092Y 布线电路板 Wiring circuit board |
| 04/23/2003 | CN1413429A Multilayer printed wiring board and method of manufacturing the same |
| 04/23/2003 | CN1413428A Switchable wavelength laser-based etched circuit board processing system |
| 04/23/2003 | CN1413427A 多层印刷电路板 Multilayer printed circuit board |
| 04/23/2003 | CN1413080A Justification method of influence sensor and its equipment |
| 04/23/2003 | CN1413075A Method for preventing production of tin ball and its mould |
| 04/23/2003 | CN1413074A Method for recovering printed circuit board by utilizing stepped adhesion structure |
| 04/23/2003 | CN1413073A Method of producing ceramic element for bonding, ceramic element for bonding, vacuum switch and vacuum container |
| 04/23/2003 | CN1413072A Circuit board for cross-connected electric connector and its production method |
| 04/23/2003 | CN1412838A High frequency semiconductor device |
| 04/23/2003 | CN1412836A Circuit board and its manufacturing method and high output module |
| 04/23/2003 | CN1412614A Display board and liquid crystal display with the same |
| 04/23/2003 | CN1411981A Transferred copper foil base plate making method |
| 04/23/2003 | CN1411920A Negative pressure plasma device and cleaning method |
| 04/23/2003 | CN1106790C Circuit components and making method thereof |
| 04/23/2003 | CN1106788C 电路基片 Circuit substrate |
| 04/23/2003 | CN1106787C Flexible printed circuit and making method thereof |
| 04/23/2003 | CN1106418C Sealant use in welding flux connecting piece of sealed electron package device and sealing method |
| 04/23/2003 | CN1106273C Soluble-fusible phenolic resin with improved optical properties |
| 04/23/2003 | CN1106239C Entry board for drilling small holes, method of making same and method for drilling small holes |
| 04/22/2003 | US6552783 Optical system |
| 04/22/2003 | US6552564 Technique to reduce reflections and ringing on CMOS interconnections |
| 04/22/2003 | US6552558 Testing fastenings of printed circuit board |
| 04/22/2003 | US6552436 Nonsoldermask defined bonding pads; attaching to printed circuit board with improved bending reliability and temperature cycling tolerance |
| 04/22/2003 | US6552425 Integrated circuit package |
| 04/22/2003 | US6552384 Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed |
| 04/22/2003 | US6552352 Aligner |
| 04/22/2003 | US6552277 Techniques for forming a connection between a pin and a circuit board |
| 04/22/2003 | US6552276 Board integrated resilient contact elements array and method of fabrication |
| 04/22/2003 | US6552275 Surface mount component |
| 04/22/2003 | US6552274 Wire laying plate assembly and a molding process for an insulation plate |
| 04/22/2003 | US6552272 Anti-abrasive flat flexible cable |
| 04/22/2003 | US6552265 Printed board assembly and method of its manufacture |
| 04/22/2003 | US6551931 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
| 04/22/2003 | US6551917 Method of locating conductive spheres utilizing screen and hopper of solder balls |
| 04/22/2003 | US6551860 Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| 04/22/2003 | US6551844 Test assembly including a test die for testing a semiconductor product die |
| 04/22/2003 | US6551763 Method for manufacture of electronic parts |
| 04/22/2003 | US6551753 Forming electrostatic latent image on one side, statically charging side that does not have electrostatic latent image to surface potential of 80V before developing electrostatic latent image side, reversal developing image side with toner |
| 04/22/2003 | US6551697 Printed circuit board, method of making same, and photomask for use in the method |
| 04/22/2003 | US6551650 Dip formation of flip-chip solder bumps |
| 04/22/2003 | US6551552 Comprises gas impermeable enclosure comprising shell adapted to maintain pressure differences with exterior containing desiccant, corrosion inhibitor, and/or inert gas; storage stability |
| 04/22/2003 | US6551488 Segmenting of processing system into wet and dry areas |
| 04/22/2003 | US6551484 Connecting an electric source between an anode immersed in an electrolyte solution and a seed layer formed on the substrate |
| 04/22/2003 | US6551449 Thin electronic circuit component and method and apparatus for producing the same |
| 04/22/2003 | US6551433 Method for producing copper-clad laminate |
| 04/22/2003 | US6551427 Method for manufacturing ceramic substrate and non-fired ceramic substrate |
| 04/22/2003 | US6551345 Protection apparatus for implantable medical device |
| 04/22/2003 | US6551149 Connecting terminal and method of mounting the same onto a circuit board |
| 04/22/2003 | US6551143 Battery connector |
| 04/22/2003 | US6551112 Test and burn-in connector |
| 04/22/2003 | US6550835 Method and apparatus for supporting an electrical circuit board in a vehicle panel closure |
| 04/22/2003 | US6550667 Flux composition and soldering method for high density arrays |
| 04/22/2003 | US6550662 Chip rework solder tool |
| 04/22/2003 | US6550377 Hot press apparatus |
| 04/22/2003 | US6550136 Method of fabricating printed wiring board |
| 04/22/2003 | US6550135 Method of part mounting |
| 04/22/2003 | US6550117 Multilayer ceramic electronic element and manufacturing method therefor |
| 04/17/2003 | WO2003032701A1 Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured by the same |
| 04/17/2003 | WO2003032700A1 Method for manufacturing wiring board |
| 04/17/2003 | WO2003032699A1 Carrier-attached copper foil and printed board using the copper foil |
| 04/17/2003 | WO2003032697A1 Electronic parts |
| 04/17/2003 | WO2003032696A1 Microwave circuit substrate and its production method |
| 04/17/2003 | WO2003032695A1 Electrical circuit and method of formation |
| 04/17/2003 | WO2003032389A1 Voltage conversion module |
| 04/17/2003 | WO2003032386A1 High-frequency module board device |
| 04/17/2003 | WO2003032334A1 Thick-film sheet member, its applied device, and methods for manufacturing them |
| 04/17/2003 | WO2003032245A1 Chip card and method for producing a chip card of this type |
| 04/17/2003 | WO2003032241A1 Electronic module with protective bump |
| 04/17/2003 | WO2003032090A1 Photosensitive resin composition |
| 04/17/2003 | WO2003032089A1 Photosensitive resin composition and printed circuit board |
| 04/17/2003 | WO2003032088A1 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 04/17/2003 | WO2003032087A2 Aqueous developable photoimageable thick film compositions |
| 04/17/2003 | WO2003032084A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 04/17/2003 | WO2003031372A2 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate. |
| 04/17/2003 | WO2003031101A1 Highly filled composites of powdered fillers and polymer matrix |
| 04/17/2003 | WO1999060829A3 Method and apparatus for making electrical traces, circuits and devices |
| 04/17/2003 | US20030074638 Design support apparatus for circuit including directional coupler, design support tool, method of designing circuit, and circuit board |
| 04/17/2003 | US20030074193 Data processing of a bitstream signal |
| 04/17/2003 | US20030073349 Structure of joining chip part to bus bars |
| 04/17/2003 | US20030073330 Device for retaining at least two electronic components disposed opposite each other on each side of a connection board |