Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2003
04/15/2003CA2043337C Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation
04/10/2003WO2003030609A1 Electric apparatus comprising shield structure
04/10/2003WO2003030602A1 Multi-layered circuit wiring plate, ic package, and production method of multi-layered circuit wiring plate
04/10/2003WO2003030601A1 Electronic circuit comprising conductive bridges and method for making such bridges
04/10/2003WO2003030600A1 Printed wiring board and production method for printed wiring board
04/10/2003WO2003030599A1 Copper foil with carrier and printed board comprising this copper foil
04/10/2003WO2003030597A2 Machine and installation for tracing on a support
04/10/2003WO2003030259A1 Semiconductor device and method of manufacturing the device
04/10/2003WO2003030257A2 Soldered heat sink anchor and method of use
04/10/2003WO2003030252A2 Process for producing interconnects
04/10/2003WO2003030248A2 Method of mounting an electronic device on a substrate by a laser beam
04/10/2003WO2003030247A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
04/10/2003WO2003030246A2 Device for soldering contacts on semiconductor chips
04/10/2003WO2003030193A1 Multiple terminal smt-bga-style wound capacitor
04/10/2003WO2003030186A2 Nickel coated copper as electrodes for embedded passive devices
04/10/2003WO2003029519A1 Method for producing metal plated plastic article
04/10/2003WO2003029518A2 Precious metal recovery
04/10/2003WO2003029255A1 Vinyl silane compounds containing epoxy functionality
04/10/2003WO2003028991A1 Machine for converting synthetic or natural resins or rubbers
04/10/2003WO2003028972A1 Cushioning material for hot pressing and process for producing the same
04/10/2003WO2003028932A1 Processing device, processing method, and production equipment using the device and the method
04/10/2003WO2002089338A3 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
04/10/2003WO2002048430A3 Oxide-reducing agent composition, system and process
04/10/2003US20030068920 High density, high frequency memory chip modules having thermal management structures
04/10/2003US20030068916 Structure of a ball grid array ic scoket connection with solder ball
04/10/2003US20030068905 Bump contact force concentration system and method
04/10/2003US20030068877 Circuit boards containing vias and methods for producing same
04/10/2003US20030068847 Semiconductor device and manufacturing method
04/10/2003US20030068839 Forming solder walls and interconnects on a substrate
04/10/2003US20030068581 Formation of a hydrophilic/ hydrophobic region directly bonded to the support surface as the result of energy is imparted imagewise to the pattern-forming material
04/10/2003US20030068567 Photosensitive resin composition and printed wiring board
04/10/2003US20030068537 Metal/ceramic circuit board
04/10/2003US20030068532 Metal/ceramic bonding article
04/10/2003US20030068520 Laminate
04/10/2003US20030068517 Nickel coated copper as electrodes for embedded passive devices
04/10/2003US20030068504 Electronic device comprising a layer of flame retardant pressure sensitive adhesive mounted on surface, covering with a fireproofed conformal polysiloxane coatings
04/10/2003US20030068480 Method for forming patterns for semiconductor devices
04/10/2003US20030067756 Electrical service distribution board
04/10/2003US20030067755 Electronic component with flexible contacting pads and method for producing the electronic component
04/10/2003US20030067730 Universial energy conditioning interposer with circuit architecture
04/10/2003US20030067576 Liquid crystal display device and method of making the same
04/10/2003US20030067415 Conductive electrical element and antenna with ink additive technology
04/10/2003US20030067313 Electronic device and coupler
04/10/2003US20030067310 Apparatus monitoring the deposition of a liquid-to-pasty medium on a substrate
04/10/2003US20030067082 Apparatus and methods for stacking integrated circuit devices with interconnected stacking structure
04/10/2003US20030067080 Sockets for "springed" semiconductor devices
04/10/2003US20030067074 Circuit boards containing vias and methods for producing same
04/10/2003US20030067068 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
04/10/2003US20030067060 Routing element for use in multichip modules, multichip modules including the routing element, and methods
04/10/2003US20030067056 Multilayer interconnect board and multilayer semiconductor device
04/10/2003US20030066866 Method for local application of solder to preselected areas on a printed circuit board
04/10/2003US20030066865 Method for producing metal/ceramic bonding circuit board
04/10/2003US20030066756 Plating bath and method for depositing a metal layer on a substrate
04/10/2003US20030066754 Method for manufacturing copper-resin composite material
04/10/2003US20030066683 Circuit board and production of the same
04/10/2003US20030066682 Printed circuit board electrical interconnects
04/10/2003US20030066681 Solder paste and terminal-to-terminal connection structure
04/10/2003US20030066680 Terminal electrode of thin-film device with improved mounting strength, manufacturing method for the same, and thin-film magnetic head
04/10/2003US20030066679 Electrical circuit and method of formation
04/10/2003US20030066678 Heating, controlling temperature; flexible printed cables; fitting into pivot-rotation device
04/10/2003US20030066572 Fluid material filling apparatus and related filling method
04/10/2003US20030066540 Semi-aqueous solvent cleaning of paste processing residue from substrates
04/10/2003CA2460015A1 Precious metal recovery
04/09/2003EP1301061A2 Flexible electrical interconnect for optical fibre transceivers
04/09/2003EP1300488A2 Plating path and method for depositing a metal layer on a substrate
04/09/2003EP1300487A1 Plating bath and method for depositing a metal layer on a substrate
04/09/2003EP1300486A1 Plating bath and method for depositing a metal layer on a substrate
04/09/2003EP1300377A2 Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel
04/09/2003EP1300066A1 Method of producing plants, plant cultivating device, and light-emitting panel
04/09/2003EP1300059A2 Jet print apparatus and method for printed circuit board manufacturing
04/09/2003EP1299907A1 Electronic device with heat conductive encasing device
04/09/2003EP1299906A2 Electronic component
04/09/2003EP1299575A2 Acidic treatment liquid and method of treating copper surfaces
04/09/2003EP1299324A1 Freestanding reactive multilayer foils
04/09/2003EP1151646B1 Article having a circuit soldered with parts and method for recycling wastes of the same
04/09/2003EP1123157B1 Method for making integrated multilayered microfluidic devices
04/09/2003EP0998723B1 Module and its use in a chip card
04/09/2003EP0912335B1 Conductive elastomers and methods for fabricating the same
04/09/2003EP0758840B1 Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit
04/09/2003EP0680082B1 Structure for mounting semiconductor device and liquid crystal display device
04/09/2003CN1409873A Power transistor module, power amplifier and method in fabrication thereof
04/09/2003CN1409816A Inspection method utilizing vertical slice image
04/09/2003CN1409587A Method for forming holes, using flexible connection board formed thereof and its producing method
04/09/2003CN1409586A Soldering-inhibiting method for printed circuit board
04/09/2003CN1409585A Structure of soft printed circuit board
04/09/2003CN1409584A method for producing flexible printed circuit and flexible printed circuit produced thereof
04/09/2003CN1409435A High frequency module
04/09/2003CN1409283A Mark for visual detection and electronic instrument
04/09/2003CN1409173A Photosensitive resin composition and printing circuit board
04/09/2003CN1409172A Photosensitive resin composition and printing circuit board
04/09/2003CN1408903A Improvement of adhesive property and compounding method for direct metalization
04/09/2003CN1408765A Resin composition for insulation and laminated body using said composition
04/09/2003CN1408764A Light solidified and heat solidified resin composition and method for producing printed circuit board
04/09/2003CN1408546A Screen printing plate and its producing method and device, screen printing method and device, screen printed article
04/09/2003CN1105485C Process for extablishing electrically conducting connections between two or more conductor structures
04/09/2003CN1105484C Method for producing embedded capactor in electronic circuit assembly and electronic circuit assembly
04/09/2003CN1105482C Method for preventing assembly-line delamination and sagging in circuit board manufacturing
04/09/2003CN1105176C Cold cleaning composition based on alkanes or cycloalkanes and organic compound comprising ketone group
04/09/2003CN1105160C Reducing void formation in curable adhesive formulations
04/09/2003CN1104967C Fluid delivery apparatus and method
1 ... 689 690 691 692 693 694 695 696 697 698 699 700 701 702 703 704 705 706 707 708 709 ... 1185