Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/11/2004 | WO2004096816A1 Dicopper (i) oxalate complexes as precursor for metallic copper deposition |
11/11/2004 | WO2004096711A1 Methods and devices for recycling copper from a discarded circuit board and a discarded fluid containing copper |
11/11/2004 | WO2004096483A1 Method of producing laser-processed product and adhesive sheet, for laser processing used therefor |
11/11/2004 | WO2004068640B1 Conductive terminal and the electrical connector using the conductive terminal |
11/11/2004 | WO2004001099A3 Complexing agent for treating metallic and plastic surfaces |
11/11/2004 | US20040225807 Method and assembly having a matched filter connector |
11/11/2004 | US20040225487 Power supply noise analysis model generator, power supply noise analysis model generation method, and power supply noise analysis model generation program |
11/11/2004 | US20040225045 joining semiconductor to carrier substrates; using maleimide polymer and organometallic complex |
11/11/2004 | US20040224541 Apparatus and method for forming solder wicking prevention zone and electronic part |
11/11/2004 | US20040224509 Method to remove copper without pattern density effect |
11/11/2004 | US20040224442 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
11/11/2004 | US20040224259 Functionalized polymer |
11/11/2004 | US20040224252 comprises catalyst precursor (alkyl, alkenyl, alkynyl-carboxylic acid metal salt) with metal-deposition catalytic activity suitable for electroless metal plating |
11/11/2004 | US20040224138 Electrically active textile article |
11/11/2004 | US20040223926 Coating solution for forming wettability-varied pattern and method of producing pattern-formed body |
11/11/2004 | US20040223875 hermetic sealed vias, formed by laser drilling and annealing, which are filled with conductive material such as fritless ink; electronics; biosensors; portable diagnostic medical equipment |
11/11/2004 | US20040223309 Enhanced compliant probe card systems having improved planarity |
11/11/2004 | US20040223128 Apparatus for forming pattern |
11/11/2004 | US20040222947 LED lighting array for a portable task light |
11/11/2004 | US20040222863 Low cost RF oscillator devices manufactured from conductive loaded resin-based materials |
11/11/2004 | US20040222752 Electronic ballast for a discharge lamp |
11/11/2004 | US20040222563 Methods and apparatuses for shaping a printed circuit board |
11/11/2004 | US20040222536 Process for high shear gas-liquid reactions |
11/11/2004 | US20040222523 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same |
11/11/2004 | US20040222408 Circuit-connecting material and circuit terminal connected structure and connecting method |
11/11/2004 | US20040222272 Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof |
11/11/2004 | US20040222271 Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates |
11/11/2004 | US20040222202 Laser micromachining and electrical structures formed thereby |
11/11/2004 | US20040222197 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
11/11/2004 | US20040222183 Method of forming an electrically conductive pattern on support |
11/11/2004 | US20040222104 Electroplating composition |
11/11/2004 | US20040222016 Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board |
11/11/2004 | US20040222015 Printed circuit board manufacturing method and printed circuit board |
11/11/2004 | US20040221951 Method for bonding an integrated circuit device to a glass substrate |
11/11/2004 | US20040221877 Process and apparatus for treating a workpiece with gases |
11/11/2004 | US20040221805 Spray valve |
11/11/2004 | US20040221683 Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material |
11/11/2004 | US20040221647 Liquid level sending unit with flexible sensor board |
11/11/2004 | US20040221475 Dry cabinets for use in moisture sensitive device management in electronics manufacturing |
11/11/2004 | US20040221450 Filling plugs through chemical mechanical polish |
11/11/2004 | US20040221449 Circuit board and method of manufacturing the same |
11/11/2004 | US20040221448 Method for producing wired circuit board |
11/11/2004 | US20040221447 Method of producing wired circuit board |
11/11/2004 | DE10341743A1 Rigid composite plate, particularly printed circuit board base, production involves feeding dried, ungelled prepreg to an isobaric press for gelation followed by an isocoric press for completion of curing |
11/11/2004 | DE10326457A1 Recycling process for organic and/or inorganic composite materials involves introduction of additional fluid flow across flow of composite particles in transporting medium |
11/11/2004 | DE10318725A1 Controller, especially for motor vehicle, has shunt for current measurement inserted in circuit board for current measurement with 2 fixing legs joined by contact leg, and solid press-in pins at free ends |
11/11/2004 | DE10317879A1 System for manufacturing molded interconnect device (MID) with at least one conductive path, with MID containing substrate surface of thermally softening, electrically insulating material for conductive path location |
11/11/2004 | DE10317596A1 Verfahren zur Erzeugung von Lotkugeln auf einem elektrischen Bauelement A process for the production of solder balls on an electrical component |
11/11/2004 | DE10317095A1 Bauelemententräger und Verfahren zu dessen Herstellung Carrier components and process for its preparation |
11/11/2004 | DE10222119B4 Vorrichtung und Verfahren zum Einstellen der relativen Lage zwischen einem zu bedruckenden Substrat und einem Druckmuster Device and method for adjusting the relative position between a substrate to be printed and a print pattern |
11/11/2004 | DE102004008886A1 Verfahren und System zum Entwerfen einer integrierten Schaltung mit reduziertem Rauschen Method and system for designing an integrated circuit with reduced noise |
11/11/2004 | CA2525521A1 Dicopper (i) oxalate complexes as precursor for metallic copper deposition |
11/11/2004 | CA2523971A1 A method for processing a thin film substrate |
11/10/2004 | EP1476004A2 Method for producing wired circuit board |
11/10/2004 | EP1475743A1 Conductive paste and method of forming antenna for transponder |
11/10/2004 | EP1475230A2 Image forming methods, pattern forming methods, pattern forming material and planographic printing plate |
11/10/2004 | EP1475184A2 High speed drilling spindle with reciprocating ceramic shaft and double-gripping centrifugal chuck |
11/10/2004 | EP1475177A1 Apparatus and method for forming solder wicking prevention zone and electronic part |
11/10/2004 | EP1475170A2 Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material |
11/10/2004 | EP1474960A1 Device and method for transporting flat workpieces in conveyorized processing lines |
11/10/2004 | EP1474811A1 Etching solution for forming an embedded resistor |
11/10/2004 | EP1474546A2 High resolution patterning method |
11/10/2004 | EP1474261A1 Flux collection method and system |
11/10/2004 | EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
11/10/2004 | EP0903066B1 Reel for winding photosensitive film |
11/10/2004 | EP0888701A4 Thin film fabrication technique for implantable electrodes |
11/10/2004 | CN2655589Y Flexible printed circuitboard |
11/10/2004 | CN1545827A Throughplating of flexible printed boards |
11/10/2004 | CN1545826A Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil |
11/10/2004 | CN1545751A Cable assembly module with compressive connector |
11/10/2004 | CN1545622A Testing device sensor and testing device |
11/10/2004 | CN1545570A Surface-treated copper foil |
11/10/2004 | CN1545533A Etching liquid for thermoplastic polyimide resin |
11/10/2004 | CN1545453A Methods of fabricating patterned layers on a substrate |
11/10/2004 | CN1545377A Method of processing before hole metallization process of polytetrafluoroethylene printed board |
11/10/2004 | CN1545376A Method for preventing pre-moded hole circuit board from dip-soldering and special purpose template |
11/10/2004 | CN1545375A Intelligent circuit board mill |
11/10/2004 | CN1545374A Flexible wiring board pieces and wiring sheets |
11/10/2004 | CN1545085A Data processing of a bitstream signal |
11/10/2004 | CN1544218A Fabrication method of high precision flexible circuit die cutting plate |
11/10/2004 | CN1175716C Method for making printed circuits and resulting printed circuit |
11/10/2004 | CN1175715C 多层印刷线路板 Multilayer printed circuit boards |
11/10/2004 | CN1175567C Electronic equipment |
11/10/2004 | CN1175275C Inspection device and inspection method |
11/10/2004 | CN1175033C Composite of powdered fillers and polymer bond and process for preparing them |
11/10/2004 | CN1174858C Laminated board |
11/10/2004 | CN1174857C Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil |
11/10/2004 | CN1174856C Adhesion promoting layer for use with epoxy prepregs |
11/09/2004 | US6817002 Method and apparatus for PCB array with compensated signal propagation |
11/09/2004 | US6816387 Expansion board apparatus and removing method |
11/09/2004 | US6816385 Compliant laminate connector |
11/09/2004 | US6816380 Electronic devices with small functional elements supported on a carrier |
11/09/2004 | US6816377 Electronic control unit |
11/09/2004 | US6816125 Forming electromagnetic communication circuit components using densified metal powder |
11/09/2004 | US6815962 Connection/inspection device for semiconductor elements |
11/09/2004 | US6815961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
11/09/2004 | US6815837 Electronic package with strengthened conductive pad |
11/09/2004 | US6815810 High-frequency semiconductor device |
11/09/2004 | US6815709 Structure having flush circuitry features and method of making |
11/09/2004 | US6815638 Method of determining a minimum pulse width for a short pulse laser system |