| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/05/2004 | US6800815 Materials and structure for a high reliability bga connection between LTCC and PB boards |
| 10/05/2004 | US6800814 Multi-layered printed wiring board |
| 10/05/2004 | US6800813 Switch for power tools with integrated switch contacts |
| 10/05/2004 | US6800807 Electric junction box and process for producing the same |
| 10/05/2004 | US6800545 Micro soldered connection |
| 10/05/2004 | US6800537 Methods of making anisotropic conductive elements for use in microelectronic packaging |
| 10/05/2004 | US6800507 Semiconductor device and a method of manufacturing the same |
| 10/05/2004 | US6800506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly |
| 10/05/2004 | US6800237 Method for machining ceramic green sheet |
| 10/05/2004 | US6800232 PCB support plate method for PCB via fill |
| 10/05/2004 | US6800223 For connecting throughhole-type conductive bumps between printed circuit layers |
| 10/05/2004 | US6800211 Method for removing voids in a ceramic substrate |
| 10/05/2004 | US6800188 Reaction product of amines with glycidyl ether or quaternary ammonium compound |
| 10/05/2004 | US6800169 Method for joining conductive structures and an electrical conductive article |
| 10/05/2004 | US6800166 Transfer sheet |
| 10/05/2004 | US6799990 Crimp connector |
| 10/05/2004 | US6799976 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| 10/05/2004 | US6799711 Minute copper balls and a method for their manufacture |
| 10/05/2004 | US6799709 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board |
| 10/05/2004 | US6799369 Printed circuit board and method for producing the same |
| 10/05/2004 | CA2189291C Method for making a multilevel polyimide stencil |
| 09/30/2004 | WO2004084597A1 Material for multilayer printed circuit board with built-in capacitor, substrate for multilayer printed circuit board, multilayer printed circuit board and methods for producing those |
| 09/30/2004 | WO2004084596A1 Apparatus for adjusting width of side conveyor in screen printer |
| 09/30/2004 | WO2004084595A1 Domed circuit board of an antenna amplifier for a vehicle antenna device |
| 09/30/2004 | WO2004084594A1 Process for producing electronic component and electronic component |
| 09/30/2004 | WO2004084593A1 Method for forming fine through hole conductor in circuit board |
| 09/30/2004 | WO2004084421A2 Grouped element transmission channel link with pedestal aspects |
| 09/30/2004 | WO2004084265A2 Led symbol signal |
| 09/30/2004 | WO2004083487A1 Novel imidazole compound and usage thereof |
| 09/30/2004 | WO2004083332A1 A conductive adhesive composition |
| 09/30/2004 | WO2004083278A1 Aromatic ring polymer and low-dielectric material |
| 09/30/2004 | WO2004082923A1 System and method for bending a substantially rigid substrate |
| 09/30/2004 | WO2004082911A1 Breaking device for separating ceramic printed circuit boards |
| 09/30/2004 | WO2004082885A1 Laser beam machining method |
| 09/30/2004 | WO2004082879A2 Conveyorized blind microvia laser drilling system |
| 09/30/2004 | WO2004065050A3 Method and system for solder connecting electrical devices |
| 09/30/2004 | WO2004011182A3 Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method |
| 09/30/2004 | US20040192091 Transceiver mounting adapters |
| 09/30/2004 | US20040192087 Electric connector housing supporting a plurality of solder balls and including a plurality of protruding blocks respectively supporting the plurality of solder balls |
| 09/30/2004 | US20040192084 High current output pin |
| 09/30/2004 | US20040192080 Electrical contact |
| 09/30/2004 | US20040192039 Method of fabricating a multi-layer circuit structure having embedded polymer resistors |
| 09/30/2004 | US20040191982 Manufacturing method of circuit board, circuit board, and liquid discharging apparatus |
| 09/30/2004 | US20040191958 Method for connecting an integrated circuit to a substrate and corresponding arrangement |
| 09/30/2004 | US20040191712 Method and apparatus for improved process control in combustion applications |
| 09/30/2004 | US20040191695 Processing inorganic nanoparticles and a carrier to form an electroconductive pattern area that adheres to the surface of a substrate |
| 09/30/2004 | US20040191681 Near IR sensitive photoimageable/photopolymerizable compositions, media, and associated processes |
| 09/30/2004 | US20040191639 Surface of pattern having organosilicon release agents |
| 09/30/2004 | US20040191616 Battery and battery manufacturing method |
| 09/30/2004 | US20040191560 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 09/30/2004 | US20040191497 Wiring member and method of manufacturing the same |
| 09/30/2004 | US20040191491 Transfer sheet and wiring board using the same, and method of manufacturing the same |
| 09/30/2004 | US20040191490 Circuit board, process for producing the same and a power module employing the same |
| 09/30/2004 | US20040191423 spin coating amorphous films of silver-containing precursors such as silver trifluoroacetylacetonate on surfaces of substrates and irradiating to form electroconductive or semiconductor layers; microelectronics |
| 09/30/2004 | US20040191415 system for dispensing a liquid in coating patterns of selectively varying width |
| 09/30/2004 | US20040190294 Method of fixing a power light-emitting diode on a radiator, and a signalling device comprising such a diode |
| 09/30/2004 | US20040190273 Chip carrier and method for testing electrical performance of passive component |
| 09/30/2004 | US20040190272 Control circuit board and circuit structural body |
| 09/30/2004 | US20040190267 IC card |
| 09/30/2004 | US20040189170 Low cost lighting circuits manufactured from conductive loaded resin-based materials |
| 09/30/2004 | US20040188836 Copper ring solder mask defined ball grid array pad |
| 09/30/2004 | US20040188826 Interposer with signal and power supply through vias |
| 09/30/2004 | US20040188825 Package structure with increased capacitance and method |
| 09/30/2004 | US20040188824 Semiconductor interconnect having laser machined contacts |
| 09/30/2004 | US20040188822 Semiconductor chip, semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 09/30/2004 | US20040188813 Integrated circuit package with reduced stress on die and associated methods |
| 09/30/2004 | US20040188697 Surface-mountable radiation-emitting component and method of producing such a component |
| 09/30/2004 | US20040188656 Rendering electroconductivity polymer nonconductivity; contacting with electrolyte; applying electric voltage ; electrochemistry response at interface between electrolyte and polymer in response to voltage |
| 09/30/2004 | US20040188503 Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same |
| 09/30/2004 | US20040188502 Metal mask and method of printing lead-free solder paste using same |
| 09/30/2004 | US20040188498 Electrically conductive wire |
| 09/30/2004 | US20040188497 Solder reflow type electrical apparatus packaging having integrated circuit and discrete components |
| 09/30/2004 | US20040188496 Approaches for fluxless soldering |
| 09/30/2004 | US20040188418 Low cost heating devices manufactured from conductive loaded resin-based materials |
| 09/30/2004 | US20040188401 Laser processing apparatus |
| 09/30/2004 | US20040188263 Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil |
| 09/30/2004 | US20040188260 Method of plating a semiconductor structure |
| 09/30/2004 | US20040188139 Wiring circuit board having bumps and method of producing same |
| 09/30/2004 | US20040188138 Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards |
| 09/30/2004 | US20040188137 Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board |
| 09/30/2004 | US20040188136 Method of production of multilayer circuit board with built-in semiconductor chip |
| 09/30/2004 | US20040188135 Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board |
| 09/30/2004 | US20040188134 manufacturing a material for components that are as thin as possible |
| 09/30/2004 | US20040188131 Package with pre-applied underfill and associated methods |
| 09/30/2004 | US20040188123 Microelectronic component assemblies having exposed contacts |
| 09/30/2004 | US20040187976 Phase change lead-free super plastic solders |
| 09/30/2004 | US20040187975 Metal filling method and memeber with filled metal sections |
| 09/30/2004 | US20040187716 Pressure control system for printing a viscous material |
| 09/30/2004 | US20040187663 Unloading apparatus for plate-like workpiece cutting machine |
| 09/30/2004 | US20040187310 Method of using micro-contact imprinted features for formation of electrical interconnects for substrates |
| 09/30/2004 | US20040187305 Method of manufacturing wiring board |
| 09/30/2004 | US20040187304 Enhancement of Cu line reliability using thin ALD TaN film to cap the Cu line |
| 09/30/2004 | US20040187303 Selective plating using dual lift-off mask |
| 09/30/2004 | US20040187297 Method of fabricating a polymer resistor in an interconnection via |
| 09/30/2004 | US20040187296 Methods for creating ground paths for ILS |
| 09/30/2004 | DE202004007837U1 Holder for soldering and subsequent sealing of electronic sensor with connecting leads, includes connected chambers for casting compound and sensor |
| 09/30/2004 | DE19543765B4 Verfahren zur Herstellung von Kontaktzungen und deren Verbindung in an der Unterseite eines elektrischen Bauelements vergesehenen Anschlußstiften A process for the production of contact tongues and their connecting in vergesehenen at the bottom of an electrical component terminal pins |
| 09/30/2004 | DE10311821A1 Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck Method and apparatus for aligning substrate and stencil stencil printing |
| 09/30/2004 | DE10310797A1 Vorrichtung zur Bearbeitung von Substraten, insbesondere von elektrischen Schaltungssubstraten, mit Laser An apparatus for processing substrates, in particular of electric circuit substrates, with laser |
| 09/30/2004 | DE10310434A1 Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte Method for RF tuning an electric arrangement and appoint a suitable circuit board |