Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2003
05/02/2003EP1307077A1 Adhesive film and method for manufacturing multilayer printed wiring board comprising the same
05/02/2003EP1307076A1 Structure for interconnecting conductors and connecting method
05/02/2003EP1307075A2 Prepreg and circuit board and method for manufacturing the same
05/02/2003EP1306902A1 High-frequency module and its manufacturing method
05/02/2003EP1306899A1 Wiring method and element arranging method using the same, and method of producing image display devices
05/02/2003EP1306897A2 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
05/02/2003EP1306466A2 Electroless gold plating composition
05/02/2003EP1306160A1 Laser drilling method
05/02/2003EP1305989A2 Circuit board protection method and apparatus
05/02/2003EP1305988A1 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner
05/02/2003EP1305987A1 Adhesive bonding of printed circuit boards to heat sinks
05/02/2003EP1305829A1 Solder bar for high power flip chips
05/02/2003EP1305258A2 Ceramic microelectromechanical structure
05/02/2003EP1198352B1 Method and apparatus for dispensing viscous material
05/02/2003EP1190374B1 High-reliability touch panel
05/02/2003EP1115563A4 Phenol-novolacs with improved optical properties
05/02/2003EP1007596B1 Contact Printable Adhesive Composition and Methods of Making Thereof
05/02/2003EP0857402A4 High performance flexible laminate
05/02/2003EP0734303B1 Heat-transfer device for use in a convective-heat installation, in particular a convective-heat soldering installation
05/02/2003EP0710177B1 Circuit board material with barrier layer
05/02/2003CA2426866A1 Securing electrical conductors
05/01/2003WO2003037057A1 Element for electromagnetic shielding and method for manufacturing thereof
05/01/2003WO2003037053A1 Chip scale stacking system and method
05/01/2003WO2003037051A1 Object consisting of several individual parts, especially an electronic or electrotechnical device
05/01/2003WO2003037050A1 Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method
05/01/2003WO2003037049A1 Circuit formation by laser ablation of ink
05/01/2003WO2003036763A2 Bending a tab flex circuit via cantilevered leads
05/01/2003WO2003036689A2 Anti-tombstoning structures and methods of manufacture
05/01/2003WO2003036686A2 Method of patterning electrically conductive polymers
05/01/2003WO2003036685A2 Method and apparatus for applying conductive ink onto semiconductor substrates
05/01/2003WO2003036664A1 Multilayer circuit and method of manufacturing
05/01/2003WO2003036387A2 Method of forming a pattern of sub-micron broad features
05/01/2003WO2003035930A1 Surface treatment for copper foil
05/01/2003WO2003035766A1 Photo-curable and thermosetting resin composition
05/01/2003WO2003035543A1 A method of fabrication of micro-devices
05/01/2003WO2003035386A1 Integrated microfluidic, optical and electronic devices and method for manufacturing
05/01/2003WO2003035308A1 Monodisperse metal spherical particle and production method thereof
05/01/2003WO2003035281A2 Ultrasonic printed circuit board transducer
05/01/2003WO2003035279A1 Tape compositions for the deposition of electronic features
05/01/2003WO2003035277A1 System for inverting substrate
05/01/2003WO2002101830A3 Electronic components with plurality of contoured microelectronic spring contacts
05/01/2003WO2002100138B1 Electronic component-use material and electronic componsnet usint it
05/01/2003US20030084415 System and method for evaluation of electric characteristics of printed-circuit boards
05/01/2003US20030083856 Model analyzing method and apparatus, and storage medium
05/01/2003US20030083458 Method and apparatus of producing high-density polyidimide (HPI) film
05/01/2003US20030083455 Room temperature curable organopolysiloxane compositions
05/01/2003US20030083452 Adhesion promoters or curable compositions
05/01/2003US20030083203 Apparatus and methods for forming film pattern
05/01/2003US20030082938 Circuit board connector with improved terminal tails
05/01/2003US20030082932 Electrical connector assembly
05/01/2003US20030082931 Electrical connector and terminal for flat circuitry
05/01/2003US20030082898 Ball grid array X-ray orientation mark
05/01/2003US20030082897 Method for forming bumps, semiconductor device, and solder paste
05/01/2003US20030082896 Hole metal-filling method
05/01/2003US20030082853 Electrical coupling of a stiffener to a chip carrier
05/01/2003US20030082848 Semiconductor device and manufacturing method
05/01/2003US20030082363 Prepreg and circuit board and method for manufacturing the same
05/01/2003US20030082356 Metal filling method and member with filled metal sections
05/01/2003US20030082355 Photopoilymerization; anhydride crosslinked phenolic resin
05/01/2003US20030081719 Marking apparatus used in a process for producing multi-layered printed circuit board
05/01/2003US20030081647 Methods and systems for forming a die package
05/01/2003US20030081394 Electronic-part mounting structure and mounting method therefor
05/01/2003US20030081393 Resin-formed substrate and resin-formed substrate unit
05/01/2003US20030081392 Integrated circuit stacking system and method
05/01/2003US20030081387 Module and connector having multiple contact rows
05/01/2003US20030081195 Device for exposing a face of a panel
05/01/2003US20030081066 Bending a tab flex circuit via cantilevered leads
05/01/2003US20030081065 Limiting unwanted ink penetration of flexible circuits of fluid ejection devices
05/01/2003US20030080836 High frequency circuit module
05/01/2003US20030080835 High frequency printed circuit board via
05/01/2003US20030080826 Method of shortening a microwave circuit and the printed circuit board made by using said method
05/01/2003US20030080819 Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
05/01/2003US20030080770 Method for universal wafer carrier for wafer level die burn-in
05/01/2003US20030080424 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same
05/01/2003US20030080420 Bumps formed on the pads, wherein each of the bumps is a single layer disposed on a part of each of the pads exposed from the passivation film, and on the passivation film; bump formed by electroless plating
05/01/2003US20030080415 Cross-over for quasi-coaxial transmission lines fabricated on a substrate
05/01/2003US20030080409 Multilayered substrate for semiconductor device
05/01/2003US20030080408 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
05/01/2003US20030080397 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
05/01/2003US20030080175 Soldering apparatus
05/01/2003US20030080174 Header for surface mount between parallel circuit boards
05/01/2003US20030080108 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus
05/01/2003US20030080092 Rework method for finishing metallurgy on chip carriers
05/01/2003US20030079911 Discrete solder ball contact and circuit board assembly utilizing same
05/01/2003US20030079910 Current carrying structure using voltage switchable dielectric material
05/01/2003US20030079909 Stacking multiple devices using direct soldering
05/01/2003US20030079907 Card edge connector, method of manufacturing same, electronic card and electronic equipment
05/01/2003US20030079896 Electronic component mounted member and repair method thereof
05/01/2003US20030079680 Method for mounting a semiconductor device
05/01/2003US20030079627 Screening apparatus with trailing squeegee and method of screening
05/01/2003US20030079624 Etch resist using printer technology
05/01/2003US20030079369 Process and apparatus for drying drying a thick film layer
05/01/2003US20030079341 Method for connecting printed circuit boards and connected printed circuit boards
05/01/2003US20030079335 Manufacturing method for legless electronics parts
05/01/2003CA2469463A1 Circuit formation by laser ablation of ink
05/01/2003CA2464582A1 A method of fabrication of micro-devices
04/2003
04/30/2003DE20302059U1 Connection pins for electronic components soldered onto a printed circuit board
04/30/2003DE10202077C1 Circuit board component fixing device uses fixing pin of component secured in seat of printed circuit board by solder
04/30/2003CN2548391Y Tin-soldered pin
04/30/2003CN2548390Y Angular pin
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