| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/28/2004 | WO2004093164A2 Layered microelectronic contact and method for fabricating same |
| 10/28/2004 | WO2004093153A2 Non-homogeneous multilayer circuit assemblies and method of manufacture |
| 10/28/2004 | WO2004093145A2 Voltage tunable photodefinable dielectric and method of manufacture therefore |
| 10/28/2004 | WO2004093140A2 Electronic component and method of manufacturing same |
| 10/28/2004 | WO2004093105A1 Method of forming sheet having foreign material portions used for forming multilayer wiring board and sheet having foreign portions |
| 10/28/2004 | WO2004093100A2 Method for producing soldering globules on an electrical component |
| 10/28/2004 | WO2004093098A1 Materials containing thermoplastic |
| 10/28/2004 | WO2004092838A1 Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof |
| 10/28/2004 | WO2004092713A2 System and method for attenuating the effect of ambient light on an optical sensor |
| 10/28/2004 | WO2004092452A1 Two-layer flexible copper-clad laminate and method for manufacturing the two-layer flexible copper-clad laminate |
| 10/28/2004 | WO2004092451A1 Method of directly forming electroplate layer on the surface of nonconductive material |
| 10/28/2004 | WO2004091845A1 Device and method for drilling holes in an electric circuit substrate |
| 10/28/2004 | WO2004091838A2 Method of soldering or brazing articles having surfaces that are difficult to bond |
| 10/28/2004 | WO2004091809A2 Kinetic spray application of coatings onto covered materials |
| 10/28/2004 | WO2004077901A3 Printed circuit board and method for fixing wired parts thereto |
| 10/28/2004 | WO2004072331A3 Apparatus and method for highly controlled electrodeposition |
| 10/28/2004 | WO2004034431A3 Circuit board threadplate |
| 10/28/2004 | US20040214979 Polyurethanes and polyimides for wires or connectors and a process for connecting wires, curing with curing agents to form films. |
| 10/28/2004 | US20040214503 Electromagnetic-wave shielding and light transmitting plate and manufacturing method thereof |
| 10/28/2004 | US20040214468 Electrical connector |
| 10/28/2004 | US20040214466 Joint connector of printed circuit board and manufacturing method thereof |
| 10/28/2004 | US20040214422 Semiconductor devices, and manufacturing methods, circuit substrates and electronic equipments for the same |
| 10/28/2004 | US20040214420 Method and apparatus for transferring solder bumps |
| 10/28/2004 | US20040214409 Method and apparatus for manufacturing known good semiconductor die |
| 10/28/2004 | US20040214079 Integrated thin film battery and circuit module |
| 10/28/2004 | US20040214006 Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards |
| 10/28/2004 | US20040214005 Resin film and multilayer printed wiring board using thereof |
| 10/28/2004 | US20040213971 Forming a self-aligned pattern on an existing pattern on a substrate by coating a masking material to the substrate and allowing a portion of the masking material to preferentially attach to portions of the existing pattern; including metal elements and dielectrics; microelectronics; simplifification |
| 10/28/2004 | US20040213969 Releasing laminated film |
| 10/28/2004 | US20040213963 Terminated conductive patterned sheet utilizing conductive conduits |
| 10/28/2004 | US20040213962 use in transmitted display devices such as liquid crystal displays; polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material and the other serving a function beyond protection, such as guide light waves |
| 10/28/2004 | US20040213957 Article comprising conductive conduit channels |
| 10/28/2004 | US20040213954 Heat selective electrically conductive polymer sheet |
| 10/28/2004 | US20040213912 adhering a catalytic metal as electroless plating catalyst onto the insulating body and the conductive pattern, selectively forming a protection film or selectively oxidizing the catalytic metal, electroless plating metal on the conductive pattern; selectivity prevents short-circuiting |
| 10/28/2004 | US20040213896 Conductive pattern forming composition, formation method of conductive pattern and production method of conductive pattern forming composition |
| 10/28/2004 | US20040213894 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance |
| 10/28/2004 | US20040213525 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 10/28/2004 | US20040213450 Image recognition apparatus and image recognition method |
| 10/28/2004 | US20040212972 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor |
| 10/28/2004 | US20040212971 Printed circuit board |
| 10/28/2004 | US20040212969 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 10/28/2004 | US20040212965 Electronic circuit apparatus and method of manufacturing the same |
| 10/28/2004 | US20040212797 Appearance inspection apparatus and the method of inspecting the same |
| 10/28/2004 | US20040212772 Liquid crystal device, manufacturing method therefor, and electronic apparatus |
| 10/28/2004 | US20040212718 Placement of a camera module in a portable device |
| 10/28/2004 | US20040212634 System and method for configuring capabilities of printed circuit boards |
| 10/28/2004 | US20040212475 Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board |
| 10/28/2004 | US20040212391 Method for universal wafer carrier for wafer level die burn-in |
| 10/28/2004 | US20040212389 Method and apparatus for processing semiconductor devices in a singulated form |
| 10/28/2004 | US20040212386 Method of testing FPC bonding yield and FPC having testing pads thereon |
| 10/28/2004 | US20040212103 Techniques for pin arrangements in circuit chips |
| 10/28/2004 | US20040212101 Flip chip interconnection structure |
| 10/28/2004 | US20040212098 Flip chip interconnection structure |
| 10/28/2004 | US20040212094 Useful for the assembly of passive components and organic substrates with conventional ceramic packages |
| 10/28/2004 | US20040212091 Semiconductor device substrate |
| 10/28/2004 | US20040212089 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
| 10/28/2004 | US20040212087 Wiring substrate and electronic parts packaging structure |
| 10/28/2004 | US20040212085 Thick film circuit board, method of producing the same and integrated circuit device |
| 10/28/2004 | US20040212084 Thick film millimeter wave transceiver module |
| 10/28/2004 | US20040212077 High-frequency module, method of manufacturing thereof and method of molding resin |
| 10/28/2004 | US20040212076 Multilayer substrate |
| 10/28/2004 | US20040212075 Semiconductor device including a wiring board with a three-dimensional wiring pattern |
| 10/28/2004 | US20040212063 Electronic package having a flexible substrate with ends connected to one another |
| 10/28/2004 | US20040212062 Tape stiffener and semiconductor device component assemblies including same |
| 10/28/2004 | US20040212050 Film carrier tape for mounting an electronic part, process for producing the same, and screen for solder resist coating |
| 10/28/2004 | US20040212030 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication |
| 10/28/2004 | US20040211979 Circuit board and method for manufacturing the circuit board |
| 10/28/2004 | US20040211954 Compositive laminate substrate with inorganic substrate and organic substrate |
| 10/28/2004 | US20040211818 Jig and method for connecting connection members using the same |
| 10/28/2004 | US20040211816 Wave soldering apparatus |
| 10/28/2004 | US20040211815 Apparatus for removing an image sensor from a printed circuit board |
| 10/28/2004 | US20040211751 Method of manufacturing circuit board |
| 10/28/2004 | US20040211653 Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials |
| 10/28/2004 | US20040211594 Vertical routing structure |
| 10/28/2004 | US20040211593 Method and apparatus for implementing circuit changes on printed circuit boards after manufacture |
| 10/28/2004 | US20040211592 Wiring board and electro-optical device, method of manufacture thereof, and electronic instrument |
| 10/28/2004 | US20040211590 Multilayer printed wiring board and integrated circuit using the same |
| 10/28/2004 | US20040211589 High conducting thin-film nanoprobe card and its fabrication method |
| 10/28/2004 | US20040211583 Surface-mount-type high-frequency module |
| 10/28/2004 | US20040211506 shrinkage inhibition of multilayer glass laminates, using films comprising glass, ceramic fillers, binders and solvents; dielectrics |
| 10/28/2004 | US20040211494 Partition or method for producing a partition for a multilayer pressed packet |
| 10/28/2004 | US20040211061 Method of forming socket contacts |
| 10/28/2004 | US20040211060 Method of mounting an electronic part |
| 10/28/2004 | US20040211059 Mounting method of electronic components |
| 10/28/2004 | US20040211057 Equipment and method for bonding printed circuit boards |
| 10/28/2004 | DE19810873B4 Elektromotor Electric motor |
| 10/28/2004 | DE10392162T5 Schaltkreiskarte und Schaltkreiskartenverbindungsstruktur Circuit board and circuit board connection structure |
| 10/28/2004 | DE10334388B3 Coating method for application of solder material to contact bumps of microchip using magnetization of contact bumps so that magnetic or magnetizable solder material is magnetically adhered |
| 10/28/2004 | DE10317564A1 Materials with thermoplastics contacting a metal (especially cables, circuit boards or strip conductors) have a corrosion inhibitor other than a triazole derivative of salicylaldehyde in the thermoplastic |
| 10/28/2004 | DE102004011986A1 Busschienenstrukturplatte und Herstellungsverfahren eines Schaltkreisstrukturkörpers unter Verwendung hiermit Busschienenstrukturplatte and method of manufacturing a circuit structure body using hereby |
| 10/28/2004 | CA2832827A1 System and method for attenuating the effect of ambient light on an optical sensor |
| 10/28/2004 | CA2773112A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2773085A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2773076A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2522694A1 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 10/28/2004 | CA2522281A1 System and method for attenuating the effect of ambient light on an optical sensor |
| 10/28/2004 | CA2458438A1 Electronic package with strengthened conductive pad |
| 10/28/2004 | CA2426651A1 Method and apparatus for transferring solder bumps |
| 10/27/2004 | EP1471769A2 Surface-mountable electronic component |
| 10/27/2004 | EP1471614A2 TO-CAN type optical module |