Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2004
11/11/2004WO2004096816A1 Dicopper (i) oxalate complexes as precursor for metallic copper deposition
11/11/2004WO2004096711A1 Methods and devices for recycling copper from a discarded circuit board and a discarded fluid containing copper
11/11/2004WO2004096483A1 Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
11/11/2004WO2004068640B1 Conductive terminal and the electrical connector using the conductive terminal
11/11/2004WO2004001099A3 Complexing agent for treating metallic and plastic surfaces
11/11/2004US20040225807 Method and assembly having a matched filter connector
11/11/2004US20040225487 Power supply noise analysis model generator, power supply noise analysis model generation method, and power supply noise analysis model generation program
11/11/2004US20040225045 joining semiconductor to carrier substrates; using maleimide polymer and organometallic complex
11/11/2004US20040224541 Apparatus and method for forming solder wicking prevention zone and electronic part
11/11/2004US20040224509 Method to remove copper without pattern density effect
11/11/2004US20040224442 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
11/11/2004US20040224259 Functionalized polymer
11/11/2004US20040224252 comprises catalyst precursor (alkyl, alkenyl, alkynyl-carboxylic acid metal salt) with metal-deposition catalytic activity suitable for electroless metal plating
11/11/2004US20040224138 Electrically active textile article
11/11/2004US20040223926 Coating solution for forming wettability-varied pattern and method of producing pattern-formed body
11/11/2004US20040223875 hermetic sealed vias, formed by laser drilling and annealing, which are filled with conductive material such as fritless ink; electronics; biosensors; portable diagnostic medical equipment
11/11/2004US20040223309 Enhanced compliant probe card systems having improved planarity
11/11/2004US20040223128 Apparatus for forming pattern
11/11/2004US20040222947 LED lighting array for a portable task light
11/11/2004US20040222863 Low cost RF oscillator devices manufactured from conductive loaded resin-based materials
11/11/2004US20040222752 Electronic ballast for a discharge lamp
11/11/2004US20040222563 Methods and apparatuses for shaping a printed circuit board
11/11/2004US20040222536 Process for high shear gas-liquid reactions
11/11/2004US20040222523 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
11/11/2004US20040222408 Circuit-connecting material and circuit terminal connected structure and connecting method
11/11/2004US20040222272 Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof
11/11/2004US20040222271 Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates
11/11/2004US20040222202 Laser micromachining and electrical structures formed thereby
11/11/2004US20040222197 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
11/11/2004US20040222183 Method of forming an electrically conductive pattern on support
11/11/2004US20040222104 Electroplating composition
11/11/2004US20040222016 Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board
11/11/2004US20040222015 Printed circuit board manufacturing method and printed circuit board
11/11/2004US20040221951 Method for bonding an integrated circuit device to a glass substrate
11/11/2004US20040221877 Process and apparatus for treating a workpiece with gases
11/11/2004US20040221805 Spray valve
11/11/2004US20040221683 Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material
11/11/2004US20040221647 Liquid level sending unit with flexible sensor board
11/11/2004US20040221475 Dry cabinets for use in moisture sensitive device management in electronics manufacturing
11/11/2004US20040221450 Filling plugs through chemical mechanical polish
11/11/2004US20040221449 Circuit board and method of manufacturing the same
11/11/2004US20040221448 Method for producing wired circuit board
11/11/2004US20040221447 Method of producing wired circuit board
11/11/2004DE10341743A1 Rigid composite plate, particularly printed circuit board base, production involves feeding dried, ungelled prepreg to an isobaric press for gelation followed by an isocoric press for completion of curing
11/11/2004DE10326457A1 Recycling process for organic and/or inorganic composite materials involves introduction of additional fluid flow across flow of composite particles in transporting medium
11/11/2004DE10318725A1 Controller, especially for motor vehicle, has shunt for current measurement inserted in circuit board for current measurement with 2 fixing legs joined by contact leg, and solid press-in pins at free ends
11/11/2004DE10317879A1 System for manufacturing molded interconnect device (MID) with at least one conductive path, with MID containing substrate surface of thermally softening, electrically insulating material for conductive path location
11/11/2004DE10317596A1 Verfahren zur Erzeugung von Lotkugeln auf einem elektrischen Bauelement A process for the production of solder balls on an electrical component
11/11/2004DE10317095A1 Bauelemententräger und Verfahren zu dessen Herstellung Carrier components and process for its preparation
11/11/2004DE10222119B4 Vorrichtung und Verfahren zum Einstellen der relativen Lage zwischen einem zu bedruckenden Substrat und einem Druckmuster Device and method for adjusting the relative position between a substrate to be printed and a print pattern
11/11/2004DE102004008886A1 Verfahren und System zum Entwerfen einer integrierten Schaltung mit reduziertem Rauschen Method and system for designing an integrated circuit with reduced noise
11/11/2004CA2525521A1 Dicopper (i) oxalate complexes as precursor for metallic copper deposition
11/11/2004CA2523971A1 A method for processing a thin film substrate
11/10/2004EP1476004A2 Method for producing wired circuit board
11/10/2004EP1475743A1 Conductive paste and method of forming antenna for transponder
11/10/2004EP1475230A2 Image forming methods, pattern forming methods, pattern forming material and planographic printing plate
11/10/2004EP1475184A2 High speed drilling spindle with reciprocating ceramic shaft and double-gripping centrifugal chuck
11/10/2004EP1475177A1 Apparatus and method for forming solder wicking prevention zone and electronic part
11/10/2004EP1475170A2 Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material
11/10/2004EP1474960A1 Device and method for transporting flat workpieces in conveyorized processing lines
11/10/2004EP1474811A1 Etching solution for forming an embedded resistor
11/10/2004EP1474546A2 High resolution patterning method
11/10/2004EP1474261A1 Flux collection method and system
11/10/2004EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
11/10/2004EP0903066B1 Reel for winding photosensitive film
11/10/2004EP0888701A4 Thin film fabrication technique for implantable electrodes
11/10/2004CN2655589Y Flexible printed circuitboard
11/10/2004CN1545827A Throughplating of flexible printed boards
11/10/2004CN1545826A Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil
11/10/2004CN1545751A Cable assembly module with compressive connector
11/10/2004CN1545622A Testing device sensor and testing device
11/10/2004CN1545570A Surface-treated copper foil
11/10/2004CN1545533A Etching liquid for thermoplastic polyimide resin
11/10/2004CN1545453A Methods of fabricating patterned layers on a substrate
11/10/2004CN1545377A Method of processing before hole metallization process of polytetrafluoroethylene printed board
11/10/2004CN1545376A Method for preventing pre-moded hole circuit board from dip-soldering and special purpose template
11/10/2004CN1545375A Intelligent circuit board mill
11/10/2004CN1545374A Flexible wiring board pieces and wiring sheets
11/10/2004CN1545085A Data processing of a bitstream signal
11/10/2004CN1544218A Fabrication method of high precision flexible circuit die cutting plate
11/10/2004CN1175716C Method for making printed circuits and resulting printed circuit
11/10/2004CN1175715C 多层印刷线路板 Multilayer printed circuit boards
11/10/2004CN1175567C Electronic equipment
11/10/2004CN1175275C Inspection device and inspection method
11/10/2004CN1175033C Composite of powdered fillers and polymer bond and process for preparing them
11/10/2004CN1174858C Laminated board
11/10/2004CN1174857C Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/10/2004CN1174856C Adhesion promoting layer for use with epoxy prepregs
11/09/2004US6817002 Method and apparatus for PCB array with compensated signal propagation
11/09/2004US6816387 Expansion board apparatus and removing method
11/09/2004US6816385 Compliant laminate connector
11/09/2004US6816380 Electronic devices with small functional elements supported on a carrier
11/09/2004US6816377 Electronic control unit
11/09/2004US6816125 Forming electromagnetic communication circuit components using densified metal powder
11/09/2004US6815962 Connection/inspection device for semiconductor elements
11/09/2004US6815961 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
11/09/2004US6815837 Electronic package with strengthened conductive pad
11/09/2004US6815810 High-frequency semiconductor device
11/09/2004US6815709 Structure having flush circuitry features and method of making
11/09/2004US6815638 Method of determining a minimum pulse width for a short pulse laser system