| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/27/2004 | EP1471605A2 Electronic circuit unit having mounting structure with high soldering reliability |
| 10/27/2004 | EP1471574A2 Wiring substrate and electronic parts packaging structure |
| 10/27/2004 | EP1471573A1 Multi-layer ceramic substrate, and method and device for producing the same |
| 10/27/2004 | EP1471570A1 Method of mounting an electronic part on a mounting board |
| 10/27/2004 | EP1471167A2 Electroless plating method |
| 10/27/2004 | EP1471041A1 Multilayer ceramic composition |
| 10/27/2004 | EP1470920A1 Ink jet head and manufacturing method thereof |
| 10/27/2004 | EP1470581A2 High density area array solder microjoining interconnect structure and fabrication method |
| 10/27/2004 | EP1470528A2 Method for manufacturing rfid labels |
| 10/27/2004 | EP1470268A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 10/27/2004 | EP1470207A1 Aqueous stripping and cleaning composition |
| 10/27/2004 | EP1470176A1 No flow underfill composition |
| 10/27/2004 | EP1138047A4 Method and apparatus for photosensitized ultraviolet decontamination of surfaces and aerosol clouds |
| 10/27/2004 | EP1010035B1 Novel addressing schemes for electrophoretic displays |
| 10/27/2004 | EP0886991B1 Conducting foil for conductively connecting electric and/or electronic components |
| 10/27/2004 | EP0845445B1 Photosensitive ceramic green sheet, ceramic package,process for producing the same and its use in preparing a ceramic package with a fired board |
| 10/27/2004 | CN2652088Y Circuit board with pin with resin production |
| 10/27/2004 | CN2650922Y Accepting tray for positioning solder to implant electric conductive terminals |
| 10/27/2004 | CN1541414A Electronic assembly with llaterally connected capacitors and mfg. method |
| 10/27/2004 | CN1541409A Metal pattern formation |
| 10/27/2004 | CN1541054A Electronic assembly and its mfg. method |
| 10/27/2004 | CN1541053A Encapsulation structure of distribution substrate and electronic element |
| 10/27/2004 | CN1541052A Method of assembling electronic parts |
| 10/27/2004 | CN1541051A Soldering resist compsn. and printed wiring board |
| 10/27/2004 | CN1541050A Figure forming method and mfg. method of device, electrooptical device and electronic instrument |
| 10/27/2004 | CN1541049A Washing method, storage method, figure forming method and mfg. method of device |
| 10/27/2004 | CN1541048A Mfg. method of circuit substrate, circuit substrate and liquid spraying appts |
| 10/27/2004 | CN1541047A Pins of outputting high current |
| 10/27/2004 | CN1541026A Surface mounting elemctronic element encapsulation |
| 10/27/2004 | CN1540750A Surface-mounting high frequency modular |
| 10/27/2004 | CN1540749A Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent |
| 10/27/2004 | CN1540692A 镀覆接线端 Plated terminals |
| 10/27/2004 | CN1173616C Method of manufacturing multilayer wiring boards |
| 10/27/2004 | CN1173615C Interlayer connection of multi-layer electronic component and mfg. method thereof |
| 10/27/2004 | CN1173614C Method for forming metal conductor models on electrically insulating supports |
| 10/27/2004 | CN1173613C Process for preparing contact electrode of high-temp superconductor filter |
| 10/27/2004 | CN1173612C Copper foil for printed circuit and its manufacture |
| 10/27/2004 | CN1173611C Multi-layer printed circuit board |
| 10/27/2004 | CN1173609C Single system module for electric/electronic equipment |
| 10/27/2004 | CN1173371C Conductive formation and electronic equipment using such conductive formation |
| 10/27/2004 | CN1173257C Upper chip for secondary board of optic mouse and optical mouse using same |
| 10/27/2004 | CN1173231C Thermal assisted photosensitive composition and method thereof |
| 10/27/2004 | CN1172871C Glass-ceramic composition for ceramic-type electromic element, ceramic-type electronic element and process for preparing malti-layer ceramic-type electronic element |
| 10/26/2004 | US6810138 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 10/26/2004 | US6809937 Method and apparatus for shock and vibration isolation of a circuit component |
| 10/26/2004 | US6809935 Thermally compliant PCB substrate for the application of chip scale packages |
| 10/26/2004 | US6809617 Edge plated transmission line and switch integrally formed therewith |
| 10/26/2004 | US6809415 Printed-circuit board and method of manufacture thereof |
| 10/26/2004 | US6809414 Semiconductor chip assembly with bumped conductive trace |
| 10/26/2004 | US6809367 Device for interconnecting, in three dimensions, electronic components |
| 10/26/2004 | US6809290 Laser energy delivery system outputting beams having a selectable energy |
| 10/26/2004 | US6809289 With a laser operated at an energy density below the ablation threshold of a conductive layer on the circuit board |
| 10/26/2004 | US6809269 Circuitized substrate assembly and method of making same |
| 10/26/2004 | US6809267 Flexible printed wiring board and its production method |
| 10/26/2004 | US6809262 Flip chip package carrier |
| 10/26/2004 | US6809260 Apparatus and method for an integrated high-performance electrical interconnect |
| 10/26/2004 | US6809255 Radio frequency ground shield |
| 10/26/2004 | US6809045 Screen ink printed film carrier and electrically modulated device using same |
| 10/26/2004 | US6808959 Semiconductor device having reinforced coupling between solder balls and substrate |
| 10/26/2004 | US6808958 Methods of bonding microelectronic elements |
| 10/26/2004 | US6808866 Steps of pressing, etching and insulating are executed on a flexible insulation tape in reel- to-reel fashion. thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the |
| 10/26/2004 | US6808819 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin |
| 10/26/2004 | US6808798 Semiconductor chips are mounted on a heat conductive resin substrate which polybenzazole fibers are oriented in a thick direction and/or in a direction of a surface of a resin substrate. |
| 10/26/2004 | US6808773 Shielding base member and method of manufacturing the same |
| 10/26/2004 | US6808770 Heat-resistant film and thermal transfer recording medium |
| 10/26/2004 | US6808676 Method and device for producing shaped ceramic bodies using setter plates |
| 10/26/2004 | US6808643 Hybrid interconnect substrate and method of manufacture thereof |
| 10/26/2004 | US6808642 Method for producing multilayer substrate and electronic part, and multilayer electronic part |
| 10/26/2004 | US6808641 Method of wiring formation and method for manufacturing electronic components |
| 10/26/2004 | US6808614 Sulfonic acid electrolyte; a tin compound soluble in the sulfonic acid to form a tin sulfonate; a copper compound soluble in the sulfonic acid to form a copper sulfonate; a nonionic surfactant; a satin brightener; and an antioxidant. |
| 10/26/2004 | US6808612 Positioning electroconductive substrate in a chamber containing electrochemical bath, applying a plating bias to the substrate while immersing into bath, and depositing third conductive material in situ to fill; pulsation |
| 10/26/2004 | US6808578 Method for producing ceramic substrate |
| 10/26/2004 | US6808422 Filter insert for an electrical connector assembly |
| 10/26/2004 | US6807732 Methods for modifying inner-layer circuit features of printed circuit boards |
| 10/26/2004 | US6807731 Electromagnetic interference shield in the form of a thin metal film or foil; reduces amount of electromagnetic interference emissions from penetrating within the assembly to the circuit board |
| 10/26/2004 | US6807730 Pad structure of semiconductor package |
| 10/26/2004 | US6807729 Method of manufacturing metal foil |
| 10/26/2004 | CA2376697C An adhesion promoting layer for use with epoxy prepregs |
| 10/22/2004 | CA2426231A1 Method and apparatus for making smart card solder contacts |
| 10/21/2004 | WO2004091268A1 Multilayer printed wiring board |
| 10/21/2004 | WO2004091267A1 Method for packaging small size memory cards |
| 10/21/2004 | WO2004091054A1 Electronic component provided with a single connector grouping together radio frequency signals and digital signals, corresponding support, electronic system and method for the implementation thereof |
| 10/21/2004 | WO2004090970A1 Wiring board and process for producing the same |
| 10/21/2004 | WO2004090942A2 Thermally conductive adhesive composition and process for device attachment |
| 10/21/2004 | WO2004090920A1 Solid-state electrolytic capacitor and mounting method therefor |
| 10/21/2004 | WO2004090893A1 System and method for improving hard drive actuator lead attachment |
| 10/21/2004 | WO2004090197A1 Electrolytic copper foil with low roughness surface and process for producing the same |
| 10/21/2004 | WO2004089817A1 Potassium hydrogen peroxymonosulfate solutions |
| 10/21/2004 | WO2004089573A1 Solder paste and printed board |
| 10/21/2004 | US20040210854 Parellel electronic design automation: shared simultaneous editing |
| 10/21/2004 | US20040209578 EMI shield for reducing clock jitter of a transceiver |
| 10/21/2004 | US20040209530 Terminal pin structure and method for manufacturing the same |
| 10/21/2004 | US20040209508 Heat-shrinkable retainer for PCB double-sided assembly |
| 10/21/2004 | US20040209497 Electrical interconnect using locally conductive adhesive |
| 10/21/2004 | US20040209495 Solder reserve transfer device and process |
| 10/21/2004 | US20040209453 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 10/21/2004 | US20040209451 Solder deposition method and solder bump forming method |
| 10/21/2004 | US20040209448 Printing electronic and opto-electronic circuits |
| 10/21/2004 | US20040209439 Method for forming a multi-layer circuit assembly |
| 10/21/2004 | US20040209399 Electronic parts packaging structure and method of manufacturing the same |