| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/14/2004 | DE10313517A1 Lösung zum Ätzen von Kupferoberflächen und Verfahren zum Abscheiden von Metall auf Kupferoberflächen Solution for etching copper surfaces and methods for depositing metal on copper surfaces |
| 10/14/2004 | DE10312341A1 Vinyl ester, for lacquers and coating agents, is prepared by reaction of an epoxide with 0.7-0.9 moles of an ethylenically unsaturated carboxylic acid and 0.1-0.3 moles of a saturated carboxylic acid (with respect to the epoxide equivalent) |
| 10/14/2004 | DE10312158A1 Gewölbte Schaltungsplatine eines Antennenvertärkers für eine Fahrzeugantenneneinrichtung Curved circuit board of a Antennenvertärkers for a vehicle antenna device |
| 10/14/2004 | DE102004002902A1 Herstellungsverfahren für ein elektronisches Bauteil Manufacturing method for an electronic component |
| 10/14/2004 | CA2520992A1 Method for manufacturing an electronic module and an electronic module |
| 10/14/2004 | CA2464280A1 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| 10/14/2004 | CA2464153A1 Low cost lighting circuits manufactured from conductive loaded resin-based materials |
| 10/13/2004 | EP1467605A1 Process and apparatus for reflow soldering of electronic components limiting tilting phenomena (Manhattan effect) |
| 10/13/2004 | EP1467604A2 Techniques for reducing the number of layers in a multilayer signal routing device. |
| 10/13/2004 | EP1467603A1 Protection against short circuits on a printed circuit board |
| 10/13/2004 | EP1466723A1 Composite resin molding and process for producing the same |
| 10/13/2004 | EP1466707A2 A method of removing selected portions of material from a base material |
| 10/13/2004 | EP1466362A2 System for the production of electric and integrated circuits |
| 10/13/2004 | EP1466278A2 Process for designing high frequency circuits in multiple domains |
| 10/13/2004 | EP1005642B1 Method and device for determining a parameter for a metallization bath |
| 10/13/2004 | EP0879112B1 Fluxless soldering method |
| 10/13/2004 | CN2648765Y Electric circuit board apparatus |
| 10/13/2004 | CN1537407A Electronic component, component mounting equipment, and component mounting method |
| 10/13/2004 | CN1537327A Flip chip interconnection using no clean flux |
| 10/13/2004 | CN1537230A Sensor package |
| 10/13/2004 | CN1537137A Flame retardant molding compositions |
| 10/13/2004 | CN1536952A Multilayer printed circuit board and mfg. method thereof |
| 10/13/2004 | CN1536951A Multilayer printed circuit board and mfg. method |
| 10/13/2004 | CN1536950A Wiring board, wiring board mfg. method and electronic equipment |
| 10/13/2004 | CN1536949A Image forming method, image forming device and its mfg. method |
| 10/13/2004 | CN1536946A Short-circuit protection of printing circuit board |
| 10/13/2004 | CN1536760A Transformer or inductor and antenna made of conductive charged resin base material |
| 10/13/2004 | CN1536632A Manufacturing method for mounting substrate and method for making circuit device |
| 10/13/2004 | CN1536631A Electrically-connecting pad electroplated metal layer structrure of semiconductor package base plate and its making metod |
| 10/13/2004 | CN1536613A Substrate element and soft substrate |
| 10/13/2004 | CN1536444A Functional polymer |
| 10/13/2004 | CN1171518C Method and apparatus for processing ceramic inner piece |
| 10/13/2004 | CN1171517C Method for making laminated circuit board |
| 10/13/2004 | CN1171516C 印刷电路板结构 A printed circuit board structure |
| 10/13/2004 | CN1171515C Circuit board |
| 10/13/2004 | CN1171514C Low-CTE power source and stratum |
| 10/13/2004 | CN1171513C Copper foil for printed circuit board and its surface treatment method |
| 10/13/2004 | CN1171512C Printed circuit board |
| 10/13/2004 | CN1171431C Method and device to fasten a loudspeaker to circuit board |
| 10/13/2004 | CN1171300C Method for making wiring circuit board with convex point and method for forming convex point |
| 10/13/2004 | CN1171295C Assembling method for monolithic electronic member and monolithic electronic member |
| 10/13/2004 | CN1171257C Method for mfg. ceramic capacitor and ceramic capacitor |
| 10/13/2004 | CN1171173C Method for manufacturing non-contact data carrier |
| 10/13/2004 | CN1171117C Electrooptic device, method for manufacturing electrooptic device, and electronic apparatus |
| 10/13/2004 | CN1170965C Method for electro copperplating substrates |
| 10/13/2004 | CN1170908C Interlamellar insulation adhesive using for multilayer printed circuit board |
| 10/13/2004 | CN1170885C Thermosetting resin composition |
| 10/13/2004 | CN1170750C 芯片元件进给器 Chip component feeder |
| 10/13/2004 | CN1170671C Metallic tension laminated plate used for electric circuit basic plate and its mfg. method |
| 10/13/2004 | CN1170653C Method and apparauts for laser drilling |
| 10/13/2004 | CN1170650C Soldering tin blow device and tin-soldering method thereof |
| 10/12/2004 | US6804388 Method and apparatus of registering a printed circuit board |
| 10/12/2004 | US6804120 Method and apparatus for connecting circuit boards for a sensor assembly |
| 10/12/2004 | US6803664 Semiconductor package |
| 10/12/2004 | US6803658 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 10/12/2004 | US6803657 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 10/12/2004 | US6803649 Electronic assembly |
| 10/12/2004 | US6803647 Mounting structure of semiconductor device and mounting method thereof |
| 10/12/2004 | US6803528 Multi-layer double-sided wiring board and method of fabricating the same |
| 10/12/2004 | US6803527 Circuit board with via through surface mount device contact |
| 10/12/2004 | US6803324 Semiconductor device and its manufacturing method |
| 10/12/2004 | US6803257 Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board |
| 10/12/2004 | US6803116 Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby |
| 10/12/2004 | US6803092 Selective deposition of circuit-protective polymers |
| 10/12/2004 | US6802985 Method for fabricating metal wirings |
| 10/12/2004 | US6802930 Method of making a laminated structure |
| 10/12/2004 | US6802918 Fabrication method for adhesive pressure bonding two components together with closed-loop control |
| 10/12/2004 | US6802733 Topside installation apparatus for land grid array modules |
| 10/12/2004 | US6802654 Electrical connector for opto-electronic modules |
| 10/12/2004 | US6802446 Conductive adhesive material with metallurgically-bonded conductive particles |
| 10/12/2004 | US6802445 Provides for creation of low-tolerance, high accuracy openings to solder bumps using infrared solder mask with laser technology and for creation of high-tolerance, low accuracy openings to contact balls using photo-imaging technology |
| 10/12/2004 | US6802250 Stencil design for solder paste printing |
| 10/12/2004 | US6802120 Hot-pressing first and second copper-clad laminates having plated through holes sandwiched with prepreg bonding sheet to form composite having through holes closed by resin flow, for lead mounting of insertion components from both sides of board |
| 10/12/2004 | US6802119 Conductive pedestal on pad for leadless chip carrier (LCC) standoff |
| 10/12/2004 | CA2369688C Contact assembly for a plug connector, in particular for a pcb plug connector |
| 10/12/2004 | CA2139330C Electrical devices |
| 10/07/2004 | WO2004086843A1 Method of determining at least one marking element on a substrate |
| 10/07/2004 | WO2004086837A1 Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods |
| 10/07/2004 | WO2004086833A1 Printed wiring board, its manufacturing method, and curing resin molded article with support |
| 10/07/2004 | WO2004086832A1 Process for manufacturing printed circuit boards and a machine for this purpose |
| 10/07/2004 | WO2004086831A2 Method and device for electrically and mechanically connecting two printed boards |
| 10/07/2004 | WO2004086830A1 Cleaner apparatus for screen printer |
| 10/07/2004 | WO2004086829A1 Laminate for wiring board and method for etching the same |
| 10/07/2004 | WO2004086493A1 Method for manufacturing electronic component-mounted board |
| 10/07/2004 | WO2004086202A1 A security housing for a circuit |
| 10/07/2004 | WO2004085706A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 10/07/2004 | WO2004085550A2 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
| 10/07/2004 | WO2004085165A1 Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method |
| 10/07/2004 | WO2004068560A3 Area array package with non-electrically connected solder balls |
| 10/07/2004 | WO2004068533A3 Method for producing an electronic module |
| 10/07/2004 | WO2000077907A9 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 10/07/2004 | US20040198861 Solvent and photocurable resin and oxyalkyl compound for photosensitive resin that is water soluble |
| 10/07/2004 | US20040198231 Ceramic microelectromechanical structure |
| 10/07/2004 | US20040198082 Method of making an electrical connector |
| 10/07/2004 | US20040198081 Microelectronic spring contact elements |
| 10/07/2004 | US20040198075 Signal repeating device |
| 10/07/2004 | US20040198074 Electrical interconnect assemblies and methods of forming same |
| 10/07/2004 | US20040198053 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 10/07/2004 | US20040198044 Stacking photoresist image transferring method for fabricating a packaging substrate |
| 10/07/2004 | US20040198043 [discrete circuit component having fabrication stage clogged through-holes and process of making the same] |