H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2004
11/09/2004	US6815620 Flexible circuit with electrostatic damage limiting feature
11/09/2004	US6815614 Arrangement for co-planar vertical surface mounting of subassemblies on a mother board
11/09/2004	US6815613 Electronic component with external connection elements
11/09/2004	US6815313 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
11/09/2004	US6815257 Chip scale package and method of fabricating the same
11/09/2004	US6815253 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
11/09/2004	US6815252 Method of forming flip chip interconnection structure
11/09/2004	US6815249 Surface-mount device and method for manufacturing the surface-mount device
11/09/2004	US6815126 Printed wiring board with conformally plated circuit traces
11/09/2004	US6815088 Copper preservative treatment
11/09/2004	US6815085 Printed circuit board capacitor structure and method
11/09/2004	US6815073 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film
11/09/2004	US6815046 Method of producing ceramic multilayer substrate
11/09/2004	US6815015 Jetting behavior in the laser forward transfer of rheological systems
11/09/2004	US6814918 Filling method
11/09/2004	US6814893 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
11/09/2004	US6814836 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
11/09/2004	US6814832 Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
11/09/2004	US6814804 Apparatus and method for printing solder paste
11/09/2004	US6814778 Mapping defects using raster scan and blanking system; rapidly and accurately making repairs
11/09/2004	US6814591 Electrical connector housing
11/09/2004	US6814589 Electrical connector with elastomeric element and restrainer member to offset relaxation of the elastomer
11/09/2004	US6814588 Overmold cable terminator
11/09/2004	US6814583 Through-board PCB edge connector, system and method
11/09/2004	US6814328 Spool apparatus and method for harnessing optical fiber to a circuit board
11/09/2004	US6814277 Lead frame substrate clamp and method
11/09/2004	US6814276 Process for soldering and connecting structure
11/09/2004	US6814273 Flatwire repair tool systems and methods
11/09/2004	US6813829 Method for removing punched fragments and a method for producing an article by punching
11/04/2004	WO2004095900A1 Multilayer printed wiring board-use copper-clad laminate sheet, multilayer printed wiring board and production method for multilayer printed wiring board
11/04/2004	WO2004095899A1 Power delivery apparatus, systems, and methods
11/04/2004	WO2004095897A2 Electrical contact
11/04/2004	WO2004095685A2 Low cost rf oscillator devices manufactured from conductive loaded resin-based materials
11/04/2004	WO2004095646A1 Anisotropic conductive sheet and its manufacturing method, adaptor device and its manufacturing method, and circuit device electric test instrument
11/04/2004	WO2004095644A1 Durable electronic assembly with conductive adhesive
11/04/2004	WO2004095603A2 Method of producing membrane electrode assemblies
11/04/2004	WO2004095544A2 Substrate with multiple conductive layers and methods for making and using same
11/04/2004	WO2004095093A1 Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method
11/04/2004	WO2004094682A2 Improved coating for silver plated circuits
11/04/2004	WO2004094314A2 Conductor-within-a-via microwave launch
11/04/2004	WO2004094097A1 Phase change lead-free super plastic solders
11/04/2004	WO2004054333A3 Cross connect via for multilayer printed circuit boards
11/04/2004	US20040220770 Pass/fail judgment device, pass/fail judgment program, pass/fail judgment method, and multivariate statistics analyzer
11/04/2004	US20040220066 removal polymeric material using quaternizating ammonium silicate
11/04/2004	US20040219844 Stamped grid comprising a fastening element
11/04/2004	US20040219785 Coating composition for the protection of packaging and interconnecting boards
11/04/2004	US20040219775 Lead free bump and method of forming the same
11/04/2004	US20040219771 Pattern forming method and pattern forming device
11/04/2004	US20040219719 Device having resin package and method of producing the same
11/04/2004	US20040219463 Easily removal of marking without defect; patterning multilayer photoresist masking layer covering marking; etching
11/04/2004	US20040219384 Immersion plating and plated structures
11/04/2004	US20040219377 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
11/04/2004	US20040219375 Bonding layer for bonding resin on copper surface
11/04/2004	US20040219374 A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed
11/04/2004	US20040219342 Electronic substrate with direct inner layer component interconnection
11/04/2004	US20040219341 Film carrier tape for mounting electronic devices thereon and production method thereof
11/04/2004	US20040218808 Systems and methods for detecting defects in printed solder paste
11/04/2004	US20040218769 Package of surface-mountable electronic component
11/04/2004	US20040218389 LED lamp assembly
11/04/2004	US20040218372 LSI package provided with interface module and method of mounting the same
11/04/2004	US20040218371 Circuit board standoff
11/04/2004	US20040218342 Embedded microelectronic capacitor equipped with geometrically-centered electrodes and method of fabrication
11/04/2004	US20040218329 Circuit protection device
11/04/2004	US20040218161 Apparatus for forming pattern
11/04/2004	US20040218084 Microminiature image pickup device
11/04/2004	US20040218009 Methods for forming and protecting electrical interconnects and resultant assemblies
11/04/2004	US20040217903 Low cost antennas using conductive plastics or conductive composites
11/04/2004	US20040217830 RF multilayer circuit board
11/04/2004	US20040217486 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly
11/04/2004	US20040217469 Package structure with increased capacitance and method
11/04/2004	US20040217466 Function module and its manufacturing method
11/04/2004	US20040217463 Circuit board
11/04/2004	US20040217461 Microelectronic adaptors, assemblies and methods
11/04/2004	US20040217455 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor
11/04/2004	US20040217405 Low cost capacitors manufactured from conductive loaded resin-based materials
11/04/2004	US20040217202 Airless conformal coating apparatus and method
11/04/2004	US20040217193 Jetting device and a method of jetting device
11/04/2004	US20040217152 Lead-free solder paste for reflow soldering
11/04/2004	US20040217150 Method for ablating points of contact (debumping)
11/04/2004	US20040217093 Method and apparatus for laser drilling
11/04/2004	US20040217088 Selective removal of dielectric materials and plating process using same
11/04/2004	US20040217009 Copper filled submicron apertures free of pits and voids; ion source, electrolyte and polyalkylene oxide random copolymers; printed wiring boards, integrated circuits
11/04/2004	US20040217008 Method for electrolytic copper plating
11/04/2004	US20040217003 Controlled, accurate electrophoretic deposition of dielectric material; miniature coaxial cables; immunity to interference, facilitating high speed operation
11/04/2004	US20040216919 Method and structure for repairing or modifying surface connections on circuit boards
11/04/2004	US20040216918 Two-layer electrical substrate for optical devices
11/04/2004	US20040216917 Method for improved high current component interconnections
11/04/2004	US20040216916 Technique for improving power and ground flooding
11/04/2004	US20040216840 Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same
11/04/2004	US20040216838 Processes for the production of components fo electronic apparatuses
11/04/2004	US20040216761 Desmear and texturing method
11/04/2004	US20040216305 Ceramic electronic device and method of production of same
11/04/2004	DE19747609B4 Dünnfilmmehrschichtsubstrat und daraus hergestellte elektronische Vorrichtung Thin-film multilayer substrate and derived electronic device
11/04/2004	DE10342047A1 Electrical connecting piece for spaced-apart SMD circuit boards, has conductor bent at right angles to circuit board abutment piece
11/04/2004	DE10314502A1 Ein Verfahren zum Beschichten einer Halbleiterstruktur A method of coating a semiconductor structure
11/04/2004	DE10312693B3 Conductor structures and carrier substrates are formed by placing a metal film on a primary mold half, applying the second mould half, induction heating and moldings
11/04/2004	DE10246576B4 Leiterplatte Circuit board
11/04/2004	DE102004018640A1 Lotaufschmelzofen Solder reflow oven
11/04/2004	CA2522849A1 Substrate with multiple conductive layers and methods for making and using same
11/04/2004	CA2521079A1 Method of producing membrane electrode assemblies

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