H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2004
10/19/2004	US6807047 Electronic device and interposer board
10/19/2004	US6806945 Automatic exposing apparatus and method for exposing both sides of works
10/19/2004	US6806936 Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel
10/19/2004	US6806581 Bonded anisotropic conductive film
10/19/2004	US6806580 Multichip module including substrate with an array of interconnect structures
10/19/2004	US6806562 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two
10/19/2004	US6806560 Semiconductor device and method for fabricating same
10/19/2004	US6806440 Quasi-CW diode pumped, solid-state UV laser system and method employing same
10/19/2004	US6806428 Module component and method of manufacturing the same
10/19/2004	US6806118 Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure
10/19/2004	US6806034 Method of forming a conductive pattern on dielectric substrates
10/19/2004	US6806033 Photoimaged dielectric, its manufacture and use in electronics
10/19/2004	US6806028 Reacting metal hydroxides present on the surface of the powdered base metal with a polyvalent alcohol having at least 4 hydroxyl groups; organic binder having acidic groups to form a microgel; photosensitive organic component
10/19/2004	US6805974 Coupling electroconductive pads
10/19/2004	US6805964 Protective coatings for improved tarnish resistance in metal foils
10/19/2004	US6805958 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
10/19/2004	US6805940 Method for making conductive circuits using powdered metals
10/19/2004	US6805918 Laser forward transfer of rheological systems
10/19/2004	US6805915 Electroless copper plating solution, electroless copper plating process and production process of circuit board
10/19/2004	US6805911 Method and apparatus for improving interfacial chemical reactions
10/19/2004	US6805829 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
10/19/2004	US6805816 Complexing monomeric compound which is pyrrole or 3,4-ethylenedioxythiophene with cyclodextrin, polymerizing complexed compound using chemical oxidant or electrochemical polymerization
10/19/2004	US6805771 Pressure laminator apparatus and non woven fabric formed thereby
10/19/2004	US6805568 Zipper connector
10/19/2004	US6805280 Z interconnect structure and method
10/19/2004	US6805279 Fluxless bumping process using ions
10/19/2004	US6805277 Process for soldering electric connector onto circuit board
10/19/2004	US6805274 Solder ball attracting mask and its manufacturing method
10/19/2004	US6804881 Applying dielectric coating onto electroconductive support; electroplating solder into recesses; applying colloidal palladium; contacting with divalent sulfur salt; free of glass fibers
10/19/2004	CA2302907C Plaster solder array using injection molded solder
10/15/2004	CA2464585A1 Low cost shielded cable manufactured from conductive loaded resin-based materials
10/14/2004	WO2004089049A1 Multilayer substrate and method for producing same
10/14/2004	WO2004089048A1 Method for manufacturing an electronic module and an electronic module
10/14/2004	WO2004089047A1 Electric connecting part
10/14/2004	WO2004088795A1 Anisotropic electrically conductive film and method of producing the same
10/14/2004	WO2004088738A1 Laminate
10/14/2004	WO2004088737A1 Electronic device producing method
10/14/2004	WO2004088731A2 Methods for fabricating three-dimensional all organic interconnect structures
10/14/2004	WO2004088722A2 Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
10/14/2004	WO2004088688A1 Composite electronic component
10/14/2004	WO2004088425A2 Contact masks and lithographic patterning methods using said masks
10/14/2004	WO2004087974A1 Machinable copper alloy
10/14/2004	WO2004087820A1 Insect repellent coating and industrial product using the same
10/14/2004	WO2004087466A1 Arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area
10/14/2004	WO2004087421A1 Pressure control system for printing a viscous material
10/14/2004	WO2004087401A1 Stretched film and method for production thereof
10/14/2004	WO2004087336A2 Ultrasonic spray coating system
10/14/2004	WO2004032234A3 Semiconductor device power interconnect striping
10/14/2004	US20040204334 Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipment
10/14/2004	US20040203290 Connector structure
10/14/2004	US20040203274 Connecting device for connecting electrically a flexible printed board to a circuit board
10/14/2004	US20040203262 Helical microelectronic contact and method for fabricating same
10/14/2004	US20040203260 Component arrangement
10/14/2004	US20040203237 Mounting electronic components
10/14/2004	US20040203191 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
10/14/2004	US20040203184 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
10/14/2004	US20040202958 an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid; pretreating an insulating film to remove residual metals exposed by etching
10/14/2004	US20040202848 Electronic parts and method producing the same
10/14/2004	US20040202844 Feature formation in thick-film inks
10/14/2004	US20040202834 Thin-sheet resin-coated carrier
10/14/2004	US20040202823 Ceramic laminate and method for manufacturing the same
10/14/2004	US20040202795 Encoding tracking information into glass using single screen and laser ablation
10/14/2004	US20040202781 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
10/14/2004	US20040202776 An antiplating layer is formed on localized area of a plastic component; a portion of the anti-plating layer is etched using a low-power laser; electroplating to form a plated layer over the remaining area of the plastic component
10/14/2004	US20040202517 Drilling system with stationary work table
10/14/2004	US20040202432 TO-CAN type optical module
10/14/2004	US20040201969 Method for packaging small size memory cards
10/14/2004	US20040201648 Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate
10/14/2004	US20040201446 Conductive substrate with resistance layer, resistance board, and resistance circuit board
10/14/2004	US20040201396 Floating interposer
10/14/2004	US20040201390 Test interconnect for bumped semiconductor components and method of fabrication
10/14/2004	US20040201367 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
10/14/2004	US20040201136 Material separation to form segmented product
10/14/2004	US20040201113 Conductive contamination reliability solution for assembling substrates
10/14/2004	US20040201112 Durable electronic assembly with conductive adhesive
10/14/2004	US20040201106 Semiconductor chip; copper pads; solder connectors; integrated circuits; prevent damage
10/14/2004	US20040201105 Wiring board and method for producing same
10/14/2004	US20040201096 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/14/2004	US20040201095 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
10/14/2004	US20040201091 Stacked module systems and methods
10/14/2004	US20040201085 Multi-chip circuit module and method for producing the same
10/14/2004	US20040201074 Layered microelectronic contact and method for fabricating same
10/14/2004	US20040201056 Audio signal processing circuit and a display device incorporating the same
10/14/2004	US20040200889 System and method for improving hard drive actuator lead attachment
10/14/2004	US20040200880 Apparatus and method for corrective soldering
10/14/2004	US20040200878 System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process
10/14/2004	US20040200877 Solder reflow oven
10/14/2004	US20040200815 System and method for generating and controlling multiple independently steerable laser beam for material processing
10/14/2004	US20040200801 Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process
10/14/2004	US20040200728 Improved flatness when fine and large holes are present in the surface of a substrate and when subsequent chemical mechanical polishing is used; plating a film of a conductive material on the substrate surface in a plating liquid and electrolytic-etching a surface of the plated film formed
10/14/2004	US20040200726 Reducing space between wire bonding pads by preventing nickel plating layer and gold plating layer from protruding at the lower portion of a copper pattern by filling the spaces between the copper patterns with a and applying plating layers on the exposed surface of the copper; semiconductor packages
10/14/2004	US20040200638 Bonding pads for a printed circuit board
10/14/2004	US20040200067 Method of machining glass substrate and method of fabricating high-frequency circuit
10/14/2004	US20040200065 Electronic circuit device and method of manufacturing the same
10/14/2004	US20040200061 Conductive pattern and method of making
10/14/2004	DE19539584B4 Kontaktverbindung eines elektrischen Bauelementes mit einer Leiterbahnanordnung Contact connection of an electrical component to a conductor track arrangement
10/14/2004	DE10315459A1 Production of a circuit board for electronic devices comprises forming a layout in a mirror-inverted manner, applying as toner coating to a transfer film covered with a plastic layer and acting as intermediate layer, and further processing
10/14/2004	DE10315438A1 Anordnung von elektrischen und/oder mechanischen Komponenten auf einer großen, flexiblen Folienleiterfläche Arrangement of electrical and / or mechanical components on a large, flexible foil conductor surface
10/14/2004	DE10313556A1 Curable powder coating useful in manufacture of printed circuit boards is obtained by mixing polymeric binder, oxazine resin, cyanate ester or maleimide, hardener or initiator and coating additive; melt extruding; and milling and sieving
10/14/2004	DE10313555A1 Curable powder coating useful in manufacture of printed circuit boards is obtained by mixing polymeric binder, oxazine resin, cyanate ester or maleimide, hardener or initiator and coating additive; melt extruding; and milling and sieving

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