| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/21/2004 | US20040209398 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 10/21/2004 | US20040209397 Semiconductor package for improved recognition and mounting |
| 10/21/2004 | US20040209395 Method of plating metal layer over isolated pads on semiconductor package substrate |
| 10/21/2004 | US20040209203 graft polymerization on supports having polymerization initiation layers obtained by fixing or crosslinking polymers |
| 10/21/2004 | US20040209197 Photogravure press and method for manufacturing multilayer-ceramic electronic component |
| 10/21/2004 | US20040209191 Method for producing conductive structures by means of printing technique, and active components produced therefrom for integrated circuits |
| 10/21/2004 | US20040209190 forming a mask having pattern forming openings on a workpiece surface, and then supplying and solidifying a liquid pattern material in the openings; does not require reduced pressure environment during manufacture and can be used for forming patterns near atmospheric pressure |
| 10/21/2004 | US20040209188 Solvents and photoresists compositions for short wavelength imaging |
| 10/21/2004 | US20040209112 an electrically conductive material for connecting parts which consists of a parent material of copper, does not crack even when bent sharply, keeps a low contact resistance after standing at high temperatures, has good corrosion resistance to SO2 |
| 10/21/2004 | US20040209109 heat-resistant layer with an olefin-based silane coupling agent layer on at least one side thereof; low profile with excellent adhesion to the insulating resin; used for a copper-clad laminate for higher frequency applications. |
| 10/21/2004 | US20040209106 thin films comprising metallic carriers, barriers layers, a second metallic layer selected from zinc, copper and cobalt, and/or arsenic, manganese, tin, vanadium, molybdenum, antimony or tungsten, and electrodeposited overcoating, used for printed circuits; electrical and electronic apparatus; multilayer |
| 10/21/2004 | US20040209091 perforating sheets to improve accuracy of processing and plating throwing power |
| 10/21/2004 | US20040209089 comprises polydimethylsiloxane cross-linked telechelic polymethylpentene/polyisobutylene; hydrogen sulfide permeable membranes; for production of electronic components |
| 10/21/2004 | US20040209055 Multilayer ceramic composition |
| 10/21/2004 | US20040209054 Circuit elements having an embedded conductive trace and methods of manufacture |
| 10/21/2004 | US20040209044 Non-homogeneous multilayer circuit assemblies and method of manufacture |
| 10/21/2004 | US20040209004 apparatus comprising a coater for coating a liquid that reacts with an ultraviolet ray to deposit metal on the substrate, and an ultraviolet irradiating means; wiring pattern formed by ink jet printing of good adhesion |
| 10/21/2004 | US20040209003 Radiation curable hot melt composition and a process for the application thereof |
| 10/21/2004 | US20040208987 Ceramic electronic device, paste coating method, and paste coating apparatus |
| 10/21/2004 | US20040208933 Method for manufacturing multilayer circuit board |
| 10/21/2004 | US20040208461 Transparent substrate and hinged optical assembly |
| 10/21/2004 | US20040208416 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| 10/21/2004 | US20040207975 Electronic circuit unit having mounting structure with high soldering reliability |
| 10/21/2004 | US20040207496 [method for tuning parameter of rf transmission line and structure thereof] |
| 10/21/2004 | US20040207487 High-frequency electronic component and its designing method |
| 10/21/2004 | US20040207423 Electrical inspection apparatus |
| 10/21/2004 | US20040207421 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 10/21/2004 | US20040207418 Inspection apparatus for printed board |
| 10/21/2004 | US20040207134 Method of manufacturing ceramic laminated body |
| 10/21/2004 | US20040207094 Package substrate and a flip chip mounted semiconductor device |
| 10/21/2004 | US20040207076 Soldered heat sink anchor and method of use |
| 10/21/2004 | US20040207073 Electronic apparatus |
| 10/21/2004 | US20040207069 Tape carrier for TAB and method for producing the same |
| 10/21/2004 | US20040207056 Conductor substrate, semiconductor device and production method thereof |
| 10/21/2004 | US20040207053 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 10/21/2004 | US20040206968 Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
| 10/21/2004 | US20040206943 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same |
| 10/21/2004 | US20040206916 Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 10/21/2004 | US20040206829 throughplating of flexible printed boards |
| 10/21/2004 | US20040206805 Method for removing solder bumps from LSI |
| 10/21/2004 | US20040206802 Process for soldering electric connector onto circuit board |
| 10/21/2004 | US20040206801 Electronic devices including metallurgy structures for wire and solder bonding |
| 10/21/2004 | US20040206799 soldering terminals of transmitters embedded in plastic substrates to terminals of integrated circuit modules on the substrate |
| 10/21/2004 | US20040206733 Method and system to drill holes in an electric circuit substrate |
| 10/21/2004 | US20040206631 Brightener degradation inhibitor compound in copper plating bath |
| 10/21/2004 | US20040206546 Method for producing a ceramic substrate and ceramic substrate |
| 10/21/2004 | US20040206457 Intensive machine for performing a plurality of processes in fabrication of multilayer substrate |
| 10/21/2004 | US20040205960 Electric part handling device |
| 10/21/2004 | US20040205958 Methods for fabricating MRAM device structures |
| 10/21/2004 | DE10316513A1 Reflow soldering process for electronic circuit boards has a microwave powered preheating stage |
| 10/21/2004 | DE102004015283A1 IC-Karte IC card |
| 10/21/2004 | DE102004014094A1 Verfahren zum Schwalllöten von oberflächenmontierten Leuchtdioden A method for wave soldering of surface mount LEDs |
| 10/21/2004 | CA2517511A1 Potassium hydrogen peroxymonosulfate solutions |
| 10/20/2004 | EP1469710A2 Component support and process for manufacturing the same |
| 10/20/2004 | EP1469707A2 Lighting circuits manufactured from conductive loaded resin-based materials |
| 10/20/2004 | EP1469514A2 Conductor substrate, semiconductor device and production method thereof |
| 10/20/2004 | EP1469513A2 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| 10/20/2004 | EP1469490A1 An audio signal processing circuit and a display device incorporating the same |
| 10/20/2004 | EP1469485A2 Low cost shielded cable manufactured form conductive loaded resin-based materials |
| 10/20/2004 | EP1468776A2 Microelectronics spring contact elements |
| 10/20/2004 | EP1468752A2 Cleaning sheet and method of cleaning a substrate |
| 10/20/2004 | EP1468466A1 Grouped element transmission channel link |
| 10/20/2004 | EP1468446A1 Method for production of dielectric layers using polyfunctional carbosilanes |
| 10/20/2004 | EP1468354A2 A method of applying an edge electrode pattern to a touch screen |
| 10/20/2004 | EP1468054A1 Ink-jet inks containing metal nanoparticles |
| 10/20/2004 | EP1468042A2 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects |
| 10/20/2004 | EP1468041A1 Resin composition |
| 10/20/2004 | EP1467845A1 A method and related apparatus for cutting a product from a sheet material |
| 10/20/2004 | EP1467837A1 Depaneling systems |
| 10/20/2004 | EP1374654A4 Heat sink |
| 10/20/2004 | EP1274885B1 Electrical contacting element made of an elastic material |
| 10/20/2004 | EP0860101B1 Method for producing contact pads on adapter boards and adapter board for testing pattern boards |
| 10/20/2004 | CN2650449Y Part fixing structure |
| 10/20/2004 | CN1539256A Welded leadframe |
| 10/20/2004 | CN1539255A Card manufacturing technique and resulting card |
| 10/20/2004 | CN1539179A Batch electrically connecting sheet |
| 10/20/2004 | CN1539161A Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 10/20/2004 | CN1539029A Copper on INVAR composite and method of making |
| 10/20/2004 | CN1538978A Resin composition, composition for solder resist, and cured article obtained therefrom |
| 10/20/2004 | CN1538893A Multi-beam micro-machining system and method |
| 10/20/2004 | CN1538803A Manufacturing method of multilayer printed circuit board |
| 10/20/2004 | CN1538802A Multilayer printed circuit board with conrex column conducting and its manufacturing method |
| 10/20/2004 | CN1538801A Electronic line unit with assembling structure of high-reliability welding |
| 10/20/2004 | CN1538800A Method of sharing tin stealing bonding pad |
| 10/20/2004 | CN1538799A Figure forming method figure forming device and manufacturing method of device |
| 10/20/2004 | CN1538798A Distribution base material and electric equipment and switch device with the distribution base material |
| 10/20/2004 | CN1538554A Low cost antenna using conductive plastics or conductive composites |
| 10/20/2004 | CN1538518A Conductive substrate, semiconductor device and manufacturing method thereof |
| 10/20/2004 | CN1538467A Improved miniature surface mount capacitor and method of making the same |
| 10/20/2004 | CN1537971A Electroplating pretreatment solution and electroplating pretreatment method |
| 10/20/2004 | CN1172565C Method and apparatus for fabricating printed circuit board and material for printed cirucuit board |
| 10/20/2004 | CN1172564C Electromechanical component |
| 10/20/2004 | CN1172438C Electronic component having cirucit arrangement packed and mfg. method thereof |
| 10/20/2004 | CN1172409C Contact assembly for insertion connector |
| 10/20/2004 | CN1172371C Sensor circuit modular unit electronic device using same |
| 10/20/2004 | CN1172211C Manufacturing method of electrooptical device and dectrooptical device |
| 10/19/2004 | US6807066 Power supply terminal and back board |
| 10/19/2004 | US6807065 Multilayer printed circuit board |
| 10/19/2004 | US6807063 High-frequency integrated circuit module |
| 10/19/2004 | US6807060 Underhood electronic integration |