H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2004
11/03/2004	EP1473979A1 High-frequency layered part and manufacturing method thereof
11/03/2004	EP1473978A1 Lamp on sheet and manufacturing method thereof
11/03/2004	EP1473977A2 Electronic package with strengthened conductive pad
11/03/2004	EP1473846A2 Multiband high-frequency switching modul
11/03/2004	EP1473744A2 Low profile inductive component
11/03/2004	EP1473743A2 Transformers or inductors ("transductors") and antennas manufactured from conductive loaded resin-based materials
11/03/2004	EP1473329A1 Resin composition
11/03/2004	EP1473328A1 Resin composition
11/03/2004	EP1473194A1 Integration of an electronic circuit in a vehicle
11/03/2004	EP1473105A2 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachement and remote ion generation
11/03/2004	EP1472916A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
11/03/2004	EP1472915A2 Circuit carrier and production thereof
11/03/2004	EP1472914A2 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/03/2004	EP1472710A1 Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon
11/03/2004	EP1472699A2 Circuit system with a printed board comprising a programmable memory element
11/03/2004	EP1472089A1 Machine for continuously producing plastic laminates in a cold press
11/03/2004	EP1353540B1 Manufacturing method of circuit board module
11/03/2004	EP1200223B1 Print chip for a printing head working according to the ink printing principle
11/03/2004	CN2653842Y Printed board
11/03/2004	CN2653841Y Flip-chip package load board
11/03/2004	CN2653840Y 信号传输结构 Signal transmission structure
11/03/2004	CN1543757A Parallel plane substrate
11/03/2004	CN1543756A Wired transmission path
11/03/2004	CN1543701A Switching power supply unit
11/03/2004	CN1543697A Electromagnetic emission reduction technique for shielded connectors
11/03/2004	CN1543675A Microelectronic package having a bumpless laminated interconnection layer
11/03/2004	CN1543574A Apparatus and method for testing circuit board
11/03/2004	CN1543486A Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler
11/03/2004	CN1543385A 焊料组合物 Solder composition
11/03/2004	CN1543308A Electric element mounting/demounting device
11/03/2004	CN1543298A Multilayer ceramic device
11/03/2004	CN1543296A 印制电路板 Printed circuit board
11/03/2004	CN1543295A Film tearing method
11/03/2004	CN1543294A Metal mask and method of printing lead-free solder paste using same
11/03/2004	CN1543291A Electronic component built-in module and method of manufacturing the same
11/03/2004	CN1542949A Package substrate
11/03/2004	CN1542936A Apparatus for mounting semiconductor chip
11/03/2004	CN1542935A Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
11/03/2004	CN1542933A Substrate for mounting semiconductor chip thereon using ultrasonic welding
11/03/2004	CN1542888A Pattern and method for manufacturing metal or metal compound
11/03/2004	CN1542871A Chip resistor and method of manufacturing the same
11/03/2004	CN1542547A Photosensitive resin composition and method for the formation of a resin pattern using the composition
11/03/2004	CN1542526A Display unit installing and connecting device
11/03/2004	CN1542509A Audio signal processing circuit and a display device incorporating the same
11/03/2004	CN1542073A Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
11/03/2004	CN1542072A Bonding layer for bonding resin on copper surface
11/03/2004	CN1541819A Perforating device
11/03/2004	CN1174665C Multilayer flexible wiring board
11/03/2004	CN1174664C Multilayer printing distribution board and its making method
11/03/2004	CN1174489C Distribution base, its mfg. method, displaying device and electronic device
11/03/2004	CN1174488C 显示装置 The display device
11/03/2004	CN1174482C Modular assembly and electronic component
11/03/2004	CN1174481C Method for making burrless castellation via hole for plastic chip carrier and product
11/03/2004	CN1174475C Method for making RF module element with sound wave surface wave unit
11/03/2004	CN1174286C Diazo-contg. photosensitive meterial
11/03/2004	CN1174279C Wiring base plate, display device, semiconductor chip and electronic machine
11/03/2004	CN1174251C Method for making cards with multiple contact tips and cards obtained thereby
11/03/2004	CN1174119C Liquid for reducing copper oxides and process thereof
11/03/2004	CN1174055C Sealing material composition for cards and process for producing cards therewith
11/03/2004	CN1173792C Printhead for jetting hot liquid medium and method of producing joint that comprises metallic solder
11/03/2004	CN1173785C Cleaning agent, method and drying method
11/02/2004	US6813749 Method, system and computer program product for multidisciplinary design analysis of structural components
11/02/2004	US6813162 Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims
11/02/2004	US6813138 Embedded microelectronic capacitor equipped with geometrically-centered electrodes and method of fabrication
11/02/2004	US6812803 Passive transmission line equalization using circuit-board thru-holes
11/02/2004	US6812570 Organic packages having low tin solder connections
11/02/2004	US6812560 Press-fit chip package
11/02/2004	US6812549 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
11/02/2004	US6812412 Multi-layer wiring board and method of producing same
11/02/2004	US6812411 Printed circuit board configuration with a multipole plug-in connector
11/02/2004	US6812410 Semiconductor module and method of manufacturing the same
11/02/2004	US6812299 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards
11/02/2004	US6812078 Method for transferring and stacking of semiconductor devices
11/02/2004	US6812065 Anisotropic conductive paste
11/02/2004	US6812060 Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
11/02/2004	US6811892 For use with electronic/flip chip packaging; requires reflow temperatures compatible with circuit board assembly processes; improved reliability over eutectics under high temperature processing
11/02/2004	US6811675 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
11/02/2004	US6811672 Method for forming plating film and electronic component having plating film formed theron by same method
11/02/2004	US6811658 Apparatus for forming interconnects
11/02/2004	US6811635 Multilayer ceramic substrate, method for manufacturing the same, and electronic device
11/02/2004	US6811634 Shrinkage inhibition, dimemsional accuracy
11/02/2004	US6811409 Connecting device for flexible electrical connection of circuit boards
11/02/2004	US6811073 Method for connecting conductive members
11/02/2004	US6810814 Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus
11/02/2004	US6810583 Coupling of conductive vias to complex power-signal substructures
11/02/2004	US6810580 System for forming conductor wire on a substrate board
11/02/2004	US6810579 Method for manufacturing membranes
11/02/2004	CA2293181C Resilient electrical interconnects having non-uniform cross-section
11/02/2004	CA2279271C Through-hole interconnect device with isolated wire-leads and component barriers
10/2004
10/28/2004	WO2004093508A1 Rigid-flex wiring board
10/28/2004	WO2004093507A1 Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device
10/28/2004	WO2004093506A2 Electomagnetic interference shielding for a printed circuit board
10/28/2004	WO2004093505A2 Emi shielding for electronic component packaging
10/28/2004	WO2004093504A2 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
10/28/2004	WO2004093266A1 Method of making an electrical connector
10/28/2004	WO2004093252A2 Electrical connector and method for making
10/28/2004	WO2004093189A1 Helical microelectronic contact and method for fabricating same
10/28/2004	WO2004093186A1 Metal-base circuit board and its manufacturing method
10/28/2004	WO2004093183A1 Film carrier and semiconductor device using the same
10/28/2004	WO2004093174A1 Laser processing apparatus and laser processing method

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