| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/07/2004 | US20040198033 Double bumping of flexible substrate for first and second level interconnects |
| 10/07/2004 | US20040197979 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 10/07/2004 | US20040197978 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins |
| 10/07/2004 | US20040197962 Manufacturing method for wiring circuit substrate |
| 10/07/2004 | US20040197956 Memory expansion and chip scale stacking system and method |
| 10/07/2004 | US20040197955 Methods for assembly and packaging of flip chip configured dice with interposer |
| 10/07/2004 | US20040197952 Methods for assembly and packaging of flip chip configured dice with interposer |
| 10/07/2004 | US20040197541 Selective electroless deposition and interconnects made therefrom |
| 10/07/2004 | US20040197488 Plasma deposited selective wetting material |
| 10/07/2004 | US20040197487 electrophotographing circuit boards without using exposure masks; diversified small-quantity production and shorter production cycle |
| 10/07/2004 | US20040197478 After molding thermoplastic with a shear strength of 50 MPa or more, the surfaces are subjected to liquid honing treatment with an aluminum abrasive so that the surface roughness Rz is 10 mu m or more, adding catalyst, activation, and electroless plating |
| 10/07/2004 | US20040197261 Potassium hydrogen peroxymonosulfate solutions |
| 10/07/2004 | US20040196638 Method for reducing shrinkage during sintering low-temperature confired ceramics |
| 10/07/2004 | US20040196329 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 10/07/2004 | US20040196198 Low cost adjustable RF resonator devices manufactured from conductive loaded resin-based materials |
| 10/07/2004 | US20040196137 Fuel tank resistor card having improved corrosion resistance |
| 10/07/2004 | US20040196122 Conductor-within-a-via microwave launch |
| 10/07/2004 | US20040195685 System and method for venting pressure from an integrated circuit package sealed with a lid |
| 10/07/2004 | US20040195669 Integrated circuit packaging apparatus and method |
| 10/07/2004 | US20040195666 Stacked module systems and methods |
| 10/07/2004 | US20040195661 Semiconductor package and lead frame therefor |
| 10/07/2004 | US20040195228 Cartridge-type soldering iron |
| 10/07/2004 | US20040195010 Printed circuit board and method of use thereof |
| 10/07/2004 | US20040195002 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 10/07/2004 | US20040195000 Microreplication in ceramics |
| 10/07/2004 | US20040194999 Wiring board, method for manufacturing a wiring board and electronic equipment |
| 10/07/2004 | US20040194992 Method for removing an image sensor from a printed circuit board |
| 10/07/2004 | US20040194988 EMI-shielding assembly and method for making same |
| 10/07/2004 | US20040194915 Thermal pouch interface |
| 10/07/2004 | US20040194856 Powder containing soft and hard ferromagnetic crystalline phases; heat treatment, rapid cooling; uniformity, performance |
| 10/07/2004 | US20040194812 Substrate treatment process and apparatus |
| 10/07/2004 | US20040194798 Dirt removed by irradiating the substrate with ultraviolet rays in an oxygen-containing atmosphere in advance of wet cleaning with pure water; wet cleaning time and the amount of pure water can be reduced; liquid crystal device glass substrates |
| 10/07/2004 | US20040194695 Resin coated carrier fabrication method and the related apparatus for the fabrication |
| 10/07/2004 | US20040194305 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 10/07/2004 | US20040194303 Method of fabricating multi-layered printed circuit board |
| 10/07/2004 | US20040194302 Method of making a biosensor |
| 10/07/2004 | US20040194301 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 10/07/2004 | DE10314179A1 Brechvorrichtung für das Vereinzeln von Keramikleiterplatten Breaking device for the separation of ceramic circuit boards |
| 10/07/2004 | DE10313344A1 Medical or dental hand instrument, e.g. for cutting or drilling, has an electrically activated tool that is supplied by leads formed on an insulated shaft by deposition of an electrical layer and then erosion to form two strips |
| 10/07/2004 | DE10312157A1 Multilayer circuit board e.g. for electrical and computer technology especially computer back-planes, uses metallization consisting of through-boring passing through circuit board |
| 10/07/2004 | DE10311822A1 Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck Method and apparatus for controlling or influencing the printing process in the paste printing |
| 10/07/2004 | DE102004013107A1 Zusammenbaustruktur für Schaltkreisplatinen Assembly structure for circuit boards |
| 10/07/2004 | DE102004013056A1 Verfahren zur Herstellung eines Halbleiterbauelements und zugehörige Leiterplatte A process for producing a semiconductor device and associated circuit board |
| 10/07/2004 | CA2520132A1 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
| 10/07/2004 | CA2461205A1 Techniques for reducing the number of layers in a multilayer signal routing device |
| 10/06/2004 | EP1465471A2 Wiring board, method for manufacturing a wiring board and electronic equipment |
| 10/06/2004 | EP1465470A2 Electrical interconnect assemblies and methods of forming same |
| 10/06/2004 | EP1465469A2 Screen printing method and screen printing apparatus |
| 10/06/2004 | EP1465468A1 Metal mask and method of printing lead-free solder paste using same |
| 10/06/2004 | EP1465253A2 Semiconductor package and lead frame therefor |
| 10/06/2004 | EP1465251A2 Method for producing metal/ceramic bonded substrate |
| 10/06/2004 | EP1465249A2 System and method for venting pressure from an integrated circuit package sealed with a lid |
| 10/06/2004 | EP1464431A1 Soldering method and solder alloy for additional supply |
| 10/06/2004 | EP1464407A2 Multi-mode film coating apparatus and method |
| 10/06/2004 | EP1464211A1 Electric circuit module and method for its assembly |
| 10/06/2004 | EP1464083A2 Method for making a microcircuit card |
| 10/06/2004 | EP1389408B1 Method for producing components for electronic devices |
| 10/06/2004 | EP1332244A4 Method for enhancing the solderability of a surface |
| 10/06/2004 | EP1309740B1 Elastic contact element |
| 10/06/2004 | CN1535479A Direct build-up layer on encapsulated die package |
| 10/06/2004 | CN1535195A Carbon dioxide gas laser machining method of multilayer material |
| 10/06/2004 | CN1535186A Ultra-rrequency of increasing resolution ratio in microdeposition controlling system |
| 10/06/2004 | CN1535185A Ultra-frequency in microdeposition control system for increasing resolution |
| 10/06/2004 | CN1535106A Manufacturing method of multilayer printed circuit board |
| 10/06/2004 | CN1535105A Method and device for mounting semiconductor chip |
| 10/06/2004 | CN1535104A Device and method ofr mfg. printed wiring board |
| 10/06/2004 | CN1535103A Wiring board |
| 10/06/2004 | CN1535102A Printed circuitboard, apparatus and method for checking the same |
| 10/06/2004 | CN1535101A Transfer board wiring board using the same and its mfg. method |
| 10/06/2004 | CN1535078A Distributing substrate, electrooptical apparatus and mfg. method thereof |
| 10/06/2004 | CN1534833A Differential signal electric connector |
| 10/06/2004 | CN1534808A Cell and mfg. method thereof |
| 10/06/2004 | CN1534776A Semiconductor package and its lead wire frame |
| 10/06/2004 | CN1534727A Film pattern forming method and device mfg. method, photoelectric device and electronic apparatus |
| 10/06/2004 | CN1534698A Distribution capacitor in high density application |
| 10/06/2004 | CN1534545A Ic卡 Ic Card |
| 10/06/2004 | CN1533898A Electron interconnecting component element and its shaping method |
| 10/06/2004 | CN1170465C Method for mfg. printed circuitboard or multichannel structure in chip carriers |
| 10/06/2004 | CN1170464C Equipment capable of forming homogenous etching liquid film and etching device |
| 10/06/2004 | CN1170463C Connection apparatus between circuit boards |
| 10/06/2004 | CN1170365C Surface mounted electric element |
| 10/06/2004 | CN1170314C Polymer-ceramic composite electronic substrate |
| 10/06/2004 | CN1170167C Method and device for testing operativeness of printed circuit boards |
| 10/06/2004 | CN1169669C Electrically conductive adhesive transfers |
| 10/06/2004 | CN1169637C Machine for punching sheet material |
| 10/05/2004 | US6801880 System and method for minimizing a loading effect of a via by tuning a cutout ratio |
| 10/05/2004 | US6801795 Cellular telephone with a changeable key arrangement |
| 10/05/2004 | US6801440 Mounting structure for module substrates |
| 10/05/2004 | US6801438 Electrical circuit and method of formation |
| 10/05/2004 | US6801437 Electronic organic substrate |
| 10/05/2004 | US6801436 Extension mechanism and method for assembling overhanging components |
| 10/05/2004 | US6801432 Retainer element for electrical components for assembly on circuit supports |
| 10/05/2004 | US6801431 Integrated power delivery and cooling system for high power microprocessors |
| 10/05/2004 | US6801422 High performance capacitor |
| 10/05/2004 | US6801174 Display device, producing method of electronic apparatus and display device |
| 10/05/2004 | US6800947 Flexible tape electronics packaging |
| 10/05/2004 | US6800942 Vertically mountable semiconductor device and methods |
| 10/05/2004 | US6800936 High-frequency module device |
| 10/05/2004 | US6800935 Switching circuit with improved signal blocking effect in off mode |
| 10/05/2004 | US6800816 Wiring circuit board having bumps and method of producing same |